JPH02142849A - Polycarbonate resin composition - Google Patents
Polycarbonate resin compositionInfo
- Publication number
- JPH02142849A JPH02142849A JP29695088A JP29695088A JPH02142849A JP H02142849 A JPH02142849 A JP H02142849A JP 29695088 A JP29695088 A JP 29695088A JP 29695088 A JP29695088 A JP 29695088A JP H02142849 A JPH02142849 A JP H02142849A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aromatic
- polycarbonate resin
- liquid crystal
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 27
- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 26
- 239000000203 mixture Substances 0.000 title claims abstract description 18
- 125000003118 aryl group Chemical group 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 16
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 13
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000011342 resin composition Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 abstract description 7
- 229920000728 polyester Polymers 0.000 abstract description 4
- 229920006149 polyester-amide block copolymer Polymers 0.000 abstract description 4
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 abstract 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 abstract 1
- 229920000515 polycarbonate Polymers 0.000 abstract 1
- 239000004417 polycarbonate Substances 0.000 abstract 1
- -1 carbonate ester Chemical class 0.000 description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000002734 clay mineral Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000012779 reinforcing material Substances 0.000 description 4
- 239000010425 asbestos Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 229910052918 calcium silicate Inorganic materials 0.000 description 3
- 235000012241 calcium silicate Nutrition 0.000 description 3
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000012744 reinforcing agent Substances 0.000 description 3
- 229910052895 riebeckite Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000011269 tar Substances 0.000 description 3
- FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical class C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004609 Impact Modifier Substances 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000000314 lubricant Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920006163 vinyl copolymer Polymers 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- KTMNDTPAJZKQPF-UHFFFAOYSA-N 2-tert-butyl-4-[1-(3-tert-butyl-4-hydroxyphenyl)propyl]phenol Chemical compound C=1C=C(O)C(C(C)(C)C)=CC=1C(CC)C1=CC=C(O)C(C(C)(C)C)=C1 KTMNDTPAJZKQPF-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001408 amides Chemical group 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 125000004799 bromophenyl group Chemical group 0.000 description 1
- HJJVPARKXDDIQD-UHFFFAOYSA-N bromuconazole Chemical compound ClC1=CC(Cl)=CC=C1C1(CN2N=CN=C2)OCC(Br)C1 HJJVPARKXDDIQD-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 150000004790 diaryl sulfoxides Chemical class 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 229920000343 polyazomethine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ポリカーボネート樹脂組成物に係シ、更に詳
しくは、ポリカーボネート樹脂の優れた機械的特性を更
に改良しかつ成形加工性をも向上させ、広範な用途にも
使用可能にしたポリカーボネート樹脂組成物に関するも
のである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a polycarbonate resin composition, and more specifically, to a polycarbonate resin composition that further improves the excellent mechanical properties and improves the moldability. This invention relates to a polycarbonate resin composition that can be used in a wide range of applications.
芳香族ポリカーボネート樹脂は、機械的特性及び熱的特
性に優れるが、更にその特性を改良するために、杵1脂
の補強に常用されるガラス繊維や無機充填材などの無機
系補強材にて補強すると、成形加工性が低下し、外観も
不良になる。Aromatic polycarbonate resin has excellent mechanical and thermal properties, but to further improve its properties, it can be reinforced with inorganic reinforcing materials such as glass fiber and inorganic fillers, which are commonly used to reinforce punches. As a result, moldability deteriorates and the appearance becomes poor.
このため、有機材料を補強材として配合することが考え
られ、熱可塑性液晶樹脂を配合することが知られている
(特開昭57−40551、特開昭63−159467
)。For this reason, it has been considered to mix an organic material as a reinforcing material, and it is known to mix a thermoplastic liquid crystal resin (JP-A-57-40551, JP-A-63-159467).
).
しかしながら、ポリカーボネート樹脂と液晶樹脂との相
溶性が充分ではなく、得られる成形品には剥離が生じ易
く、また衝撃特性や、ウェルド強度も不満足である。し
たがって、無機系補強材の補強効果を有し、しかも成形
加工性や外観をも改良した有機補強材を配合したポリカ
ポネート樹脂は、未だに得られていない、という問題が
あった。However, the compatibility between the polycarbonate resin and the liquid crystal resin is not sufficient, and the resulting molded product is likely to peel off, and its impact properties and weld strength are also unsatisfactory. Therefore, there has been a problem that a polycarbonate resin blended with an organic reinforcing material that has the reinforcing effect of an inorganic reinforcing material and also has improved moldability and appearance has not yet been obtained.
