JPH02140674A - Lead bending preventive mechanism - Google Patents

Abstract

PURPOSE:To correct the misalignment, and also, to contrive the decrease of a rate of generation of lead bending of a mold IC by receiving temporarily the mold IC by a mold IC receiving table, pushing it in vertically and bringing it into contact with a contact. CONSTITUTION:A mold IC 8 contains X, Y and Q and a shift of one side-down generated by a pocket of a pallet, and adsorbed and brought to feed material by a holding and carrying mechanism 9. This IC 8 is dropped down by dead weight due to a fact that the adsorption of the mechanism 9 is cut, and held horizontally on a mold IC receiving table 6 of a method by which a mold IC lead does not hit against a guide 7 integrated into a socket 1. When the mechanism 9 holds down the IC 8 by stronger force than that of a spring 5 in order to feed a material until the IC 8 is brought into contact with a contact 2 of the socket 1 from this state, the IC 8 descends vertically in a state held horizontally together with the receiving table 6, and is brought into contact with the contact 2 and is brought to feed material.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] In the electrical property test after molding of 1C, it can be used as a socket which is a jig to be attached to a test device.

[Prior art] A conventional socket has a socket guide and a contactor.
He was receiving the lead directly from the opponent.

[Problems to be Solved by the Invention] The final usage form of molded ICs is board mounting. In board mounting, the foot surroundings of molds and IC leads are a major cause of mounting defects, especially in multi-bin molds and ICs. One of the causes of this mold/IC lead bending is that the method of supplying the mold/IC to the socket during the electrical characteristic measurement process has been changed to compensate for misalignment between the socket and the mold/IC, and to improve cycle time. Includes: On the other hand, molded IC leads are extremely susceptible to external stress and have a high incidence of lead bending in the drop-in method. Therefore, an object of the present invention is to make it possible to correct positional deviations without reducing cycle time, and to reduce the incidence of mold/IC lead bending.

[Measures for solving the problem 1] The mold/IC is handled in the socket using the conventional drop-in method, and at this time, a vertically movable device with a built-in spring is used to prevent the mold/IC lead from directly touching the contact. Mold/IC lead can be placed in a mold/IC holder with dimensions that prevent it from coming into direct contact with the mold/IC lead.
The problem was solved by once receiving the IC and bringing it into contact with the contact by being pushed vertically.

[Implementation Example 1] An embodiment of the present invention will be described below using FIG.

The socket l includes a spring bearing 3 that holds a spring 5 and incorporates a mold/IC holder 6 having a hollow cylindrical shaft via a stopper pin 4, and a guide 7 that has a socket wider than the pocket of the pallet. It is. First, the mold C8, including the X, Y, Q and column down deviations caused in the pockets of the pallet, is adsorbed and fed by the presser transport mechanism 9. This mold IC8
When the suction of the presser transfer mechanism 9 is cut off, the mold I falls under its own weight, and the mold I is sized so that the guide 7 built into the socket I and the mold IC lead do not come into contact with each other.
It is held horizontally on the mold/IC holder 6 by the C holder 6. From this state, insert the mold/IC8 into socket 1.
In order to feed the material until it contacts the contact 2 of
When the mold/IC 8 is pressed down with a force stronger than the sub-Jing 5, the mold/IC 8 is vertically lowered together with the mold/IC holder 6 while being kept horizontally, and is brought into contact with the contactor 2 for material supply. I can do it.

〔Effect of the invention〕

Prevention of lead bending of the present invention! Depending on the side, the mold
The IC suction transport is carried on the side of the rock, so even if the IC is dropped and stored in the socket with its posture deformed, the posture can be corrected as before.
We were able to reduce the incidence of mold and IC lead bending when dropped.

[Brief explanation of the drawing]

FIG. 1 shows a cross-sectional view of an embodiment of the lead bending prevention mechanism of the present invention.・Socket contactor ・Spring bearing ・Block pin ・Spring ・Mold ・IC holder ・Guide ・Mold ・IC ・Presser transfer I! Mizo Applicant Seiko Epson Co., Ltd. Agent Patent Attorney Masayoshi Kamiyanagi (and 1 other person) Figure 1

Claims (1)

[Claims] In the process of measuring the electrical characteristics of a mold/IC, in the workpiece accommodation mechanism of a jig (hereinafter referred to as a socket) that has contacts for accommodating and measuring the mold/IC as a workpiece, the elasticity located at a position higher than the contact surface is used. It consists of a workpiece holder with a built-in spring and a guide with a tapered socket.The holder receives and holds the workpiece regardless of the state of the workpiece falling, thereby preventing the workpiece lead from bending due to the workpiece falling. A lead bending prevention mechanism characterized by preventing lead bending and being accommodated in a socket.