JPH0214173B2 - - Google Patents
Info
- Publication number
- JPH0214173B2 JPH0214173B2 JP28836885A JP28836885A JPH0214173B2 JP H0214173 B2 JPH0214173 B2 JP H0214173B2 JP 28836885 A JP28836885 A JP 28836885A JP 28836885 A JP28836885 A JP 28836885A JP H0214173 B2 JPH0214173 B2 JP H0214173B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- resin sheet
- patterned
- whiskers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 120
- 239000011347 resin Substances 0.000 claims description 120
- 238000000465 moulding Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、肌理模様や木目模様、梨地模様、葉
脈模様、鱗模様、大理石模様等の凹凸をその表面
に有する樹脂成形品を作製する場合に用いられる
樹脂成形用型で、詳しくは、凹凸模様を形成する
ための凹凸状型面を、基体に貼付けた樹脂層に形
成してある樹脂成形用型に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to the production of resin molded products having irregularities such as texture patterns, wood grain patterns, satin patterns, leaf vein patterns, scale patterns, marble patterns, etc. on the surface thereof. More specifically, the present invention relates to a resin molding mold that has an uneven mold surface for forming an uneven pattern formed on a resin layer attached to a base.
従来のこの種の樹脂成形用型においては、前記
の樹脂層を、ガラス繊維を混入した樹脂から構成
することにより、樹脂層に、凹凸状型面としての
強度を付与するようにしていた（例えば、特開昭
50−34058号公報）。
In conventional resin molding molds of this type, the resin layer is made of a resin mixed with glass fibers, thereby imparting strength to the resin layer as an uneven mold surface (e.g. , Tokukai Akira
50-34058).
しかしながら、前記従来の樹脂成形用型による
ときは、樹脂成形品を作製する際の基体（一般に
金属製である。）への熱伝導を良くして樹脂層の
熱による変形、変質を抑える上で、樹脂層を薄く
（200μｍ程度）した場合、前記ガラス繊維がチヨ
ツプドストランドで長さが２〜３cm程度のもので
あるため、樹脂層内におけるガラス繊維が型内に
沿つた横向きの姿勢となるといつた具合に樹脂層
内でのガラス繊維の配向に偏りが生じ易く、樹脂
層が熱や外力によつて、変形し、破壊し易いとい
つた欠点があつた。また、ガラス繊維が２〜３mm
程度の長さのものである故、凹凸模様が非常に微
細な場合、その凹凸状型面を精度良く形成するこ
とがむずかしいといつた欠点があつた。
However, when using the conventional resin molding mold, it is important to improve heat conduction to the base (generally made of metal) when producing a resin molded product and to suppress deformation and deterioration of the resin layer due to heat. When the resin layer is made thin (about 200 μm), the glass fibers are chopped strands with a length of about 2 to 3 cm, so the glass fibers in the resin layer are in a horizontal position along the inside of the mold. This has disadvantages in that the orientation of the glass fibers within the resin layer tends to be uneven, and the resin layer is easily deformed and destroyed by heat or external force. In addition, glass fiber is 2 to 3 mm
Because of the length of the mold, it has the disadvantage that if the uneven pattern is very fine, it is difficult to form the uneven mold surface with high precision.
本発明の目的は、樹脂層の強度を向上するとと
もに、微細な凹凸状型面を精度良く形成できるよ
うにする点にある。 An object of the present invention is to improve the strength of the resin layer and to form a finely uneven mold surface with high precision.
本発明による樹脂成形用型の特徴構成は、前記
樹脂層を、長さが10〜300μｍのウイスカーを混
入した樹脂から構成してある点にある。そして、
それによる作用・効果は次の通りである。
A characteristic feature of the resin molding mold according to the present invention is that the resin layer is made of a resin mixed with whiskers having a length of 10 to 300 μm. and,
The effects and effects thereof are as follows.
ガラス繊維ではなく、直径が0.05〜17μｍ、長
さが10〜300μｍといつた微細なウイスカーを混
入した樹脂から樹脂層を構成してあるため、樹脂
層が薄くても、その樹脂層内においてウイスカー
を全方向に万遍なく配向することができ、かつ、
ウイスカーによつて微細な凹凸状型面の成形を阻
害することがない。
The resin layer is not made of glass fiber, but is made of resin mixed with minute whiskers with a diameter of 0.05 to 17 μm and a length of 10 to 300 μm, so even if the resin layer is thin, the whiskers will not be present in the resin layer. can be oriented uniformly in all directions, and
Whiskers do not impede molding of a finely uneven mold surface.