本発明は、上記のような従来の課題を解決し得る、新規
なポリカーボネート樹脂組成物の提供を目的とする。An object of the present invention is to provide a novel polycarbonate resin composition that can solve the conventional problems as described above.
本発明者らは、かかる目的を達成すべく鋭意検討の結果
、芳香族ポリカーボネート樹脂と熱可塑性液晶樹脂との
混合物に、芳香族エポキシ化合物を配合することによっ
て、両者の相溶性を著しく改善することが可能なことを
初めて見いだし、本発明に到達した。すなわち、本発明
は、芳香族ポリカーボネート樹脂95〜60重量%と熱
可塑性液晶樹脂5〜40重量%とからなる樹脂組成物1
00重量部に対し、芳香族エポキシ樹脂を005〜5重
量部配置型てなるポリカーボネート樹脂組成物を要旨と
するものであって、剛性が高く、外観に優れ、成形加工
性が良好で、衝撃特性が高く、剥離を生じない新規なポ
リカーボネート樹脂組成物を提供するものである。As a result of intensive studies to achieve this objective, the present inventors have found that by blending an aromatic epoxy compound into a mixture of an aromatic polycarbonate resin and a thermoplastic liquid crystal resin, the compatibility between the two can be significantly improved. We have discovered for the first time that this is possible, and have arrived at the present invention. That is, the present invention provides a resin composition 1 comprising 95 to 60% by weight of an aromatic polycarbonate resin and 5 to 40% by weight of a thermoplastic liquid crystal resin.
The main feature of this composition is a polycarbonate resin composition comprising 0.00 parts by weight and 0.05 to 5 parts by weight of an aromatic epoxy resin, which has high rigidity, excellent appearance, good moldability, and impact properties. The object of the present invention is to provide a novel polycarbonate resin composition that has a high hardness and does not cause peeling.
以下、本発明を具体的に説明する。The present invention will be specifically explained below.
本発明において主成分として使用される芳香族ポリカー
ボネート樹脂は、種々のジヒドロキシジアリール化合物
とホスゲンとを反応させるホスゲン法、またけジヒドロ
キシジアリール化合物トジフェニルカーボネートなどの
炭酸エステルとを反応させるエステル交換法によって得
られる共重合体であり、代表的なものとしては、2.2
−ビス(4−ヒドロキノフェニル)プロパン(ビスフェ
ノールA)から製造されたポリカポネート樹脂が挙げら
れる。上記ジヒドロキシジアリール化合物としては、ビ
スフェノールAの他に、ビス(4−ヒドロキシフェニル
)メタン、1,1−ビス(4−ヒドロキシフェニル)エ
タン、2.2−ビス(4−ヒドロキシフェニル)ブタン
、2.2−ビス(4−ヒドロキシフェニル)オクタン、
ビス(4−ヒドロキシフェニル)フェニルメタン、2,
2−ビス(4−ヒドロキシ3−メチルフェニル)プロパ
ン、1,1−ビス(4−ヒドロキシ−3−第三ブチルフ
ェニル)プロパン、2,2−ビス(4−ヒドロキシ−3
−フロモフェニル)プロパン、2,2−ビス(4ヒドロ
キシ−3,5→ブロモフエニル)フロノ;ン、2.2−
ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プ
ロパンのようなビス(ヒドロキシアリール)アルカン類
、1.1−ビス(4−ヒドロキシフェニル)シクロペン
タン、1,1−ビス(4−ヒドロキシフェニル)シクロ
ヘキサンのようなビス(ヒドロキシアリール)シクロア
ルカン類、4,4′−ジヒドロキシジフェニルエーテル
、4,4′−ジヒドロキシ−3,3′−ジメチルジフェ
ニルエーテル、のようなジヒドロキシジアリルエーテル
1114,4’−ジヒドロキシジフェニルスルフィド、
4.4′−ジヒドロキシ−3,3′−ジメチルジフェニ
ルタフイトのようなジヒドロキシジアリールスルフィド
類、4.4’−ジヒドロキシジフェニルスルホキシド、
4.4’−ジヒドロキシ−3,3′−ジメチルジフェニ
ルスルホキシドのようなジヒドロキシジアリールスルホ
キシド類、4.4′−ジヒドロキシジフェニルスルホン
、4.4’ジヒドロキシ−3,3′−ジメチルジフェニ
ルスルホンのようなジヒドロキシジアリールスルホン類
等が挙げられる。The aromatic polycarbonate resin used as the main component in the present invention can be obtained by the phosgene method in which various dihydroxydiaryl compounds are reacted with phosgene, or the transesterification method in which the dihydroxydiaryl compound is reacted with a carbonate ester such as diphenyl carbonate. A typical copolymer is 2.2
