JPH0212681Y2 - - Google Patents
Info
- Publication number
- JPH0212681Y2 JPH0212681Y2 JP12317583U JP12317583U JPH0212681Y2 JP H0212681 Y2 JPH0212681 Y2 JP H0212681Y2 JP 12317583 U JP12317583 U JP 12317583U JP 12317583 U JP12317583 U JP 12317583U JP H0212681 Y2 JPH0212681 Y2 JP H0212681Y2
- Authority
- JP
- Japan
- Prior art keywords
- unsaturated polyester
- terminal
- polyester resin
- terminal board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 3
- 229920006305 unsaturated polyester Polymers 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 10
- 239000004412 Bulk moulding compound Substances 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- NJNJBBPXTDRUQB-UHFFFAOYSA-N C=CC1=CC=CC=C1.C(C1=CC(C(=O)O)=CC=C1)(=O)O Chemical compound C=CC1=CC=CC=C1.C(C1=CC(C(=O)O)=CC=C1)(=O)O NJNJBBPXTDRUQB-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12317583U JPS6031079U (ja) | 1983-08-08 | 1983-08-08 | 不飽和ポリエステル樹脂製端子板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12317583U JPS6031079U (ja) | 1983-08-08 | 1983-08-08 | 不飽和ポリエステル樹脂製端子板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6031079U JPS6031079U (ja) | 1985-03-02 |
JPH0212681Y2 true JPH0212681Y2 (en, 2012) | 1990-04-10 |
Family
ID=30281276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12317583U Granted JPS6031079U (ja) | 1983-08-08 | 1983-08-08 | 不飽和ポリエステル樹脂製端子板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6031079U (en, 2012) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0732564B2 (ja) * | 1987-02-10 | 1995-04-10 | 株式会社三ツ葉電機製作所 | 金属と樹脂の複合体およびその製造方法 |
JP7231339B2 (ja) | 2018-06-01 | 2023-03-01 | ショット日本株式会社 | 気密端子 |
-
1983
- 1983-08-08 JP JP12317583U patent/JPS6031079U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6031079U (ja) | 1985-03-02 |
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