JPH02135177A - Method for supplying sticky material - Google Patents
Method for supplying sticky materialInfo
- Publication number
- JPH02135177A JPH02135177A JP29043588A JP29043588A JPH02135177A JP H02135177 A JPH02135177 A JP H02135177A JP 29043588 A JP29043588 A JP 29043588A JP 29043588 A JP29043588 A JP 29043588A JP H02135177 A JPH02135177 A JP H02135177A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- substrate
- height
- adhesive substance
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims description 36
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 230000001174 ascending effect Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
０）産業上の利用分野
本発明は、電子部品等を基板に固着する粘着性物質の供
給方法に関する。DETAILED DESCRIPTION OF THE INVENTION 0) Industrial Application Field The present invention relates to a method for supplying an adhesive substance for fixing electronic components and the like to a substrate.
（ロ）従来の技術
半田クリームや接着剤等の粘着性物質により電子部品等
を基板に固着するにあたり、粘着性物質の供給の安定化
を図るため、従来から様々な工夫がなされてきた。特開
昭６１−２８５０７５号公報記載の装置では、ディペン
サヘッドを粘着性△
物質塗布面の垂直方向から５度乃至４０度傾斜させて吐
出することにより所定量の粘着性物質の供給を図ってい
る。また実開昭６８−５５４７０号公報記載の装置では
、ディスペンサのノズルに切換バルブを付属させ、所定
圧力の圧縮空気を供給して接着剤をノズルから押し出し
たり、ノズル内の空気を吸引したりして接着剤がノズル
から垂れ落ちるのを防止し、接着剤の供給の安定を図っ
ている。(B) Conventional Technology When attaching electronic components to a board using adhesive substances such as solder cream and adhesives, various efforts have been made to stabilize the supply of the adhesive substance. In the apparatus described in JP-A No. 61-285075, a predetermined amount of a sticky substance is supplied by dispensing the dispenser head at an angle of 5 to 40 degrees from the perpendicular direction of the surface on which the sticky substance is applied. There is. Furthermore, in the device described in Japanese Utility Model Application Publication No. 68-55470, a switching valve is attached to the nozzle of the dispenser, and compressed air at a predetermined pressure is supplied to push out the adhesive from the nozzle or to suck the air inside the nozzle. This prevents the adhesive from dripping from the nozzle and stabilizes the adhesive supply.
ｅ）発明が解決しようとする課題
上記２例の装置は、いずれも粘着性物質の糸引き防止に
ついての考慮が払われていない。またこれらの装置では
、ディスペンサノズルを基板から一定の高さに保ってお
いて粘着性物質を吐出するため、供給量が多量となった
場合、ノズル先端部が粘着性物質に漬かった状態になり
、ノズル側面に粘着性物質が付着し、糸引きが釦生じや
すくなる。ノズル側面に付着した粘着性物質が固まると
ノズル直径が増大したのと実質的に同じことになり、意
図しない個所にまで粘着性物質を塗り広げるといった事
態を招く。しかも、ノズルと基板の間の空間を粘着性物
質が満たすと、こｎがそれ以後の粘着性物質の吐出を妨
げ、供給量が不安定となる。本発明はこれらの点に鑑み
なされたもので、粘着性物質の糸引きを防ぎ、安定した
塗イ１状態を確保できる装置を提供しようとするもので
ある。e) Problems to be Solved by the Invention In both of the above two examples of devices, no consideration is given to preventing the sticky substance from becoming stringy. Additionally, in these devices, the dispenser nozzle is kept at a constant height from the substrate and the adhesive substance is discharged, so if a large amount is supplied, the tip of the nozzle may become immersed in the adhesive substance. , a sticky substance adheres to the side of the nozzle, making the button more likely to become stringy. When the sticky substance attached to the side surface of the nozzle hardens, this is essentially the same as increasing the nozzle diameter, leading to a situation where the sticky substance spreads to unintended areas. Moreover, if the adhesive substance fills the space between the nozzle and the substrate, this will prevent the adhesive from being discharged thereafter, making the supply amount unstable. The present invention has been made in view of these points, and it is an object of the present invention to provide an apparatus that can prevent the sticky substance from becoming stringy and ensure a stable coating state.
