JPH02132785A - Connection structure of crimp-style terminal to electric conductor and formation of the terminal - Google Patents
Connection structure of crimp-style terminal to electric conductor and formation of the terminalInfo
- Publication number
- JPH02132785A JPH02132785A JP30230788A JP30230788A JPH02132785A JP H02132785 A JPH02132785 A JP H02132785A JP 30230788 A JP30230788 A JP 30230788A JP 30230788 A JP30230788 A JP 30230788A JP H02132785 A JPH02132785 A JP H02132785A
- Authority
- JP
- Japan
- Prior art keywords
- electric conductor
- solder
- conductor
- connecting portion
- crimp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 74
- 230000015572 biosynthetic process Effects 0.000 title abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- 238000002788 crimping Methods 0.000 claims description 32
- 239000006071 cream Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は圧着端子の導電体圧着部における導電体結合構
造に関し、更に詳し《は信鯨性の高い導電体結合構造を
有する圧着端子に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductor bonding structure in a conductor crimping portion of a crimp terminal, and more particularly relates to a crimp terminal having a conductor bonding structure with high reliability.
従来、圧着端子は、第４図に示すように、接触部１と、
これに連続する導電体圧着部２と、該導電体圧着部２に
連続する被覆加締部３とによって構成される。かかる圧
着端子においては、導電体圧着部２及び被覆加締部３は
、ともに、接触部１に連なる板状体の両側端を上方に屈
折し、更にその端部を内側に湾曲して挾持腕２ａ及び３
ａを構成し、底壁となるもとの板状体と挾持腕２ａ及び
３ａによって、内部にそれぞれたとえば電線Ｗの導電体
４及び電線の被覆５を収容する空間が形成されている。Conventionally, as shown in FIG. 4, a crimp terminal has a contact portion 1,
It is constituted by a conductor crimping part 2 which is continuous to this, and a cover crimping part 3 which is continuous to the conductor crimping part 2. In such a crimp terminal, both the conductor crimping part 2 and the covering crimping part 3 are formed by bending both ends of the plate-shaped body connected to the contact part 1 upward, and further curving the ends inward to form a clamping arm. 2a and 3
The original plate-shaped body forming the bottom wall and the clamping arms 2a and 3a form a space therein for accommodating, for example, the conductor 4 of the electric wire W and the sheath 5 of the electric wire, respectively.
以上のように構成された圧着端子は、導電体圧着部２に
被覆５を除去した導電体４が、また被覆加締部３に被覆
５のまま電線Ｗが挿入され、それぞれ挾持腕２ａ及び３
ａを第５図のように上下一対の加締型８，８′を用いて
加締めると、扶持腕２ａは塑性変形して導電体４に密着
し、工具の締付力を除いた後も挾持腕２ａに残留する弾
性力で導電体４に押圧接触する。In the crimp terminal configured as described above, the conductor 4 with the sheath 5 removed is inserted into the conductor crimping part 2, and the electric wire W with the sheath 5 is inserted into the sheath crimping part 3, and the clamping arms 2a and 3 are inserted, respectively.
When a is crimped using a pair of upper and lower crimping dies 8 and 8' as shown in Fig. 5, the supporting arm 2a is plastically deformed and comes into close contact with the conductor 4, even after the tightening force of the tool is removed. The clamping arms 2a are brought into pressure contact with the conductor 4 by the residual elastic force.
この挾持腕２ａの導電体４への押圧接触力が不足すれば
導電体４との接触が不充分となり、導電体圧着部２と導
電体４との間の電気抵抗が増大し、発熱，焼損の事故が
生じたり、或いは、外力によって緩み、または脱落する
などして接続している機器側に誤動作や動作停止を生ず
る原因となるので、圧着部の寸法を厳密に管理する必要
がある。If the pressing contact force of this clamping arm 2a to the conductor 4 is insufficient, the contact with the conductor 4 will be insufficient, and the electrical resistance between the conductor crimping part 2 and the conductor 4 will increase, causing heat generation and burnout. It is necessary to strictly control the dimensions of the crimped part, as this may cause an accident, or it may loosen or fall off due to external force, causing malfunction or stoppage of the connected equipment.
