JPH02138430U - - Google Patents

Info

Publication number
JPH02138430U
JPH02138430U JP4694789U JP4694789U JPH02138430U JP H02138430 U JPH02138430 U JP H02138430U JP 4694789 U JP4694789 U JP 4694789U JP 4694789 U JP4694789 U JP 4694789U JP H02138430 U JPH02138430 U JP H02138430U
Authority
JP
Japan
Prior art keywords
holder
transfer element
transfer
vertical shaft
pivoted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4694789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4694789U priority Critical patent/JPH02138430U/ja
Publication of JPH02138430U publication Critical patent/JPH02138430U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP4694789U 1989-04-20 1989-04-20 Pending JPH02138430U (ar)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4694789U JPH02138430U (ar) 1989-04-20 1989-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4694789U JPH02138430U (ar) 1989-04-20 1989-04-20

Publications (1)

Publication Number Publication Date
JPH02138430U true JPH02138430U (ar) 1990-11-19

Family

ID=31562457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4694789U Pending JPH02138430U (ar) 1989-04-20 1989-04-20

Country Status (1)

Country Link
JP (1) JPH02138430U (ar)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04105537U (ja) * 1991-02-19 1992-09-10 三菱電機株式会社 ダイボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04105537U (ja) * 1991-02-19 1992-09-10 三菱電機株式会社 ダイボンデイング装置

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