JPH02126733U - - Google Patents
Info
- Publication number
- JPH02126733U JPH02126733U JP3724889U JP3724889U JPH02126733U JP H02126733 U JPH02126733 U JP H02126733U JP 3724889 U JP3724889 U JP 3724889U JP 3724889 U JP3724889 U JP 3724889U JP H02126733 U JPH02126733 U JP H02126733U
- Authority
- JP
- Japan
- Prior art keywords
- grooves
- radial direction
- stage
- carved
- arcuate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims 2
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3724889U JPH02126733U (no) | 1989-03-29 | 1989-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3724889U JPH02126733U (no) | 1989-03-29 | 1989-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02126733U true JPH02126733U (no) | 1990-10-18 |
Family
ID=31544186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3724889U Pending JPH02126733U (no) | 1989-03-29 | 1989-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02126733U (no) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002350484A (ja) * | 2001-05-30 | 2002-12-04 | Hioki Ee Corp | 回路基板吸着装置および回路基板検査装置 |
| JP4740886B2 (ja) * | 2007-01-31 | 2011-08-03 | 株式会社ディスコ | 基板の吸着方法 |
| JP2012134275A (ja) * | 2010-12-21 | 2012-07-12 | Disco Abrasive Syst Ltd | 研削装置 |
-
1989
- 1989-03-29 JP JP3724889U patent/JPH02126733U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002350484A (ja) * | 2001-05-30 | 2002-12-04 | Hioki Ee Corp | 回路基板吸着装置および回路基板検査装置 |
| JP4678987B2 (ja) * | 2001-05-30 | 2011-04-27 | 日置電機株式会社 | 回路基板吸着装置および回路基板検査装置 |
| JP4740886B2 (ja) * | 2007-01-31 | 2011-08-03 | 株式会社ディスコ | 基板の吸着方法 |
| JP2012134275A (ja) * | 2010-12-21 | 2012-07-12 | Disco Abrasive Syst Ltd | 研削装置 |