に）課題を解決するための手段
本発明では、ディスペンサのノスルより粘着性物質を基
板の所定の位置に吐出するものにおいて、次の工程を順
次遂行させる。B) Means for Solving the Problems According to the present invention, in a device for discharging a sticky substance from a dispenser nozzle to a predetermined position on a substrate, the following steps are carried out in sequence.
Ａ、基板にノズルを接近させて粘着性物質の吐出を開始
し、吐出を続行しつつノズルを所定高さまで引き上げる
工程。A. A step in which the nozzle is brought close to the substrate to begin discharging the adhesive substance, and the nozzle is raised to a predetermined height while continuing dispensing.
Ｂ、ノズルが所定高さまで上昇したところでそのノズル
高さを維持しつつ粘着性？Ｉｔの吐出を所定時間続行す
る工程。B. When the nozzle rises to a predetermined height, is it sticky while maintaining that nozzle height? A step of continuing to discharge It for a predetermined period of time.
Ｃ，ノズルを更に所定高さ上昇させ、基板に付着した粘
着性物質とノズル内の粘着性物質を切断すると共に、そ
のノズル高さを所定時間維持して、各々の側で粘着性物
質の凝集を進行させる工程。C. Raise the nozzle further to a predetermined height to cut the sticky substance adhering to the substrate and the sticky substance inside the nozzle, and maintain the nozzle height for a predetermined time to allow the sticky substance to coagulate on each side. The process of advancing.
Ｄ、ノズルを更に引き上げ、基板に対し相対的に移動さ
せる工程。D. Step of further lifting the nozzle and moving it relative to the substrate.
（ホ）作用
上述した工程を順次遂行することにより、ノズル側面へ
の粘着性物質の付着を防ぎ、粘着性物質の糸引きを防止
して、粘着性物質の供給を常に満足できる状態で遂行す
ることができる。(E) Effect: By performing the above-mentioned steps in sequence, the adhesion of the adhesive substance to the side of the nozzle is prevented, the stringiness of the adhesive substance is prevented, and the supply of the adhesive substance is always carried out in a satisfactory state. be able to.
（へ）１ 実施例
第１図にディスペンサ１の構造を示す。−本実施例では
粘着性物質をクリーム状半田とする。２はベースで、ベ
ース２の上面にはレール取付部材４が垂直に伸びており
、レール取付部材４に沿うようにレール５が取付けらｎ
る。レール取付部材４の上方には取付デツキ６かベース
２と平行するように取付けられ、その先端には送りネジ
７か圭偵且つ回動自在に保持さｒしる。送りネジ７の他
端は、ベース２の上に取付けられた軸受部材８を介して
、ベース２の内部空間１１に入り込み、ここにプーリ９
が固着される。プーリ９と、送りネジ７のｌ＜ ｌ＋源
となる図示しないモータｑ）シャフトと１７）闇にはベ
ルト１０が掛は渡されて両者を連結する。ベース２は図
示しないＸ−Ｙテーブルに支持さｎており、これにより
ディスペンサ１は水平方向の動き得るものである。１４
は昇降腕で、一端はレール５に取付けられたスライダ１
２に連結し、中間部には送りネジ７と螺合する昇降ブロ
ック１３が結合している。昇降腕１４の他端には、側面
箔状３学形のフレーム１５が取付けられ、フレーム１５
の上下の張出部にガイドロッド１６を掛は渡す。ガイド
ロッド１６には第１スライドブロツク１７が上下自在に
取付けられ、第１スライドブロツク１７は下方よりバ卑
１８で上向きに付勢されている。１９はストッパボルト
で、スライドブロック１７を適度な高さで受は止める。(f)1 Embodiment FIG. 1 shows the structure of a dispenser 1. - In this embodiment, the sticky substance is creamy solder. 2 is a base, a rail mounting member 4 extends vertically on the upper surface of the base 2, and a rail 5 is mounted along the rail mounting member 4.