したがつて、本発明は、熱や外力による樹脂層
の変形や変質がなくて、微細な凹凸模様を樹脂成
形品の表面に形成することができる樹脂成形用型
を提供し得るに至つた。
Therefore, the present invention has been able to provide a mold for resin molding that can form a fine uneven pattern on the surface of a resin molded product without deforming or deteriorating the resin layer due to heat or external force.
以下、本発明の実施例を図面に基づいて説明す
る。
Embodiments of the present invention will be described below based on the drawings.
樹脂成形用型は、第１図に示すように、金属製
の基体１に、凹凸模様を形成するための凹凸状型
面２ａが形成された樹脂層２を貼付けて構成され
ている。 As shown in FIG. 1, the resin molding mold is constructed by pasting onto a metal base 1 a resin layer 2 on which an uneven mold surface 2a for forming an uneven pattern is formed.
前記樹脂層２は、直径が0.05〜17μｍ、好まし
くは0.5μｍ、長さが10〜300μｍ、好ましくは50μ
ｍのセラミツクのウイスカーを混入したエポキシ
樹脂から構成されている。前記ウイスカーは、エ
ポキシ樹脂20部に対して１〜100部混入されてい
るが、ウイスカーの混入量は、樹脂へのフイラー
混入量に応じて適宜選定されるものである。前記
エポキシ樹脂は、ノボラツクタイプのエポキシ樹
脂とカルボキシイミド無水物コンプレツクスとを
組合わせた組成物である。 The resin layer 2 has a diameter of 0.05 to 17 μm, preferably 0.5 μm, and a length of 10 to 300 μm, preferably 50 μm.
It is composed of epoxy resin mixed with m ceramic whiskers. The whiskers are mixed in an amount of 1 to 100 parts per 20 parts of the epoxy resin, and the amount of whiskers mixed in is appropriately selected depending on the amount of filler mixed in the resin. The epoxy resin is a composition that combines a novolak type epoxy resin and a carboxyimide anhydride complex.
前記樹脂層２の凹凸状型面２ａには、四フツ化
エチレン樹脂（一般にテフロンと呼ばれているも
の。）を成分とする離型層３が形成されている。 On the uneven mold surface 2a of the resin layer 2, a mold release layer 3 containing tetrafluoroethylene resin (commonly called Teflon) is formed.
次に前記樹脂成形用型の作製方法例を挙げる。 Next, an example of a method for manufacturing the resin molding mold will be described.
作製方法［１］
第３図イ，ロに示すように、ウイスカーが混入
されたエポキシ樹脂から半硬化状態の樹脂シート
A1を形成し、次いで、この樹脂シートA1が半硬
化状態にあるうちに、
＜１＞ 樹脂成形品に形成すべき凹凸模様を有す
る原型４の凹凸模様面４ａに樹脂シートA1を
重ね合わせて押付けることにより、一面が前記
凹凸状型面２ａとなる凹凸模様面ａに形成され
た樹脂層形成用の模様付樹脂シートA2を作製
し、
＜２＞ その、模様付樹脂シートA2を原型４か
ら剥離して基体１に貼付け、
その状態で全体を加熱して模様付樹脂シート
A2を硬化させて、凹凸状型面２ａ付きの樹脂層
２を形成する。Manufacturing method [1] As shown in Figure 3 A and B, a semi-cured resin sheet is made from epoxy resin mixed with whiskers.
A 1 is formed, and then, while this resin sheet A 1 is in a semi-cured state, <1> Overlap the resin sheet A 1 on the uneven pattern surface 4a of the master mold 4 having the uneven pattern to be formed on the resin molded product. By pressing them together, a patterned resin sheet A 2 for forming a resin layer is produced, one surface of which is formed on the uneven pattern surface a that becomes the uneven mold surface 2 a, <2> The patterned resin sheet A 2 is peeled off from the prototype 4 and pasted on the base 1, and the whole is heated in that state to form a patterned resin sheet.
A 2 is cured to form a resin layer 2 with an uneven mold surface 2a.