又、導電体４は断面形状が夫々略円形であり、導電体圧
着部２と導電体４との間、および導電体４相互間には多
数の空隙６を生じ、導電体４の外表面と導電体圧着部２
の内側面に酸化皮膜等が発生し、電気抵抗が経時的に増
大し接触不良が発生することがある。又、前記の如く接
触不良によって発熱し、電線（絶縁体部）焼損の可能性
もある。Further, each conductor 4 has a substantially circular cross-sectional shape, and a large number of gaps 6 are formed between the conductor crimped portion 2 and the conductor 4 and between the conductors 4, and the outer surface of the conductor 4 and Conductor crimping part 2
An oxide film or the like may form on the inner surface of the connector, increasing electrical resistance over time and causing poor contact. Furthermore, as mentioned above, heat may be generated due to poor contact, and there is a possibility that the wire (insulator portion) may be burnt out.
このような接触不良の発生を防ぐためにごて或いは半田
溶槽にひたすことにより半田付けを施すことがあるが、
半田付け作業が大がかりとなりその工数が必要となる。In order to prevent such contact failures, soldering is sometimes performed using a soldering iron or by dipping it into a solder bath.
The soldering work becomes extensive and requires many man-hours.
本発明は、かかる問題点を解消して確実な圧着結合を達
成できしかも長期にわたって高信軌性を維持することが
できる圧着端子の導電体結合構造を提供しようとするも
のである。SUMMARY OF THE INVENTION The present invention aims to solve these problems and provide a conductor connection structure for a crimp terminal that can achieve reliable crimp connection and maintain high reliability over a long period of time.
前述の課題を達成できる本発明の圧着端子の導電体結合
構造は、第１図および第２図に示すように、導電体圧着
部２の内側面と電線Ｗの導電体４との前記空隙６（第４
図）に半田クリーム７が溶融固化した状態で充填されて
なる。半田クリーム７に代えて、または半田クリーム７
と併用して通常のフランクス入り半田を用いることもで
きる。As shown in FIGS. 1 and 2, the conductor bonding structure of the crimp terminal of the present invention that can achieve the above-mentioned problems has the above-mentioned gap 6 between the inner surface of the conductor crimping part 2 and the conductor 4 of the electric wire W. (4th
(Fig.) is filled with solder cream 7 in a molten and solidified state. Instead of solder cream 7, or solder cream 7
Ordinary Franks-cored solder can also be used in conjunction with this.
半田クリームを用いる場合には、第３図ａに示すように
、導電体圧着部２の内面および電線Ｗの導電体４の外面
に半田クリーム７を塗布して、導電体４を導電体圧着部
２内に挿着し、該導電体４を巻くように導電体圧着部２
を従前同様に上下一対の加締型８，８′で加締めた後、
半田クリーム７を溶融，固化させることにより達成され
る。When using solder cream, as shown in FIG. 3a, solder cream 7 is applied to the inner surface of the conductor crimping part 2 and the outer surface of the conductor 4 of the electric wire W, and the conductor 4 is attached to the conductor crimping part. The conductor crimping part 2 is inserted into the conductor crimping part 2 and wound around the conductor 4.
After crimping with a pair of upper and lower crimping dies 8 and 8' as before,
This is achieved by melting and solidifying the solder cream 7.
半田クリーム７は、錫と鉛あるいは錫とビスマスを主体
とする微粒子状の半田合金を活性ロジンなどのフランク
スおよび溶剤とを混練してペースト状としたもので、高
い粘着性を有し、チューブ入りの市販品をそのまま使用
することができる。Solder cream 7 is a paste made by kneading fine particulate solder alloy mainly consisting of tin and lead or tin and bismuth with Franks such as activated rosin and a solvent.It has high adhesiveness and is packaged in a tube. Commercially available products can be used as they are.
