JPH0213735U - - Google Patents
Info
- Publication number
- JPH0213735U JPH0213735U JP9155988U JP9155988U JPH0213735U JP H0213735 U JPH0213735 U JP H0213735U JP 9155988 U JP9155988 U JP 9155988U JP 9155988 U JP9155988 U JP 9155988U JP H0213735 U JPH0213735 U JP H0213735U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- package
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011247 coating layer Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の一実施例の正面図である。
１…パツケージ、２…金属製リード、３…塗布
層、４…プリント基板、４ａ…ランド。
層、４…プリント基板、４ａ…ランド。
Claims (1)
- 樹脂製のパツケージを有し、かつプリント基板
等に半田リフロー等により半田付けする電子部品
において、前記パツケージには、プリント基板に
対向する側と反対側の面に、銀色の塗料を塗布し
た塗布層を形成したことを特徴とする電子部品。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155988U JPH0213735U (ja) | 1988-07-11 | 1988-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155988U JPH0213735U (ja) | 1988-07-11 | 1988-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213735U true JPH0213735U (ja) | 1990-01-29 |
Family
ID=31316031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9155988U Pending JPH0213735U (ja) | 1988-07-11 | 1988-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213735U (ja) |
-
1988
- 1988-07-11 JP JP9155988U patent/JPH0213735U/ja active Pending