JPH02140851U - - Google Patents

Info

Publication number

JPH02140851U

JPH02140851U JP4893389U JP4893389U JPH02140851U JP H02140851 U JPH02140851 U JP H02140851U JP 4893389 U JP4893389 U JP 4893389U JP 4893389 U JP4893389 U JP 4893389U JP H02140851 U JPH02140851 U JP H02140851U

Authority

JP

Japan

Prior art keywords

etched

wafer process

protective film

manufacturing process

layer

Prior art date

1989-04-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 239000013078 crystal Substances 0.000 claims description 5
• 230000007547 defect Effects 0.000 claims description 5
• 238000002161 passivation Methods 0.000 claims description 3
• 238000000034 method Methods 0.000 claims 4
• 238000004519 manufacturing process Methods 0.000 claims 2
• 230000001681 protective effect Effects 0.000 claims 2
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
• 238000005530 etching Methods 0.000 claims 1
• 238000011156 evaluation Methods 0.000 claims 1
• 239000004065 semiconductor Substances 0.000 claims 1
• 229910052710 silicon Inorganic materials 0.000 claims 1
• 239000010703 silicon Substances 0.000 claims 1
• 238000009792 diffusion process Methods 0.000 description 4
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
• 229910052681 coesite Inorganic materials 0.000 description 1
• 229910052906 cristobalite Inorganic materials 0.000 description 1
• 238000002955 isolation Methods 0.000 description 1
• 239000000377 silicon dioxide Substances 0.000 description 1
• 235000012239 silicon dioxide Nutrition 0.000 description 1
• 229910052682 stishovite Inorganic materials 0.000 description 1
• 229910052905 tridymite Inorganic materials 0.000 description 1