JPH02146440U - - Google Patents
Info
- Publication number
- JPH02146440U JPH02146440U JP5559989U JP5559989U JPH02146440U JP H02146440 U JPH02146440 U JP H02146440U JP 5559989 U JP5559989 U JP 5559989U JP 5559989 U JP5559989 U JP 5559989U JP H02146440 U JPH02146440 U JP H02146440U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- flange part
- head
- tip
- wall surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055599U JPH075636Y2 (ja) | 1989-05-15 | 1989-05-15 | 電子部品のリムーブ治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055599U JPH075636Y2 (ja) | 1989-05-15 | 1989-05-15 | 電子部品のリムーブ治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02146440U true JPH02146440U (enrdf_load_stackoverflow) | 1990-12-12 |
| JPH075636Y2 JPH075636Y2 (ja) | 1995-02-08 |
Family
ID=31578692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989055599U Expired - Lifetime JPH075636Y2 (ja) | 1989-05-15 | 1989-05-15 | 電子部品のリムーブ治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075636Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05251892A (ja) * | 1992-03-06 | 1993-09-28 | Nec Corp | テーピング品検査用オートハンドラの不良品取外し装置 |
-
1989
- 1989-05-15 JP JP1989055599U patent/JPH075636Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05251892A (ja) * | 1992-03-06 | 1993-09-28 | Nec Corp | テーピング品検査用オートハンドラの不良品取外し装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH075636Y2 (ja) | 1995-02-08 |