JPH02138440U - - Google Patents

Info

Publication number
JPH02138440U
JPH02138440U JP4622089U JP4622089U JPH02138440U JP H02138440 U JPH02138440 U JP H02138440U JP 4622089 U JP4622089 U JP 4622089U JP 4622089 U JP4622089 U JP 4622089U JP H02138440 U JPH02138440 U JP H02138440U
Authority
JP
Japan
Prior art keywords
metal bellows
sealed space
metal
lead terminal
lower plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4622089U
Other languages
Japanese (ja)
Other versions
JPH06829Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4622089U priority Critical patent/JPH06829Y2/en
Publication of JPH02138440U publication Critical patent/JPH02138440U/ja
Application granted granted Critical
Publication of JPH06829Y2 publication Critical patent/JPH06829Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のベローズ型ヒートシンクデバ
イスの一実施例を示す断面斜視図、第2図は同じ
く作用説明図、第3図は従来のヒートシンクの一
例を示す斜視図である。 1……金属ベローズ、3……低板、5……密封
空間、6……金属メツシユ筒、7……冷媒液、8
……半導体デバイス、9……リード端子。
FIG. 1 is a cross-sectional perspective view showing an embodiment of the bellows type heat sink device of the present invention, FIG. 2 is an explanatory view of the same operation, and FIG. 3 is a perspective view showing an example of a conventional heat sink. 1... Metal bellows, 3... Low plate, 5... Sealed space, 6... Metal mesh cylinder, 7... Refrigerant liquid, 8
...Semiconductor device, 9...Lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 低板にリード端子を有する金属ベローズと、こ
の金属ベローズ内の密封空間に挿設固定した金属
メツシユ筒と、前記金属ベローズ内の密封空間に
封入した適量の冷媒液とを有し、発熱半導体デバ
イスが、前記密封空間下部にあつて前記金属メツ
シユ筒の内側に位置して前記金属ベローズの低板
に固定され、前記リード端子に接続されてなるこ
とを特徴とするベローズ式ヒートシンクデバイス
A heat generating semiconductor device comprising a metal bellows having a lead terminal on a lower plate, a metal mesh tube inserted and fixed in a sealed space within the metal bellows, and an appropriate amount of refrigerant liquid sealed in a sealed space within the metal bellows. is located at the bottom of the sealed space and inside the metal mesh tube, is fixed to the lower plate of the metal bellows, and is connected to the lead terminal.
JP4622089U 1989-04-21 1989-04-21 Bellows type heat sink device Expired - Lifetime JPH06829Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4622089U JPH06829Y2 (en) 1989-04-21 1989-04-21 Bellows type heat sink device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4622089U JPH06829Y2 (en) 1989-04-21 1989-04-21 Bellows type heat sink device

Publications (2)

Publication Number Publication Date
JPH02138440U true JPH02138440U (en) 1990-11-19
JPH06829Y2 JPH06829Y2 (en) 1994-01-05

Family

ID=31561110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4622089U Expired - Lifetime JPH06829Y2 (en) 1989-04-21 1989-04-21 Bellows type heat sink device

Country Status (1)

Country Link
JP (1) JPH06829Y2 (en)

Also Published As

Publication number Publication date
JPH06829Y2 (en) 1994-01-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term