前記樹脂シートA1の作製方法としては、スリ
ツプブレード法、ドクターブレード法、このドク
ターブレード法におけるドクターブレードの代り
にロールを用いて成形するロール法、カレンダー
法、ペーパーデイツピング法、連続加圧法、射出
成形法、樹脂の塊をスライスするスライス法、ス
キージ法、半硬化状態の樹脂を延伸する延伸法、
樹脂の塊を削る削り取り法、プレス成形法、遠心
力で樹脂を延伸する遠心法、樹脂を押出機からシ
ート状に押出す押出し成形法、型面に樹脂を一定
厚さに吹付ける吹付け法等を挙げることができ
る。 Methods for producing the resin sheet A1 include a slip blade method, a doctor blade method, a roll method in which a roll is used instead of a doctor blade in this doctor blade method, a calendar method, a paper dip method, a continuous pressing method, Injection molding method, slicing method for slicing a lump of resin, squeegee method, stretching method for stretching semi-cured resin,
The scraping method involves scraping off lumps of resin, the press molding method, the centrifugal method by which the resin is stretched using centrifugal force, the extrusion molding method by extruding the resin into a sheet from an extruder, and the spraying method by spraying resin onto the mold surface to a constant thickness. etc. can be mentioned.
前記＜１＞の工程においては、樹脂シートA1
の可撓性を利用して、第３図イに示すように、樹
脂シートA1を一端側から徐々に凹凸模様面４ａ
に押付ける、あるいは、第４図に示すように、樹
脂シートA1の中央部から徐々に凹凸模様面４ａ
に押付けて、樹脂シートA1と凹凸模様面４ａと
の間に空気が入らないように樹脂シートA1を原
型４に重ね合わせる。また、模様付樹脂シート
A2の基体１への貼付けも同様に行う。更に、前
記＜２＞の工程において、原型４が硬質の場合
は、模様付樹脂シートA2を撓ませてその模様付
樹脂シートA2を原型４から剥離し、原型４が軟
質、つまり、可撓性を有する場合は、原型４また
は模様付樹脂シートA2もしくはその両者を撓ま
せて模様付樹脂シートA2を原型４から剥離する。
加えて、前述＜２＞の工程において、第５図に示
すように、模様付樹脂シートA2の凹凸模様面ａ
に、模様付樹脂シートA2を硬化させる温度で加
熱されることにより溶融、または、焼却、あるい
は、蒸発するワツクス等の材料からなる保護層５
を形成したのち、模様付樹脂シートA2を基体１
に貼付けても良い。この場合、基体１への貼付け
等において模様付樹脂シートA2における凹凸模
様面ａの形崩れを防止でき、かつ、模様付樹脂シ
ートA2を保護層５で補強してハンドリング性を
向上できる。 In the step <1> above, the resin sheet A 1
As shown in Fig. 3A, using the flexibility of the resin sheet A1 , gradually form the uneven pattern surface 4a from one end
4, or as shown in FIG .
The resin sheet A 1 is overlaid on the master mold 4 so that no air is trapped between the resin sheet A 1 and the uneven pattern surface 4a. In addition, patterned resin sheets
Attach A 2 to the substrate 1 in the same manner. Furthermore, in the step <2>, if the master mold 4 is hard, the patterned resin sheet A 2 is bent and the patterned resin sheet A 2 is peeled off from the master mold 4, so that the master mold 4 is soft, that is, flexible. If it has flexibility, the patterned resin sheet A 2 is peeled from the pattern 4 by bending the pattern 4 or the patterned resin sheet A 2 or both.
In addition, in the step <2> above, as shown in FIG. 5, the uneven pattern surface a of the patterned resin sheet A2
A protective layer 5 made of a material such as wax that melts, incinerates, or evaporates when heated at a temperature that hardens the patterned resin sheet A2 .
After forming patterned resin sheet A 2 , base 1
You can also paste it on In this case, it is possible to prevent the uneven pattern surface a of the patterned resin sheet A 2 from deforming when it is attached to the substrate 1, etc., and the patterned resin sheet A 2 can be reinforced with the protective layer 5 to improve handling properties.
作製方法［２］
第６図に示すように、前述の作製方法［１］に
おいて、＜２＞の工程に代えて、模様付樹脂シー
トA2を基体１に貼付けたのち、原型４を模様付
樹脂シートA2から剥離する。Manufacturing method [2] As shown in FIG. 6, in the aforementioned manufacturing method [1], instead of step <2>, after pasting the patterned resin sheet A 2 on the base 1, the patterned pattern 4 is Peel off from resin sheet A2 .