この半田クリーム７を第３図ａのように導電体圧着部２
、導電体４の双方に塗布し、または一方の導電体圧着部
２を加締型８′に載せた状態でチューブＣから押し出し
てその上に塗布し、常法に従って加締めた後、１８０゜
Ｃ前後の低温加熱処理を施すことにより、前記半田合金
が溶融して導電体４相互間および導電体４と導電体圧着
部２間の空隙６を満たし、固化する。Apply this solder cream 7 to the conductor crimping part 2 as shown in Figure 3a.
, applied to both conductors 4, or extruded from the tube C with one conductor crimped part 2 placed on the crimping die 8' and applied thereon, crimped according to the usual method, and then 180°. By performing the low-temperature heat treatment before and after C, the solder alloy melts, fills the gaps 6 between the conductors 4 and between the conductors 4 and the conductor crimped portion 2, and solidifies.
半田を用いる場合には、前記導電体４を半田浴槽に浸漬
して半田を付着させるか、或いは導電体圧着部２内に予
め半田を塗布、溶着あるいは接合しておき、第３図ａの
加締型８，８′により前述と同様に処理すればよい。例
えば、第３図ｂに示すように、導電体圧着部２の内面に
フラックス９を塗布した後、上から半田ｌＯで覆ってし
まう構造をとる等の手段をとることができる。When using solder, the conductor 4 is immersed in a solder bath to adhere the solder, or the conductor crimped portion 2 is previously coated with solder, welded or bonded, and then the process shown in FIG. 3a is performed. The process may be performed in the same manner as described above using the clamping molds 8, 8'. For example, as shown in FIG. 3B, it is possible to adopt a structure in which flux 9 is applied to the inner surface of the conductor crimped portion 2 and then covered with solder lO from above.
第２図に示すように、導電体圧着部２と導電体４との空
隙（６）は半田クリーム７（または半田）によって充填
結合されるから、全体として良導体を形成する。従って
、導電体圧着部２の押圧力の不足による導電体２の緩み
や脱落および接触不良といった問題は解消する。As shown in FIG. 2, the gap (6) between the conductor crimped portion 2 and the conductor 4 is filled and bonded with the solder cream 7 (or solder), thus forming a good conductor as a whole. Therefore, problems such as loosening, falling off, and poor contact of the conductor 2 due to insufficient pressing force of the conductor crimping portion 2 are solved.
また、空隙（６）が半田クリーム７（または半田）で充
填塞閉されるから、導電体４が外気と遮断され、酸化皮
膜の形成およびこれによる電気的抵抗の経時的増大も防
止される。その結果、従来の加締圧着時に要求された第
２図の導電体圧着部２におけるバレル巾Ｗや高さｈの厳
密な寸法管理を緩和することができる。Furthermore, since the void (6) is filled and closed with the solder cream 7 (or solder), the conductor 4 is isolated from the outside air, and the formation of an oxide film and the resulting increase in electrical resistance over time are also prevented. As a result, the strict dimensional control of the barrel width W and height h of the conductor crimping portion 2 shown in FIG. 2, which is required in the conventional crimping process, can be relaxed.
さらに、半田クリーム７を用いた場合には低温加熱処理
を施すだけで足り、被覆５に及ぼす熱的影響も解消する
。Furthermore, when the solder cream 7 is used, it is sufficient to perform a low-temperature heat treatment, and the thermal influence on the coating 5 is also eliminated.
