JPH01123354U - - Google Patents
Info
- Publication number
- JPH01123354U JPH01123354U JP1930488U JP1930488U JPH01123354U JP H01123354 U JPH01123354 U JP H01123354U JP 1930488 U JP1930488 U JP 1930488U JP 1930488 U JP1930488 U JP 1930488U JP H01123354 U JPH01123354 U JP H01123354U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- peltier element
- terminal
- electrode
- conduction path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す斜視図、第２
図は上記実施例の使用態様を表した断面図、第３
図はペルチエ素子の原理を示した模式図、第４図
は従来のペルチエ素子を示した断面図、第５図は
従来のペルチエ素子の一使用態様を表した断面図
、第６図は従来のペルチエ素子の他の使用態様を
表した断面図である。
１ｅ…吸熱体、１ｆ…放熱体、１０…ペルチエ
素子、１１…素子本体、１２…電極用端子、１３
…熱伝導路用端子。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view showing how the above embodiment is used.
The figure is a schematic diagram showing the principle of a Peltier element, Figure 4 is a cross-sectional view showing a conventional Peltier element, Figure 5 is a cross-sectional view showing one usage mode of a conventional Peltier element, and Figure 6 is a cross-sectional view of a conventional Peltier element. FIG. 7 is a cross-sectional view showing another usage mode of the Peltier element. 1e... Heat absorber, 1f... Heat sink, 10... Peltier element, 11... Element body, 12... Electrode terminal, 13
...Terminal for thermal conduction path.
Claims (1)
へ熱伝導を行なう半導体を有するペルチエ素子に
おいて、前記放熱体から熱伝導路用端子が延設さ
れるとともに前記熱伝導路用端子に前記電極用の
端子が並列して設けられたことを特徴とするペル
チエ素子。 In a Peltier element having a semiconductor that conducts heat from a heat absorber to a heat radiator in response to the application of a voltage to an electrode, a terminal for a heat conduction path extends from the heat radiator, and the electrode is connected to the terminal for a heat conduction path. A Peltier element characterized by having terminals arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1930488U JPH01123354U (en) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1930488U JPH01123354U (en) | 1988-02-18 | 1988-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123354U true JPH01123354U (en) | 1989-08-22 |
Family
ID=31234694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1930488U Pending JPH01123354U (en) | 1988-02-18 | 1988-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123354U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006242455A (en) * | 2005-03-02 | 2006-09-14 | Ishikawajima Harima Heavy Ind Co Ltd | Cooling method and device |
| JP2011005479A (en) * | 2010-02-23 | 2011-01-13 | Panasonic Electric Works Co Ltd | Electrostatic atomizer and method of manufacturing the same and peltier unit |
| JP2015529964A (en) * | 2013-04-22 | 2015-10-08 | ▲華▼▲為▼▲終▼端有限公司 | Device for preventing deformation of communication card |
-
1988
- 1988-02-18 JP JP1930488U patent/JPH01123354U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006242455A (en) * | 2005-03-02 | 2006-09-14 | Ishikawajima Harima Heavy Ind Co Ltd | Cooling method and device |
| JP4639850B2 (en) * | 2005-03-02 | 2011-02-23 | 株式会社Ｉｈｉ | Cooling method and apparatus |
| JP2011005479A (en) * | 2010-02-23 | 2011-01-13 | Panasonic Electric Works Co Ltd | Electrostatic atomizer and method of manufacturing the same and peltier unit |
| JP2015529964A (en) * | 2013-04-22 | 2015-10-08 | ▲華▼▲為▼▲終▼端有限公司 | Device for preventing deformation of communication card |