作製方法［３］
第７図イ，ロに示すように、ウイスカー混入の
エポキシ樹脂を原型４の凹凸模様面４ａに塗布、
または、押付け、あるいは、流し込んで、凹凸状
型面２ａとなる凹凸模様面ａを有する模様付樹脂
シートA2を作製し、この模様付樹脂シートA2を
硬化する前に原型４から剥離して基体１に貼付
け、加熱して硬化させる。なお、模様付樹脂シー
トA2の原型４からの剥離及び基体１への貼付け
は、前述した作製方法［１］と同様に行う。Manufacturing method [3] As shown in Fig. 7 A and B, epoxy resin mixed with whiskers is applied to the uneven pattern surface 4a of the master model 4,
Alternatively, by pressing or pouring, a patterned resin sheet A 2 having an uneven pattern surface a that becomes an uneven mold surface 2 a is produced, and this patterned resin sheet A 2 is peeled from the master mold 4 before being cured. It is pasted on the base 1 and heated to harden. Note that peeling off the patterned resin sheet A 2 from the master form 4 and pasting it onto the base 1 are performed in the same manner as in the above-described manufacturing method [1].
作製方法［４］
第８図イ，ロに示すように、前記作製方法
［３］と同様にして模様付樹脂シートA2を作製
し、この模様付樹脂シートA2を、原型４が付い
たままで基体１に貼付けたのち、原型４を剥離
し、加熱して模様付樹脂シートA2を硬化させる。Manufacturing method [4] As shown in Fig. 8 A and B, a patterned resin sheet A 2 is manufactured in the same manner as in the manufacturing method [3] above, and this patterned resin sheet A 2 is coated with the master pattern 4 attached. After the patterned resin sheet A2 is attached to the substrate 1, the patterned resin sheet A2 is peeled off and heated to harden the patterned resin sheet A2 .
作製方法［５］
第９図イ，ロ，ハに示すように、基体１に前記
半硬化状態の樹脂シートA1を貼付け、この樹脂
シートA1に原型４を押付けて、模様付樹脂シー
トA2を作製し、原型４を剥離したのち、加熱し
て模様付樹脂シートA2を硬化させる。Manufacturing method [5] As shown in FIGS. 9A, 9B, and 9C, the semi-cured resin sheet A 1 is pasted on the base 1, and the master mold 4 is pressed onto this resin sheet A 1 to form the patterned resin sheet A. After the patterned resin sheet A 2 is produced and the original mold 4 is peeled off, the patterned resin sheet A 2 is cured by heating.
作製方法［６］
第１０図イ，ロ，ハに示すように、流動状態の
ウイスカー混入エポキシ樹脂を基体１に塗布し、
この塗布樹脂が半硬化したとき、その塗布樹脂に
原型４を押付けて、模様付樹脂シートA2を基体
１に貼付いた状態に作製し、次いで、原型４を剥
離したのち加熱して模様付樹脂シートA2を硬化
させる。Manufacturing method [6] As shown in FIG.
When this coated resin is semi-cured, a patterned resin sheet A 2 is produced by pressing the patterned resin sheet A 2 onto the base 1 by pressing the coated resin, and then the patterned resin sheet A 2 is peeled off and heated to form the patterned resin. Cure sheet A2 .
作製方法［７］
第１１図イ，ロ，ハに示すように、半硬化状態
（粘土状）のウイスカー混入エポキシ樹脂塊を基
体１に置いて原型４で押付けることにより、模様
付樹脂シートA2を基体１に貼付いた状態に作製
し、次いで、原型４を剥離したのち加熱して模様
付樹脂シートA2を硬化させる。Production method [7] As shown in Fig. 11 A, B, and C, a patterned resin sheet A is prepared by placing a semi-hardened (clay-like) whisker-containing epoxy resin lump on the base 1 and pressing it with the master mold 4. The patterned resin sheet A 2 is produced in a state where it is adhered to the substrate 1, and then the patterned resin sheet A 2 is cured by heating after peeling off the master pattern 4.
作製方法［８］
第１２図イ，ロに示すように、基体１と原型４
との間の隙間に、流動状態のウイスカー混入エポ
キシ樹脂を流し込んで、模様付樹脂シートA2を
基体１に貼付いた状態に作製し、模様付樹脂シー
トA2が半硬化したのち、原型４を除去し、加熱
して模様付樹脂シートA2を硬化させる。Manufacturing method [8] As shown in Figure 12 A and B, the base 1 and the prototype 4 are
A whisker-containing epoxy resin in a fluid state is poured into the gap between the patterned resin sheet A 2 and the substrate 1 to make the patterned resin sheet A 2 adhered to the substrate 1. After the patterned resin sheet A 2 is semi-hardened, the master mold 4 is formed. Remove and heat to harden the patterned resin sheet A2 .