以上説明したように、本発明による圧着端子の導電体結
合構造は、電気的接続の信軌性の高い安定な品質のもの
が得られる。しかも、半田クリームおよび（または）半
田の空隙部分への充填，固化により圧着部の寸法の公差
管理を緩和しても確実な機械的把持と電気的接触とを達
成することができ、悪環境下においてもかかる性能を長
期にわたって保持することができる。とくに半田クリー
ムを用いた場合には、従来の端子圧着工程において半田
クリームの塗布と低温加熱処理を施すだけでよく、圧着
作業の能率を低下させずに済む。As explained above, the conductor bonding structure of the crimp terminal according to the present invention provides a stable quality electrical connection with high reliability. Furthermore, by filling the voids with solder cream and/or solder and solidifying it, reliable mechanical gripping and electrical contact can be achieved even if the tolerance control of the dimensions of the crimped part is relaxed, and even in adverse environments. Even in this case, such performance can be maintained for a long period of time. In particular, when solder cream is used, it is sufficient to apply the solder cream and perform low-temperature heat treatment in the conventional terminal crimping process, without reducing the efficiency of the crimping operation.
第１図は本発明構造を有する圧着端子の例の斜視図、
第２図は同じく導電体圧着部の横断面図、第３図ａ，ｂ
はそれぞれは同じく本発明構造の形成過程を示す斜視図
、
第４図は従来構造の圧着端子の斜視図、第５図は同じく
従来構造の形成過程を示す斜視図である。
１・・・接触部、２・・・導電体圧着部、４・・・導電
体、６・・・空隙、７・・・半田クリーム、８，８′・
・・加締型、９・・・フラックス、１０・・・半田。FIG. 1 is a perspective view of an example of a crimp terminal having the structure of the present invention, FIG. 2 is a cross-sectional view of the conductor crimping part, and FIGS. 3 a and b
FIG. 4 is a perspective view of a crimp terminal having a conventional structure, and FIG. 5 is a perspective view showing a process of forming a conventional structure. DESCRIPTION OF SYMBOLS 1...Contact part, 2...Conductor crimping part, 4...Conductor, 6...Gap, 7...Solder cream, 8, 8'.
...Crimp mold, 9...Flux, 10...Solder.
Claims (3)
分に半田クリームおよび（または）半田が溶融固化した
状態で充填されてなる圧着端子の導電体結合構造。(1) A conductor bonding structure of a crimp terminal in which the gap between the inner surface of the conductor crimping part and the conductor of the wire is filled with solder cream and/or solder in a molten and solidified state.
外面に半田クリームおよび（または）半田を塗布もしく
は溶着等して、該導電体を巻くように導電体圧着部を加
締めた後、前記半田クリームおよび（または）半田を溶
融、固化させることから成る圧着端子の導電体結合構造
の形成法。(2) After applying or welding solder cream and/or solder to the inside of the conductor crimping part and/or the outer surface of the conductor of the wire, and crimping the conductor crimping part so as to wrap the conductor, A method for forming a conductor bonding structure of a crimp terminal, which comprises melting and solidifying the solder cream and/or solder.
内に半田クリームを塗布する請求項（２）の圧着端子の
導電体結合構造の形成法。(3) The method for forming a conductor bonding structure of a crimp terminal according to claim (2), wherein a solder cream is applied to the conductor crimped portion while the terminal is placed on the crimping die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30230788A JPH02132785A (en) | 1988-07-08 | 1988-12-01 | Connection structure of crimp-style terminal to electric conductor and formation of the terminal |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16896388 | 1988-07-08 | ||
| JP63-168963 | 1988-07-08 | ||
| JP30230788A JPH02132785A (en) | 1988-07-08 | 1988-12-01 | Connection structure of crimp-style terminal to electric conductor and formation of the terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132785A true JPH02132785A (en) | 1990-05-22 |
Family
ID=26492469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30230788A Pending JPH02132785A (en) | 1988-07-08 | 1988-12-01 | Connection structure of crimp-style terminal to electric conductor and formation of the terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132785A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471173A (en) * | 1990-07-12 | 1992-03-05 | Japan Aviation Electron Ind Ltd | Method of connecting connector terminal with cable |