- Polycarbonate resins made from bis(4-hydroquinophenyl)propane (bisphenol A). In addition to bisphenol A, the dihydroxydiaryl compounds include bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane, 2.2-bis(4-hydroxyphenyl)butane, 2. 2-bis(4-hydroxyphenyl)octane,
Bis(4-hydroxyphenyl)phenylmethane, 2,
2-bis(4-hydroxy-3-methylphenyl)propane, 1,1-bis(4-hydroxy-3-tert-butylphenyl)propane, 2,2-bis(4-hydroxy-3
-Fromophenyl)propane, 2,2-bis(4hydroxy-3,5→bromophenyl)furon;, 2,2-
Bis(hydroxyaryl)alkanes such as bis(4-hydroxy-3,5-dichlorophenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclopentane, 1,1-bis(4-hydroxyphenyl)cyclohexane bis(hydroxyaryl)cycloalkanes such as 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3,3'-dimethyldiphenyl ether, dihydroxydiallyl ethers such as 1114,4'-dihydroxydiphenyl sulfide,
4. Dihydroxydiaryl sulfides such as 4'-dihydroxy-3,3'-dimethyldiphenyl tafite, 4.4'-dihydroxydiphenyl sulfoxide,
Dihydroxy diaryl sulfoxides such as 4.4'-dihydroxy-3,3'-dimethyldiphenyl sulfoxide, 4.4'-dihydroxydiphenyl sulfone, and dihydroxy such as 4.4'-dihydroxy-3,3'-dimethyldiphenyl sulfone. Examples include diarylsulfones.
これらは単独まだは2種以上混合して使用されるが、こ
れらの他に、ピペラジン、ジピペリジルハイトロキノン
、レゾルシン、4,4′−ジヒドロキシジフェニル等を
混合して使用してもよい。These may be used alone or in combination of two or more, but in addition to these, piperazine, dipiperidylhytroquinone, resorcinol, 4,4'-dihydroxydiphenyl, etc. may be used in combination.
また、本発明において必須の第2成分として使用される
熱可塑性液晶樹脂は、サーモトロピック液晶性を示すも
のであれば、その構造に特に限定はないが、一般にポリ
カーボネート樹脂の成形加工温度である220〜350
℃の間で液晶性を示す材料が好ましい。こうした液晶樹
脂としては、芳香族ジオールと芳香族ジカルボン酸及び
/又は芳香族ヒドロキシカルボン酸から々る芳香族ポリ
エステル、更に芳香族ヒドロキシアミンや芳香族ジアミ
ンを含む芳香族ポリエステルアミド、ポリアゾメチンな
どが挙げられ、より具体的には、下記の構造を主構造単
位とするポリエステルまたはポリエステルアミドが好ま
しい。In addition, the thermoplastic liquid crystal resin used as the essential second component in the present invention is not particularly limited in its structure as long as it exhibits thermotropic liquid crystallinity, but it is generally molded at 220°C, which is the molding temperature of polycarbonate resin. ~350
Preferably, the material exhibits liquid crystallinity between .degree. Examples of such liquid crystal resins include aromatic polyesters made of aromatic diols and aromatic dicarboxylic acids and/or aromatic hydroxycarboxylic acids, aromatic polyesteramides containing aromatic hydroxyamines and aromatic diamines, and polyazomethines. More specifically, polyester or polyester amide having the following structure as a main structural unit is preferable.
ポリエステル構造 −〇−R−O
CO−R−CO
O−R−C0
ポリエステルアミド構造 −CO−R−C0−C)−R
−C0
−NH−R−C0
−Nu−R−NH
上記構造式中のRは、サーモトロピック液晶性を示す範
囲内で、下記の別表1に示す群から任意に選ぶことがで
きる。Polyester structure -〇-R-O CO-R-CO O-R-C0 Polyester amide structure -CO-R-C0-C)-R
-C0 -NH-R-C0 -Nu-R-NH R in the above structural formula can be arbitrarily selected from the group shown in Attached Table 1 below within the range that exhibits thermotropic liquid crystallinity.