なお、前記離型層３は、各作製方法において、
加熱する前に離型剤を模様付樹脂シートＡの凹凸
模様面ａに塗布し、次の加熱による塗布離型剤の
硬化によつて形成されるものである。 In addition, in each manufacturing method, the release layer 3 is
A mold release agent is applied to the uneven pattern surface a of the patterned resin sheet A before heating, and the applied mold release agent is then cured by heating.
また、樹脂層２を構成する樹脂としては、上述
したものの他に、普通のエポキシ樹脂、アクリル
樹脂、ポリアセタール樹脂、ポリアミド樹脂、ポ
リイミド樹脂、ポリウレタン樹脂、ポリエステル
樹脂、ポリエチレン樹脂、ポリカーボネイト樹
脂、ポリプロピレン樹脂、けい素樹脂、ふつ素樹
脂、メラミン樹脂、ユリア樹脂、フエノール樹
脂、フタル酸系樹脂、スチロール系樹脂、繊維素
系樹脂、塩化ビニル樹脂、酢酸ビニル樹脂等を挙
げることができ、これら樹脂は、単独に使用して
も良く、混合して使用しても良い。 In addition to the above-mentioned resins, examples of resins constituting the resin layer 2 include ordinary epoxy resins, acrylic resins, polyacetal resins, polyamide resins, polyimide resins, polyurethane resins, polyester resins, polyethylene resins, polycarbonate resins, polypropylene resins, Examples include silicone resin, fluororesin, melamine resin, urea resin, phenolic resin, phthalic acid resin, styrene resin, cellulose resin, vinyl chloride resin, vinyl acetate resin, etc. It may be used for, or may be used in combination.
前記各作製方法において、樹脂シートA1およ
び模様付樹脂シートA2を基体１に貼付けるにあ
たつては、その樹脂自体の接着性のみに依存して
も良いが、接着剤を用いても良い。また、基体１
の、樹脂シートA1，A2が貼付けられる面は、ブ
ラスト等により、接着し易い粗面に加工してお
く。 In each of the above manufacturing methods, when attaching the resin sheet A 1 and the patterned resin sheet A 2 to the substrate 1, it may depend only on the adhesiveness of the resin itself, but it may also depend on the adhesiveness of the resin itself. good. In addition, the base 1
The surface to which the resin sheets A 1 and A 2 are attached is processed by blasting or the like to have a rough surface that is easy to adhere to.
次に本発明の別実施例を示す。 Next, another embodiment of the present invention will be shown.
ウイスカーとして、アルミニウム、鉄、銅等、
金属のウイスカーを混入する。 As whiskers, aluminum, iron, copper, etc.
Mix metal whiskers.
ウイスカーとして、セラミツクスのウイスカー
と金属のウイスカーとを混合して混入する。 As whiskers, ceramic whiskers and metal whiskers are mixed together.
ウイスカーに加えて、セラミツクスや金属の粉
粒体を混入した樹脂から樹脂層２を構成する。 The resin layer 2 is made of a resin mixed with ceramic or metal powder in addition to whiskers.
保護層５を、水等の液体で溶けるものから構成
する。 The protective layer 5 is made of a material that is soluble in liquid such as water.
保護層５を、剥離し易いものから構成する。 The protective layer 5 is made of a material that is easily peeled off.
前記作製方法［２］、［４］、［５］、［６］、［７
］、
［８］において、模様付樹脂シートA2を硬化させ
たのち、原型４を剥離する。 The above manufacturing method [2], [4], [5], [6], [7]
],
In [8], after the patterned resin sheet A 2 is cured, the master model 4 is peeled off.
もちろん、樹脂層２自体が離型効果を有する場
合には、離型層３を凹凸状型面２ａ施さなくても
良い。 Of course, if the resin layer 2 itself has a mold release effect, it is not necessary to apply the mold release layer 3 to the uneven mold surface 2a.
尚、特許請求の範囲の項に図面との対照を便利
にする為に符号を記すが、該記入により本発明は
添付図面の構造に限定されるものではない。 Incidentally, although reference numerals are written in the claims section for convenient comparison with the drawings, the present invention is not limited to the structure shown in the accompanying drawings.
