JPH02127090U - - Google Patents
Info
- Publication number
- JPH02127090U JPH02127090U JP3678089U JP3678089U JPH02127090U JP H02127090 U JPH02127090 U JP H02127090U JP 3678089 U JP3678089 U JP 3678089U JP 3678089 U JP3678089 U JP 3678089U JP H02127090 U JPH02127090 U JP H02127090U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal plate
- flexible printed
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3678089U JPH02127090U (lv) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3678089U JPH02127090U (lv) | 1989-03-30 | 1989-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02127090U true JPH02127090U (lv) | 1990-10-19 |
Family
ID=31543314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3678089U Pending JPH02127090U (lv) | 1989-03-30 | 1989-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02127090U (lv) |
-
1989
- 1989-03-30 JP JP3678089U patent/JPH02127090U/ja active Pending