| JPH0495372A (en) * | 1990-08-01 | 1992-03-27 | Yazaki Corp | Method and device for bonding wire material |
| JPH04167322A (en) * | 1990-10-30 | 1992-06-15 | Tokai Rika Co Ltd | Fuse forming method and fuse |
| JPH0737378U (en) * | 1991-04-27 | 1995-07-11 | 株式会社トーキン | Bolted Langevin transducer |
| JP2006040624A (en) * | 2004-07-23 | 2006-02-09 | Sumitomo Wiring Syst Ltd | Connection structure between different kinds of electric cables |
| WO2009112881A1 (en) * | 2008-03-11 | 2009-09-17 | Fci | Electrical terminal system |
| JP2010020980A (en) * | 2008-07-09 | 2010-01-28 | Autonetworks Technologies Ltd | Electric wire with terminal metal fitting, and manufacturing method thereof |
| JP2010110790A (en) * | 2008-11-06 | 2010-05-20 | Miyachi Technos Corp | Fusing method |
| JP2010165514A (en) * | 2009-01-14 | 2010-07-29 | Autonetworks Technologies Ltd | Chain terminal, terminal metal fitting, and manufacturing method for terminal metal fitting |
| JP2010182492A (en) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | Terminal, and method of connecting terminal and electric wire |
| JP2010182566A (en) * | 2009-02-06 | 2010-08-19 | Tabuchi Electric Co Ltd | Terminal for wire connection, wire connection structure, and method of connecting electric wire with terminal |
| JP2013105648A (en) * | 2011-11-15 | 2013-05-30 | Tabuchi Electric Co Ltd | Terminal connection structure |
| JP2013120683A (en) * | 2011-12-07 | 2013-06-17 | Panasonic Corp | Heating coil of electromagnetic induction heating device and connection terminal of heating coil end part |
| JP2016171041A (en) * | 2015-03-13 | 2016-09-23 | 株式会社フジクラ | Method of manufacturing aluminum wire with terminal |
-
1988
- 1988-12-01 JP JP30230788A patent/JPH02132785A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471173A (en) * | 1990-07-12 | 1992-03-05 | Japan Aviation Electron Ind Ltd | Method of connecting connector terminal with cable |
| JPH0495372A (en) * | 1990-08-01 | 1992-03-27 | Yazaki Corp | Method and device for bonding wire material |
| JPH04167322A (en) * | 1990-10-30 | 1992-06-15 | Tokai Rika Co Ltd | Fuse forming method and fuse |
| JPH0737378U (en) * | 1991-04-27 | 1995-07-11 | 株式会社トーキン | Bolted Langevin transducer |
| JP2006040624A (en) * | 2004-07-23 | 2006-02-09 | Sumitomo Wiring Syst Ltd | Connection structure between different kinds of electric cables |
| CN101999192A (en) * | 2008-03-11 | 2011-03-30 | Fci公司 | Electrical terminal system |
| WO2009112881A1 (en) * | 2008-03-11 | 2009-09-17 | Fci | Electrical terminal system |
| JP2010020980A (en) * | 2008-07-09 | 2010-01-28 | Autonetworks Technologies Ltd | Electric wire with terminal metal fitting, and manufacturing method thereof |
| JP2010110790A (en) * | 2008-11-06 | 2010-05-20 | Miyachi Technos Corp | Fusing method |
| JP2010165514A (en) * | 2009-01-14 | 2010-07-29 | Autonetworks Technologies Ltd | Chain terminal, terminal metal fitting, and manufacturing method for terminal metal fitting |
| JP2010182492A (en) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | Terminal, and method of connecting terminal and electric wire |
| JP2010182566A (en) * | 2009-02-06 | 2010-08-19 | Tabuchi Electric Co Ltd | Terminal for wire connection, wire connection structure, and method of connecting electric wire with terminal |
| JP2013105648A (en) * | 2011-11-15 | 2013-05-30 | Tabuchi Electric Co Ltd | Terminal connection structure |
| JP2013120683A (en) * | 2011-12-07 | 2013-06-17 | Panasonic Corp | Heating coil of electromagnetic induction heating device and connection terminal of heating coil end part |
| JP2016171041A (en) * | 2015-03-13 | 2016-09-23 | 株式会社フジクラ | Method of manufacturing aluminum wire with terminal |
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