別表1=
CH2−
(CH2)2
(CH2)4
−(CH2)6
また、芳香族環、脂肪族基、脂環族基の一部は、液晶性
を維持する範囲内で、下記のような基によって置換され
ていてもよい。Attached Table 1 = CH2- (CH2)2 (CH2)4 -(CH2)6 In addition, some of the aromatic rings, aliphatic groups, and alicyclic groups may be treated as follows within the range of maintaining liquid crystallinity. It may be substituted with a group.
Br、−C71,−COOH,−CONH2゜CH3,
−C(CH3) 、 イ)
これらの熱可塑性液晶樹脂は、例えば、住友化学■製エ
コノノール、米国ヘキスト社製VECTRA、三菱化成
■製N0VACCURATEなどの商品名で市販されて
いる。Br, -C71, -COOH, -CONH2゜CH3,
-C(CH3), a) These thermoplastic liquid crystal resins are commercially available under trade names such as Econonol manufactured by Sumitomo Chemical (2), VECTRA manufactured by Hoechst (USA), and N0VACCURATE manufactured by Mitsubishi Chemical (2).
芳香族ポリカーボネート樹脂と熱可塑性液晶樹脂との混
合重量比は、95:5〜60:40の範囲内で使用され
る。The mixing weight ratio of aromatic polycarbonate resin and thermoplastic liquid crystal resin is used within the range of 95:5 to 60:40.
本発明で使用される樹脂組成物には、更に、機械的特性
とヒケ・ソリを発生させない範囲内で、補強剤を配合す
ることも行われ、特に、ガラス繊維、ガラスフレーク、
ガラスピーズ力どのガラス製補強剤、及び、マイカ、タ
ルり、メタけい酸カルシウム、炭酸カルシウム、シリカ
、アルミナ、シリカ−アルミナ系粘土鉱物、シリカ−マ
グネシウム系粘土鉱物、アスベストなどの無機充填材か
ら、樹脂組成物100重量部に対し、0〜40重量部置
型することも望ましい。The resin composition used in the present invention may further contain reinforcing agents within a range that maintains mechanical properties and does not cause sink marks or warpage. In particular, reinforcing agents such as glass fibers, glass flakes,
From glass reinforcing agents such as glass beads, and inorganic fillers such as mica, tar, calcium metasilicate, calcium carbonate, silica, alumina, silica-alumina clay minerals, silica-magnesium clay minerals, asbestos, etc. It is also desirable to use 0 to 40 parts by weight per 100 parts by weight of the resin composition.
加えて、周知の各種の添加剤、例えば、ビニル共重合体
やその水添加工物、アクリロイド系化合物、変成オレフ
ィンなどの衝撃性改良剤、ツクラフインワックス、脂肪
酸エステルなどの滑剤、ヒフ ター )”フェノール、
リン酸エステルヤ亜リン酸エステルなどの酸化防止剤、
トリアジン系化合物などの耐候性改良剤、顔料、染料な
どの着色剤、ガラス繊維、炭素繊維、金属繊維、各種ウ
ィスカー等の繊維系充填材、マイカ、タルり、メタけい
酸カルシウム、炭酸カルシウム、シリカ、アルミナ、シ
リカ−アルミナ系粘土鉱物、シリカ−マグネシウム系粘
土鉱物、アスベストなどの無機充填材、帯電防止材、難
燃剤などを含有してもよい。In addition, various well-known additives, such as vinyl copolymers and their water-added products, acryloid compounds, impact modifiers such as modified olefins, lubricants such as lacquer-in wax and fatty acid esters, etc. ``Phenol,
Antioxidants such as phosphate esters and phosphites,
Weather resistance improvers such as triazine compounds, coloring agents such as pigments and dyes, fiber fillers such as glass fibers, carbon fibers, metal fibers, and various whiskers, mica, tar, calcium metasilicate, calcium carbonate, and silica. , alumina, silica-alumina clay minerals, silica-magnesium clay minerals, inorganic fillers such as asbestos, antistatic materials, flame retardants, and the like.
