JPH02132944U - - Google Patents
Info
- Publication number
- JPH02132944U JPH02132944U JP4176489U JP4176489U JPH02132944U JP H02132944 U JPH02132944 U JP H02132944U JP 4176489 U JP4176489 U JP 4176489U JP 4176489 U JP4176489 U JP 4176489U JP H02132944 U JPH02132944 U JP H02132944U
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- mounting hole
- element mounting
- lead frame
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4176489U JPH02132944U (lv) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4176489U JPH02132944U (lv) | 1989-04-10 | 1989-04-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02132944U true JPH02132944U (lv) | 1990-11-05 |
Family
ID=31552712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4176489U Pending JPH02132944U (lv) | 1989-04-10 | 1989-04-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02132944U (lv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020123691A (ja) * | 2019-01-31 | 2020-08-13 | 株式会社三社電機製作所 | 半導体製品 |
-
1989
- 1989-04-10 JP JP4176489U patent/JPH02132944U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020123691A (ja) * | 2019-01-31 | 2020-08-13 | 株式会社三社電機製作所 | 半導体製品 |