Ru. A mounting deck 6 is mounted above the rail mounting member 4 so as to be parallel to the base 2, and a feed screw 7 is rotatably held at the tip of the mounting deck 6. The other end of the feed screw 7 enters the internal space 11 of the base 2 via a bearing member 8 mounted on the base 2, and a pulley 9 is inserted therein.
is fixed. A belt 10 is passed between the pulley 9, a motor q) shaft (not shown) which serves as the source of the feed screw 7, and a belt 10 connecting the two. The base 2 is supported by an X-Y table (not shown), which allows the dispenser 1 to move in the horizontal direction. 14
is a lifting arm, and one end is a slider 1 attached to a rail 5.
2, and a lifting block 13 screwed into the feed screw 7 is connected to the intermediate portion. A frame 15 having a foil-like three-dimensional shape on the side is attached to the other end of the lifting arm 14.
A guide rod 16 is passed over the upper and lower overhangs. A first slide block 17 is attached to the guide rod 16 so as to be vertically movable, and the first slide block 17 is urged upward by a base 18 from below. 19 is a stopper bolt that stops the slide block 17 at an appropriate height.
第１スライドブロツク１７はスライダ２ｏを支持し、ス
ライダ２０には第２スライドブロツク２１が取付けられ
る。第２スライドブロツク２１はスライド方向と平行す
るｔａ穴を有し、この賃逆穴にディスペンサシリンジ２
２を嵌合している。ディスペンサシリンジ２２は、先端
のノズル２３からクリーム状半田を小歌ずつプリント基
板２４に吐出する。The first slide block 17 supports a slider 2o, and a second slide block 21 is attached to the slider 20. The second slide block 21 has a Ta hole parallel to the sliding direction, and the dispenser syringe 2 is inserted into this hole.
2 are fitted. The dispenser syringe 22 discharges creamy solder onto the printed circuit board 24 little by little from a nozzle 23 at its tip.
２５は基板２４を支持するガイドレールである。25 is a guide rail that supports the board 24.
次にノズル２３の動作につき第２図乃至第６図に基づき
説明する。まずＸ−Ｙテーブルが移動してディスペンサ
ｌを水平移動させ、基板２４上の所定の位置にノズル２
３を位置決めする。次に、送りネジ７の回転により昇降
腕１４を下降させ、ノズル２３を基板２４に対し所定距
離まで接近させる。ここでディスペンサシリンジ２２の
内部圧力が上昇し、ノズル２３はクリーム状半田２６を
吐出し始める（第２図）。同時に昇降腕１４が上昇を開
始し、クリーム状半田２６の吐出を続行させつつ、第３
図のように所定高さまでノズル２３を引き上げる１、ノ
ズル２３が所定高さまで上昇したところでそのノズル高
さを維持しつつクリーム状半田２６の吐出を所定時間続
行する。クリーム状半田２６の供給量が所定値に達した
ところでその吐出を打ち切り、第４図のようにノズル２
３を更に所定高さ上昇させる。これにより基板２４に付
着したクリーム状半田２６とノズル２３側のクリーム状
半田２６を切断し、そのままの高さで、互いの側におい
てクリーム状半田２６の凝集が進行するのを待つ。糸引
き都が凝集したところで、第５図のようにノズル２３を
更に上昇させる。この段階でノズル２３と基板２４の間
に糸引き部が残っていたとしても、それは極く細くなっ
ており、クリーム状半田２６の付着スポット外に倒れて
はみ出しを生ずるといったことはない。それから、Ｘ−
Ｙ、テーブルを次にクリーム状半田２６を塗布する位置
に移動させるものである。Next, the operation of the nozzle 23 will be explained based on FIGS. 2 to 6. First, the X-Y table moves to move the dispenser l horizontally, and the nozzle 2 is placed at a predetermined position on the board 24.
