JPH02132970U - - Google Patents
Info
- Publication number
- JPH02132970U JPH02132970U JP4277889U JP4277889U JPH02132970U JP H02132970 U JPH02132970 U JP H02132970U JP 4277889 U JP4277889 U JP 4277889U JP 4277889 U JP4277889 U JP 4277889U JP H02132970 U JPH02132970 U JP H02132970U
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- printed circuit
- engaged
- circuit board
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4277889U JPH02132970U (fi) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4277889U JPH02132970U (fi) | 1989-04-11 | 1989-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132970U true JPH02132970U (fi) | 1990-11-05 |
Family
ID=31554615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4277889U Pending JPH02132970U (fi) | 1989-04-11 | 1989-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132970U (fi) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018032780A (ja) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | 基板セット及び固定用サブ基板 |
| JP2020025012A (ja) * | 2018-08-07 | 2020-02-13 | タイコエレクトロニクスジャパン合同会社 | 端子付き回路基板および回路基板組立体 |
-
1989
- 1989-04-11 JP JP4277889U patent/JPH02132970U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018032780A (ja) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | 基板セット及び固定用サブ基板 |
| JP2020025012A (ja) * | 2018-08-07 | 2020-02-13 | タイコエレクトロニクスジャパン合同会社 | 端子付き回路基板および回路基板組立体 |
| CN112655282A (zh) * | 2018-08-07 | 2021-04-13 | 泰科电子日本合同会社 | 带有端子的电路基板和电路基板组件 |