図面は本発明に係る樹脂成形用型の実施例を示
し、第１図は断面図、第２図は要部の拡大断面
図、第３図イ，ロ、第４図、第５図、第６図、第
７図イ，ロ、第８図イ，ロ、第９図イ，ロ，ハ、
第１０図イ，ロ，ハ、第１１図イ，ロ，ハ、第１
２図イ，ロはそれぞれ作製工程を示す断面図であ
る。
１……基体、２……樹脂層、２ａ……凹凸状型
面。
The drawings show examples of the resin molding mold according to the present invention, and FIG. 1 is a sectional view, FIG. 2 is an enlarged sectional view of the main part, FIG. 3 A, B, FIG. 4, FIG. Figure 6, Figure 7 A, B, Figure 8 A, B, Figure 9 A, B, C,
Figure 10 A, B, C, Figure 11 A, B, C, 1st
Figures 2A and 2B are cross-sectional views showing the manufacturing process, respectively. DESCRIPTION OF SYMBOLS 1... Base body, 2... Resin layer, 2a... Uneven mold surface.
Claims (1)
を、基体１に貼付けた樹脂層２に形成してある樹
脂成形用型であつて、前記樹脂層２を、長さが10
〜300μｍのウイスカーを混入した樹脂から構成
してある樹脂成形用型。 ２ 前記ウイスカーがセラミツクスのウイスカー
である特許請求の範囲第１項に記載の樹脂成形用
型。 ３ 前記ウイスカーが金属のウイスカーである特
許請求の範囲第１項に記載の樹脂成形用型。 ４ 前記ウイスカーが樹脂20部に対して１〜100
部混入されている特許請求の範囲第１項乃至第３
項のいずれかに記載の樹脂成形用型。[Claims] 1. Uneven mold surface 2a for forming an uneven pattern
is a resin molding mold formed on a resin layer 2 attached to a base 1, and the resin layer 2 has a length of 10 mm.
A resin molding mold made of resin mixed with ~300μm whiskers. 2. The mold for resin molding according to claim 1, wherein the whiskers are ceramic whiskers. 3. The resin molding mold according to claim 1, wherein the whiskers are metal whiskers. 4 The whisker is 1 to 100 parts per 20 parts of resin.
Claims 1 to 3 included in this section
The mold for resin molding according to any one of paragraphs.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60288368A JPS62146606A (en) | 1985-12-20 | 1985-12-20 | Mold for molding resin |
| KR1019860010954A KR900008808B1 (en) | 1985-12-20 | 1986-12-19 | Plastics shaping mold and method of preparing mold |
| GB8630371A GB2184682B (en) | 1985-12-20 | 1986-12-19 | Plastics shaping mould and method of preparing a plastics shaping mould |
| CA000525875A CA1312186C (en) | 1985-12-20 | 1986-12-19 | Plastics shaping mold and method of preparing mold |
| DE3643717A DE3643717C2 (en) | 1985-12-20 | 1986-12-20 | Process for producing a plastic profiling mold |
| US07/247,236 US4919388A (en) | 1985-12-20 | 1988-09-21 | Plastics shaping mold having patterned resin layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60288368A JPS62146606A (en) | 1985-12-20 | 1985-12-20 | Mold for molding resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62146606A JPS62146606A (en) | 1987-06-30 |
| JPH0214173B2 true JPH0214173B2 (en) | 1990-04-06 |
Family
ID=17729294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60288368A Granted JPS62146606A (en) | 1985-12-20 | 1985-12-20 | Mold for molding resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62146606A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008065946A1 (en) | 2006-12-01 | 2008-06-05 | Tanazawa Hakkosha Co., Ltd. | Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278808A (en) * | 1987-05-11 | 1988-11-16 | Tokai Carbon Co Ltd | Resin mold |
| JPS6444710A (en) * | 1987-08-12 | 1989-02-17 | Tokai Carbon Kk | Resin mold and its manufacture |
| JPWO2007032495A1 (en) * | 2005-09-16 | 2009-03-19 | 株式会社棚澤八光社 | Molds for resin molding and resin molded products |
| EP3132910A1 (en) * | 2010-12-15 | 2017-02-22 | Canon Kabushiki Kaisha | Resin molded article, method for manufacturing the same, and printer |
-
1985
- 1985-12-20 JP JP60288368A patent/JPS62146606A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008065946A1 (en) | 2006-12-01 | 2008-06-05 | Tanazawa Hakkosha Co., Ltd. | Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62146606A (en) | 1987-06-30 |
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