Position 3. Next, the elevating arm 14 is lowered by rotation of the feed screw 7, and the nozzle 23 is brought close to the substrate 24 to a predetermined distance. At this point, the internal pressure of the dispenser syringe 22 increases, and the nozzle 23 begins to discharge creamy solder 26 (FIG. 2). At the same time, the elevating arm 14 starts to rise, and while continuing to discharge the creamy solder 26, the third
As shown in the figure, the nozzle 23 is pulled up to a predetermined height (1).Once the nozzle 23 has been raised to a predetermined height, the cream solder 26 is continued to be discharged for a predetermined time while maintaining the nozzle height. When the supply amount of the creamy solder 26 reaches a predetermined value, the discharge is stopped and the nozzle 2 is opened as shown in FIG.
3 is further raised to a predetermined height. This cuts the creamy solder 26 adhering to the substrate 24 and the creamy solder 26 on the nozzle 23 side, and waits for the creamy solder 26 to coagulate on both sides at the same height. When the stringing capital has aggregated, the nozzle 23 is further raised as shown in FIG. Even if a threaded portion remains between the nozzle 23 and the substrate 24 at this stage, it is extremely thin and will not fall outside the spot where the creamy solder 26 is attached, causing any protrusion. Then, X-
Y, the table is moved to the position where creamy solder 26 will be applied next.
第６図は時間の経過とノズル２３の高さ変化を関連づけ
て示した動作チャートで、図中Ａ点は第２図の状態、Ｂ
点は第３図の状態、Ｃ点は第４図の状態、Ｄ点は第５図
の状態にそれぞれ対応するものである。なお実際の使用
例では、基板上に直径Ｑ、ｇｍｍのスポットを生じるよ
う之リーム状半田を供給するものとし、基板面からＡ点
までの距離を０．２ｍｍ１同じくＢ点までの距離をＱ、
３ｍｍ。FIG. 6 is an operation chart showing the relationship between the passage of time and the change in the height of the nozzle 23. In the figure, point A is in the state shown in FIG.
Point C corresponds to the state shown in FIG. 3, point C corresponds to the state shown in FIG. 4, and point D corresponds to the state shown in FIG. 5. In the actual usage example, a ream-shaped solder is supplied to produce a spot with a diameter of Q and gmm on the board, and the distance from the board surface to point A is 0.2 mm, and the distance to point B is Q,
3mm.
同じくＣ点までの距離を３． ５ｍｍ、同じくＤ点まで
の距離を４．Ｑ＋ｎｍ、吐出時間を０．１秒、安定時間
を０．１５秒の設定で良好な結果を得ることができた。Similarly, the distance to point C is 3. 5mm, and the distance to point D is 4. Good results were obtained by setting Q+nm, ejection time to 0.1 seconds, and stabilization time to 0.15 seconds.
（ト）発明の効果
本発明によれば、ノズルを上昇させながら粘着性物質を
吐出することにより、ノズル先端部が粘着性物質に漬か
ることを防ぎ、ノズル側面に粘着性物質が付着すること
による悪影響を排除できる。またノズルと基板の間の空
間に粘着性物質があふれるにつれノズルが上昇し、間隔
を広げるので、先に吐出された粘着性物質によりそれ以
後の吐出が妨げられることがなく、規定の分量の供給を
常に確保できる。しかも、吐出終了後ノズルを一旦引き
上げ、その高さを維持して引きちぎられた粘着性物質が
凝集するのを待ち、更にその後もう一度ノズルを引き上
げて糸引き部の切断を完全なものにするから、ノズルの
水平移動に伴ない糸引き部が横になびいて余分なはみ出
しを生じるといったことがない。(G) Effects of the Invention According to the present invention, by ejecting the adhesive substance while raising the nozzle, the tip of the nozzle is prevented from being immersed in the adhesive substance, and the adhesive substance is prevented from adhering to the side surface of the nozzle. Negative effects can be eliminated. In addition, as the adhesive substance overflows into the space between the nozzle and the substrate, the nozzle rises and widens the gap, so subsequent discharges are not hindered by the previously discharged adhesive substance, and the specified amount is supplied. can always be ensured. Moreover, once the nozzle is finished discharging, the nozzle is pulled up once, maintaining that height and waiting for the torn sticky substance to coagulate, and then the nozzle is pulled up again to completely cut the threaded part. As the nozzle moves horizontally, the thread pulling section does not flutter sideways and cause excessive protrusion.
