JPH02129731U - - Google Patents

Info

Publication number
JPH02129731U
JPH02129731U JP3808689U JP3808689U JPH02129731U JP H02129731 U JPH02129731 U JP H02129731U JP 3808689 U JP3808689 U JP 3808689U JP 3808689 U JP3808689 U JP 3808689U JP H02129731 U JPH02129731 U JP H02129731U
Authority
JP
Japan
Prior art keywords
substrate
thin film
heat equalizing
equalizing member
holding frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3808689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3808689U priority Critical patent/JPH02129731U/ja
Publication of JPH02129731U publication Critical patent/JPH02129731U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP3808689U 1989-03-31 1989-03-31 Pending JPH02129731U (US20100012521A1-20100121-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3808689U JPH02129731U (US20100012521A1-20100121-C00001.png) 1989-03-31 1989-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3808689U JPH02129731U (US20100012521A1-20100121-C00001.png) 1989-03-31 1989-03-31

Publications (1)

Publication Number Publication Date
JPH02129731U true JPH02129731U (US20100012521A1-20100121-C00001.png) 1990-10-25

Family

ID=31545778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3808689U Pending JPH02129731U (US20100012521A1-20100121-C00001.png) 1989-03-31 1989-03-31

Country Status (1)

Country Link
JP (1) JPH02129731U (US20100012521A1-20100121-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007502538A (ja) * 2003-08-11 2007-02-08 東京エレクトロン株式会社 高圧処理中にウエハを保持する真空チャック装置及び方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007502538A (ja) * 2003-08-11 2007-02-08 東京エレクトロン株式会社 高圧処理中にウエハを保持する真空チャック装置及び方法

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