JPH02136361U - - Google Patents
Info
- Publication number
- JPH02136361U JPH02136361U JP4669089U JP4669089U JPH02136361U JP H02136361 U JPH02136361 U JP H02136361U JP 4669089 U JP4669089 U JP 4669089U JP 4669089 U JP4669089 U JP 4669089U JP H02136361 U JPH02136361 U JP H02136361U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- lands
- covered
- resist layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005192 partition Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4669089U JPH02136361U (is) | 1989-04-19 | 1989-04-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4669089U JPH02136361U (is) | 1989-04-19 | 1989-04-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02136361U true JPH02136361U (is) | 1990-11-14 |
Family
ID=31561989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4669089U Pending JPH02136361U (is) | 1989-04-19 | 1989-04-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02136361U (is) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5593294A (en) * | 1979-01-05 | 1980-07-15 | Matsushita Electric Ind Co Ltd | Reflow soldering method |
JPS6435982A (en) * | 1987-07-30 | 1989-02-07 | Ibiden Co Ltd | Printed wiring board for surface mounting |
-
1989
- 1989-04-19 JP JP4669089U patent/JPH02136361U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5593294A (en) * | 1979-01-05 | 1980-07-15 | Matsushita Electric Ind Co Ltd | Reflow soldering method |
JPS6435982A (en) * | 1987-07-30 | 1989-02-07 | Ibiden Co Ltd | Printed wiring board for surface mounting |