さらに、本発明において必須の第3成分として使用され
る芳香族エポキシ樹脂は、分子中、二個以上のエポキシ
基を有する芳香族樹脂であシ、一般には、ビスフェノー
ル化合物、フェノルツボラック、芳香族ジオールや芳香
族ジカルボン酸、及びそれらを基本構成単位とする重合
体と、エピハロヒドリンとの縮合物として得られる。な
かでも、ビスフェノールAジグリゾジルエーテル、フタ
ル酸シクリシジルエステルの使用が特に好ましい。Further, the aromatic epoxy resin used as an essential third component in the present invention is an aromatic resin having two or more epoxy groups in the molecule, and is generally a bisphenol compound, phenoltuborac, aromatic It is obtained as a condensate of diols, aromatic dicarboxylic acids, and polymers containing these as basic structural units, and epihalohydrin. Among these, use of bisphenol A diglyzodyl ether and phthalic acid cyclidyl ester is particularly preferred.
芳香族エポキシ樹脂の配合量は、芳香族ポリカーボネー
ト樹脂と熱可塑性液晶樹脂とからなる樹脂組成物100
重量部に対し、0.05〜5重量部、望ましくは、01
〜3重都部である。The blending amount of aromatic epoxy resin is 100% of the resin composition consisting of aromatic polycarbonate resin and thermoplastic liquid crystal resin.
0.05 to 5 parts by weight, preferably 0.01 to 5 parts by weight
~ It is a triple metropolitan area.
配合量が0.05重量部より少ないと相溶性の改良効果
が見られず、5重量部を越えると、成形加工性や熱安定
性が低下する。If the amount is less than 0.05 parts by weight, no effect of improving compatibility will be observed, and if it exceeds 5 parts by weight, moldability and thermal stability will decrease.
芳香族ポリカーボネート樹脂、熱可塑性液晶樹脂、及び
芳香族エポキシ樹脂の配合は、公知の方法で行われるが
、特に、エクストルーダバンバリーミキサ−スーハーミ
キサー、熱ロル、ニーダ−などによる溶融混合が望まし
い。The aromatic polycarbonate resin, thermoplastic liquid crystal resin, and aromatic epoxy resin may be blended by a known method, but melt mixing using an extruder Banbury mixer-Suher mixer, hot roll, kneader, etc. is particularly preferable.
また、本発明の樹脂組成物には、公知の各種の添加剤、
例えば、ビニル共重合体やその水添加工物、アクリロイ
ド系化合物、変性ポリオレフィンなどの衝撃性改良剤、
ノ;ラフインワックス、脂肪酸エステルなどの滑剤、ヒ
ンダードフェノール、リン酸エステルや亜リン酸エステ
ルなどの酸化防止剤、トリアジン系化合物などの耐候性
改良剤、顔料、染料などの着色剤、ガラス繊維、炭素繊
維、金属繊維、各種ウィスカ等の繊維系充填材、マイカ
、タルり、メタけい酸カルシウム、炭酸カルシウム、シ
リカ、アルミナ、シリカ−アルミナ系粘土鉱物、シリカ
マグネシウム系粘土鉱物、アスベストなどの無機充填材
、帯電防止材、難燃剤ガどを含有していてもよい。The resin composition of the present invention also includes various known additives,
For example, impact modifiers such as vinyl copolymers and their water-added products, acryloid compounds, modified polyolefins,
Rough-in wax, lubricants such as fatty acid esters, hindered phenols, antioxidants such as phosphate esters and phosphite esters, weather resistance improvers such as triazine compounds, colorants such as pigments and dyes, glass fibers , carbon fibers, metal fibers, fibrous fillers such as various whiskers, mica, tar, calcium metasilicate, calcium carbonate, silica, alumina, silica-alumina clay minerals, silica-magnesium clay minerals, and inorganic materials such as asbestos. It may contain fillers, antistatic materials, flame retardants, etc.
本発明のポリカーボネート樹脂組成物は、射出成形、押
出成形、中空成形、熱成形等の公知の種々の加工法によ
って加工されるが、本発明の組成物の特性である優れた
剛性を発現するためには、配合される熱可塑性液晶樹脂
が、成形品中で延伸配向されることが望捷しく、このだ
めには、ロール加工やブロー成形等の延伸が加わる加工
法、及び、射出成形においては射出速度が50■/秒以
上での高速射出成形が好ましいが、主要部分の肉厚が2
mm以下の薄肉成形品であることが特に望ましい。The polycarbonate resin composition of the present invention can be processed by various known processing methods such as injection molding, extrusion molding, blow molding, and thermoforming, but since it exhibits the excellent rigidity that is a characteristic of the composition of the present invention, It is desirable for the thermoplastic liquid crystal resin to be blended into the molded product to be stretched and oriented in the molded product. High-speed injection molding with an injection speed of 50 cm/sec or higher is preferable, but if the wall thickness of the main part is 2.
