JPH02140844U - - Google Patents
Info
- Publication number
- JPH02140844U JPH02140844U JP4909289U JP4909289U JPH02140844U JP H02140844 U JPH02140844 U JP H02140844U JP 4909289 U JP4909289 U JP 4909289U JP 4909289 U JP4909289 U JP 4909289U JP H02140844 U JPH02140844 U JP H02140844U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- pellet
- back surface
- pellets
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4909289U JPH02140844U (enrdf_load_stackoverflow) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4909289U JPH02140844U (enrdf_load_stackoverflow) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140844U true JPH02140844U (enrdf_load_stackoverflow) | 1990-11-26 |
Family
ID=31566489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4909289U Pending JPH02140844U (enrdf_load_stackoverflow) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140844U (enrdf_load_stackoverflow) |
-
1989
- 1989-04-25 JP JP4909289U patent/JPH02140844U/ja active Pending