JPH0213770U - - Google Patents

Info

Publication number
JPH0213770U
JPH0213770U JP9193888U JP9193888U JPH0213770U JP H0213770 U JPH0213770 U JP H0213770U JP 9193888 U JP9193888 U JP 9193888U JP 9193888 U JP9193888 U JP 9193888U JP H0213770 U JPH0213770 U JP H0213770U
Authority
JP
Japan
Prior art keywords
heating
wiring board
printed wiring
land
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9193888U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9193888U priority Critical patent/JPH0213770U/ja
Publication of JPH0213770U publication Critical patent/JPH0213770U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9193888U 1988-07-13 1988-07-13 Pending JPH0213770U (US06724976-20040420-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9193888U JPH0213770U (US06724976-20040420-M00002.png) 1988-07-13 1988-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9193888U JPH0213770U (US06724976-20040420-M00002.png) 1988-07-13 1988-07-13

Publications (1)

Publication Number Publication Date
JPH0213770U true JPH0213770U (US06724976-20040420-M00002.png) 1990-01-29

Family

ID=31316395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9193888U Pending JPH0213770U (US06724976-20040420-M00002.png) 1988-07-13 1988-07-13

Country Status (1)

Country Link
JP (1) JPH0213770U (US06724976-20040420-M00002.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351845A (ja) * 2005-06-16 2006-12-28 Nissan Motor Co Ltd 電子部品実装用基板及び実装方法並びに装置
JP2007042995A (ja) * 2005-08-05 2007-02-15 Panasonic Ev Energy Co Ltd プリント配線板とその半田付け方法及び装置
JP2008533744A (ja) * 2005-03-15 2008-08-21 メドコンクス, インコーポレイテッド マイクロ半田ポット
US10299387B2 (en) 2017-05-23 2019-05-21 Fujitsu Limited Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008533744A (ja) * 2005-03-15 2008-08-21 メドコンクス, インコーポレイテッド マイクロ半田ポット
JP2006351845A (ja) * 2005-06-16 2006-12-28 Nissan Motor Co Ltd 電子部品実装用基板及び実装方法並びに装置
JP4639353B2 (ja) * 2005-06-16 2011-02-23 日産自動車株式会社 電子部品実装用基板及び実装方法並びに装置
JP2007042995A (ja) * 2005-08-05 2007-02-15 Panasonic Ev Energy Co Ltd プリント配線板とその半田付け方法及び装置
JP4580839B2 (ja) * 2005-08-05 2010-11-17 プライムアースEvエナジー株式会社 プリント配線板
US10299387B2 (en) 2017-05-23 2019-05-21 Fujitsu Limited Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

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