Particularly desirable is a thin-walled molded product of 1 mm or less.
次に、本発明を実施例により更に具体的に説明する。 Next, the present invention will be explained in more detail with reference to Examples.
実施例1〜5及び比較例1〜4
芳香族ポリカーボネート樹脂として、粘度平均分子量2
2oooのビスフェノールAポリカポネート樹脂(三菱
化成■製ツバレックス7022A)を用い、熱可塑性液
晶樹脂として、三菱化成(ll製N0VAccURAT
E E−322を用い、この両者からなる樹脂組成物
と市販の芳香族エポキシ樹脂とを、後記表−1に示した
各組成にて配合し、それぞれを樹脂温度260〜290
℃の範囲内で、スクリュー径40簡φのベント式押出機
にて溶融混合し、各ペレットを得た。こうして得られた
各ペレットを120℃の循環式熱風乾燥機にて5時間乾
燥後、型締圧75トンの射出成形機を用い、樹脂温度2
80〜300℃の範囲内で各試験片を作成した。Examples 1 to 5 and Comparative Examples 1 to 4 As aromatic polycarbonate resin, viscosity average molecular weight 2
Using 2ooo bisphenol A polycarbonate resin (Tubalex 7022A manufactured by Mitsubishi Kasei ■), as a thermoplastic liquid crystal resin, N0VAccURAT manufactured by Mitsubishi Kasei (II) was used.
E Using E-322, a resin composition consisting of both of them and a commercially available aromatic epoxy resin were blended at each composition shown in Table 1 below, and each was heated to a resin temperature of 260 to 290.
The mixture was melt-mixed in a vent-type extruder with a screw diameter of 40 mm within a temperature range of 0.degree. C. to obtain each pellet. After drying each pellet thus obtained in a circulating hot air dryer at 120°C for 5 hours, using an injection molding machine with a mold clamping pressure of 75 tons, the resin temperature was 2.
Each test piece was created within the range of 80 to 300°C.
こうして得られた各試験片について、下記(1)〜(6
)の方法により、曲げ強度、曲げ弾性率、ウェルド部引
張強度、■ZOd衝撃強度、耐折特性、流動性、及び外
観の評価を行った。評価結果は後記表−2に示した。For each test piece obtained in this way, the following (1) to (6)
), bending strength, bending elastic modulus, weld part tensile strength, (2) ZOd impact strength, folding durability, fluidity, and appearance were evaluated. The evaluation results are shown in Table 2 below.
(1) 曲げ強度、及び曲げ弾性率
長さ5′′幅1/2”厚み1/16″及び1/8°°
の二種の試験片を用い、ASTM D−790に従って
行った0
(2) ウェルド部引張強度
両端にゲートを付与し、中央にウェルドが形成されたダ
ンベル型試験片を用いASTMD−638に従って行っ
た。(1) Bending strength and bending modulus Length 5'' Width 1/2'' Thickness 1/16'' and 1/8°
0 (2) Tensile strength of weld part Conducted according to ASTM D-638 using a dumbbell-shaped test piece with gates on both ends and a weld formed in the center .
(3) Izod衝撃強度
1/2パ厚みの試験片を用い、ASTM D−256に
従って行った。(3) Izod impact strength Tested according to ASTM D-256 using a test piece with a thickness of 1/2 Pa.
耐折特性
長さ5”幅1/2゛°厚み1/32°”の試験片を用い
、ASTM D−643に従って行った。Folding Durability Tests were carried out in accordance with ASTM D-643 using test pieces with a length of 5 inches, a width of 1/2 degrees, and a thickness of 1/32 degrees.
流動性
長さ5パ幅x/z”厚み1/16°′及びl/8・°
の二種の試験片がセットになった金型を、樹脂温度2
90°Cにて射出成形し、その際に必要な樹脂圧力によ
って、流動性を測定した。Fluidity Length 5 Pa Width x/z" Thickness 1/16°' and l/8°
The mold containing the two types of test pieces was heated to a resin temperature of 2.
