JPH0212875U - - Google Patents

Info

Publication number

JPH0212875U

JPH0212875U JP9032588U JP9032588U JPH0212875U JP H0212875 U JPH0212875 U JP H0212875U JP 9032588 U JP9032588 U JP 9032588U JP 9032588 U JP9032588 U JP 9032588U JP H0212875 U JPH0212875 U JP H0212875U

Authority

JP

Japan

Prior art keywords

chip

substrate

card

module

reinforcing

Prior art date

1988-07-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000003014 reinforcing effect Effects 0.000 claims description 3
• 239000000463 material Substances 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims 3
• 238000000465 moulding Methods 0.000 claims 1
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 239000002184 metal Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)