図は本発明の一実施例を示し、第１図は粘着性物質塗布
装置の部分断面側面図、第２図乃至第５図は塗布ノズル
の一連の動作を説明する動作説明図、第６図は塗布ノズ
ルの動きを示す動作チャートである。
１・・・ディスペンサ、２３・・・ノズル、２４・・・
基板、２６・・・クリーム状半田（粘着性物質）第１図The drawings show an embodiment of the present invention, in which Fig. 1 is a partially sectional side view of an adhesive substance coating device, Figs. 2 to 5 are operation explanatory diagrams explaining a series of operations of the coating nozzle, and Fig. 6 is an operation chart showing the movement of the coating nozzle. 1... Dispenser, 23... Nozzle, 24...
Substrate, 26... Creamy solder (adhesive substance) Figure 1
Claims (1)
定の位置に吐出するものにおいて、次の工程を順次遂行
することを特徴とする粘着性物質供給方法。 Ａ、基板にノズルを接近させて粘着性物質の吐出を開始
し、吐出を続行しつつノズルを所定高さまで引き上げる
工程。 Ｂ、ノズルが所定高さまで上昇したところでそのノズル
高さを維持しつつ粘着性物質の吐出を所定時間続行する
工程。 Ｃ、ノズルを更に所定高さ上昇させ、基板に付着した粘
着性物質とノズル内の粘着性物質を切断すると共に、そ
のノズル高さを所定時間維持して、各々の側で粘着性物
質の凝集を進行させる工程。 Ｄ、ノズルを更に引き上げ、基板に対し相対的に移動さ
せる工程。(1) A method for dispensing a sticky substance from a nozzle of a dispenser to a predetermined position on a substrate, characterized by sequentially performing the following steps. A. A step in which the nozzle is brought close to the substrate to begin discharging the adhesive substance, and the nozzle is raised to a predetermined height while continuing dispensing. B. After the nozzle has risen to a predetermined height, the nozzle height is maintained and the adhesive substance is continued to be ejected for a predetermined period of time. C. The nozzle is further raised to a predetermined height to cut the adhesive substance adhering to the substrate and the adhesive substance inside the nozzle, and the nozzle height is maintained for a predetermined time to allow the adhesive substance to coagulate on each side. The process of advancing. D. Step of further lifting the nozzle and moving it relative to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63290435A JP2654135B2 (en) | 1988-11-16 | 1988-11-16 | Adhesive substance supply method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63290435A JP2654135B2 (en) | 1988-11-16 | 1988-11-16 | Adhesive substance supply method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02135177A true JPH02135177A (en) | 1990-05-24 |
| JP2654135B2 JP2654135B2 (en) | 1997-09-17 |
Family
ID=17755995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63290435A Expired - Fee Related JP2654135B2 (en) | 1988-11-16 | 1988-11-16 | Adhesive substance supply method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2654135B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0256269A (en) * | 1987-10-13 | 1990-02-26 | Mitsubishi Electric Corp | Paste coater |
-
1988
- 1988-11-16 JP JP63290435A patent/JP2654135B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0256269A (en) * | 1987-10-13 | 1990-02-26 | Mitsubishi Electric Corp | Paste coater |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2654135B2 (en) | 1997-09-17 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |