JPH0214200Y2 - - Google Patents
Info
- Publication number
- JPH0214200Y2 JPH0214200Y2 JP5710186U JP5710186U JPH0214200Y2 JP H0214200 Y2 JPH0214200 Y2 JP H0214200Y2 JP 5710186 U JP5710186 U JP 5710186U JP 5710186 U JP5710186 U JP 5710186U JP H0214200 Y2 JPH0214200 Y2 JP H0214200Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor lead
- claw
- block
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 45
- 210000000078 claw Anatomy 0.000 claims description 30
- 230000032258 transport Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Reciprocating Conveyors (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5710186U JPH0214200Y2 (en:Method) | 1986-04-16 | 1986-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5710186U JPH0214200Y2 (en:Method) | 1986-04-16 | 1986-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61188356U JPS61188356U (en:Method) | 1986-11-25 |
| JPH0214200Y2 true JPH0214200Y2 (en:Method) | 1990-04-18 |
Family
ID=30581315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5710186U Expired JPH0214200Y2 (en:Method) | 1986-04-16 | 1986-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0214200Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5859236B2 (ja) * | 2011-07-15 | 2016-02-10 | ファスフォードテクノロジ株式会社 | フレーム供給装置およびフレーム供給方法 |
-
1986
- 1986-04-16 JP JP5710186U patent/JPH0214200Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61188356U (en:Method) | 1986-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0214200Y2 (en:Method) | ||
| JP2815000B2 (ja) | 半導体装置のリード加工装置 | |
| JP3469357B2 (ja) | 電子部品におけるリード端子の曲げ加工装置 | |
| JPH0546269Y2 (en:Method) | ||
| JP2548227Y2 (ja) | 電子部品用リードフレームの押さえ装置 | |
| JPH0325403Y2 (en:Method) | ||
| JP3027497U (ja) | リードフレーム切断装置 | |
| JP3027495U (ja) | リードフレーム切断装置 | |
| KR960019625A (ko) | 반도체 패키지의 와이어본딩(wire bonding) 검사장치 | |
| JPH034029Y2 (en:Method) | ||
| JP3027494U (ja) | リードフレーム切断装置 | |
| KR200150606Y1 (ko) | 이중 다이 본딩장치 | |
| JP3028566U (ja) | 半導体装置の製造装置 | |
| JP2001015559A (ja) | 電子部品のボンディング装置およびボンディングツール | |
| JPS58137528U (ja) | プレス機における材料送り装置 | |
| JPS6338049Y2 (en:Method) | ||
| JPH0217836U (en:Method) | ||
| JPS63159829U (en:Method) | ||
| JPH039356Y2 (en:Method) | ||
| JPH023629Y2 (en:Method) | ||
| JP3863218B2 (ja) | フープ状リードフレームに対するモールド部の成形装置 | |
| JPH0354836A (ja) | 吸着ヘッド | |
| JPS631813U (en:Method) | ||
| JPS58170131U (ja) | ブランク材等のプレス間搬送装置 | |
| JPH0212892Y2 (en:Method) |