JPH02138466U - - Google Patents
Info
- Publication number
- JPH02138466U JPH02138466U JP4760389U JP4760389U JPH02138466U JP H02138466 U JPH02138466 U JP H02138466U JP 4760389 U JP4760389 U JP 4760389U JP 4760389 U JP4760389 U JP 4760389U JP H02138466 U JPH02138466 U JP H02138466U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- thickness direction
- soldering
- bent portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4760389U JPH02138466U (xx) | 1989-04-21 | 1989-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4760389U JPH02138466U (xx) | 1989-04-21 | 1989-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138466U true JPH02138466U (xx) | 1990-11-19 |
Family
ID=31563676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4760389U Pending JPH02138466U (xx) | 1989-04-21 | 1989-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138466U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266179A (ja) * | 2006-03-28 | 2007-10-11 | Seiko Epson Corp | ヒートシンク |
-
1989
- 1989-04-21 JP JP4760389U patent/JPH02138466U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266179A (ja) * | 2006-03-28 | 2007-10-11 | Seiko Epson Corp | ヒートシンク |
| JP4666165B2 (ja) * | 2006-03-28 | 2011-04-06 | セイコーエプソン株式会社 | ヒートシンク |