JPH02146431U - - Google Patents
Info
- Publication number
- JPH02146431U JPH02146431U JP5560489U JP5560489U JPH02146431U JP H02146431 U JPH02146431 U JP H02146431U JP 5560489 U JP5560489 U JP 5560489U JP 5560489 U JP5560489 U JP 5560489U JP H02146431 U JPH02146431 U JP H02146431U
- Authority
- JP
- Japan
- Prior art keywords
- tapered surface
- semiconductor pellet
- bonding
- tapered
- bonding collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5560489U JPH02146431U (pt) | 1989-05-15 | 1989-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5560489U JPH02146431U (pt) | 1989-05-15 | 1989-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146431U true JPH02146431U (pt) | 1990-12-12 |
Family
ID=31578702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5560489U Pending JPH02146431U (pt) | 1989-05-15 | 1989-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146431U (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050737A (ja) * | 1996-08-02 | 1998-02-20 | Nec Corp | 半導体装置及び半導体素子搭載用コレット |
-
1989
- 1989-05-15 JP JP5560489U patent/JPH02146431U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050737A (ja) * | 1996-08-02 | 1998-02-20 | Nec Corp | 半導体装置及び半導体素子搭載用コレット |