Injection molding was carried out at 90°C, and fluidity was measured by the resin pressure required at that time.
外観
長さ5パ幅1/2°゛厚み1/32°′の試験片のゲー
ト部に生じるジェツテイングの有無、及び、剥離現象の
有無を、目視にて観察した。The presence or absence of jetting occurring at the gate portion of a test piece having an external length of 5 mm, width of 1/2° and thickness of 1/32°, and the presence or absence of a peeling phenomenon were visually observed.
以上の結果、特に表−2に示す結果からも明らかなよう
に、本発明のポリカーボネート樹脂組成物は、必須の第
3成分として少量の芳香族エポキシ樹脂を配合すること
によって、特に薄肉部での剛性が高く、ウェルド強度が
高く、衝撃強度や耐屈曲性も強く、加えて特に、従来の
ようなジェツテイングや剥離の不都合は全く生じない、
という工業的価値ある顕著な効果を奏するものである。As is clear from the above results, especially from the results shown in Table 2, the polycarbonate resin composition of the present invention can be improved particularly in thin-walled areas by blending a small amount of aromatic epoxy resin as an essential third component. It has high rigidity, high weld strength, high impact strength and bending resistance, and in addition, it does not suffer from jetting or peeling, which is the problem with conventional products.
This has a remarkable effect of industrial value.
Claims (1)
熱可塑性液晶樹脂5〜40重量%とからなる樹脂組成物
100重量部に対し、芳香族エポキシ樹脂を0.05〜
5重量部配合してなるポリカーボネート樹脂組成物。(1) 0.05 to 100 parts by weight of an aromatic epoxy resin to 100 parts by weight of a resin composition consisting of 95 to 60% by weight of an aromatic polycarbonate resin and 5 to 40% by weight of a thermoplastic liquid crystal resin.
A polycarbonate resin composition containing 5 parts by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63296950A JP2571709B2 (en) | 1988-11-24 | 1988-11-24 | Polycarbonate resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63296950A JP2571709B2 (en) | 1988-11-24 | 1988-11-24 | Polycarbonate resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02142849A true JPH02142849A (en) | 1990-05-31 |
JP2571709B2 JP2571709B2 (en) | 1997-01-16 |
Family
ID=17840283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63296950A Expired - Lifetime JP2571709B2 (en) | 1988-11-24 | 1988-11-24 | Polycarbonate resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2571709B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206080A (en) * | 1989-02-03 | 1990-08-15 | Mitsubishi Kasei Corp | Shutter made of resin for information disk |
EP0566149A2 (en) * | 1992-04-17 | 1993-10-20 | Mazda Motor Corporation | Molding composite composition and method for molding the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3839247A (en) * | 1973-01-05 | 1974-10-01 | Gen Electric | Water-clear hydrolytically stable polycarbonate composition containing an aromatic or aliphatic epoxy stabilizer |
JPS63159467A (en) * | 1986-10-31 | 1988-07-02 | ゼネラル・エレクトリック・カンパニイ | Polycarbonate and copolyester carbonate resin composition showing high modulus |
-
1988
- 1988-11-24 JP JP63296950A patent/JP2571709B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3839247A (en) * | 1973-01-05 | 1974-10-01 | Gen Electric | Water-clear hydrolytically stable polycarbonate composition containing an aromatic or aliphatic epoxy stabilizer |
JPS63159467A (en) * | 1986-10-31 | 1988-07-02 | ゼネラル・エレクトリック・カンパニイ | Polycarbonate and copolyester carbonate resin composition showing high modulus |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206080A (en) * | 1989-02-03 | 1990-08-15 | Mitsubishi Kasei Corp | Shutter made of resin for information disk |
JP2742286B2 (en) * | 1989-02-03 | 1998-04-22 | 三菱化学株式会社 | Resin shutter for information disk |
EP0566149A2 (en) * | 1992-04-17 | 1993-10-20 | Mazda Motor Corporation | Molding composite composition and method for molding the same |
EP0566149A3 (en) * | 1992-04-17 | 1995-04-26 | Mazda Motor | Molding composite composition and method for molding the same. |
Also Published As
Publication number | Publication date |
---|---|
JP2571709B2 (en) | 1997-01-16 |
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