JPH02126601A - Connecting structure of terminal and variable resistor provided with such connecting structure - Google Patents

Connecting structure of terminal and variable resistor provided with such connecting structure

Info

Publication number
JPH02126601A
JPH02126601A JP27990788A JP27990788A JPH02126601A JP H02126601 A JPH02126601 A JP H02126601A JP 27990788 A JP27990788 A JP 27990788A JP 27990788 A JP27990788 A JP 27990788A JP H02126601 A JPH02126601 A JP H02126601A
Authority
JP
Japan
Prior art keywords
terminal
solder
electrode
electrodes
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27990788A
Other languages
Japanese (ja)
Inventor
Fumitoshi Masuda
文年 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP27990788A priority Critical patent/JPH02126601A/en
Priority to KR1019890015984A priority patent/KR900008545A/en
Publication of JPH02126601A publication Critical patent/JPH02126601A/en
Pending legal-status Critical Current

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  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)

Abstract

PURPOSE:To enable a terminal to be stably connected onto an electrode through simple work by solder-plating the surface of a terminal member beforehand, causing the terminal member to abut an electrode part, and heating them to electrically connect the terminal member and the electrode part. CONSTITUTION:A resistor 6, electrodes 6a, 6b, a collector electrode 7, and an elastic body 8 are formed on the surface of a substrate 1. Terminals 9, 10, 11 consist of a copper alloy, etc., and are connected to the electrodes 6a, 6b by solder-plating the extremities of the terminals 9, 10, 11 beforehand, and causing these solder-plated parts to abut on the electrodes 6a, 6b, 7, and fusing the plated layers through heating by Joule heat or a heater to carry out soldering. For the substrate 1, alumina is preferably used, and as the electrodes 6a, 6b, 7, silver or silver-palladium alloy is preferably used. Therefore, in soldering, the solder is not required to be supplied separately, so that the work is simplified, and is suitable for continuous production. Further, the adhered solder amount is made constant, so that the possibility that the excessive solder flows out to exert adverse influence upon the other parts is eliminated and stable connection to a thin film electrode can be achieved.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、端子の半田付けによる接続構造及び該接続構
造を備えた可変抵抗器、特に表面に抵抗体を設けた基板
に対して摺動子を備えたロータが回動可能に取り付けら
れた可変抵抗器に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a connection structure by soldering terminals, a variable resistor equipped with the connection structure, and particularly a slider to a substrate having a resistor on its surface. The present invention relates to a variable resistor having a rotor rotatably attached thereto.

−来の技手とその 題 従来、基板上に設けた電極へ端子を接続するには、端子
を電極上に当接させ、そこに半田を供給し加熱すること
により半田付けしていた。しかしながら、これでは組立
てに際して半田を供給する装置、供給量をフントロール
する機能が必要であり、設備が大型化し、高価になる。
- Previous Techniques and Their Titles Conventionally, in order to connect a terminal to an electrode provided on a board, the terminal was brought into contact with the electrode, and solder was applied and heated by applying solder thereto. However, this requires a device for supplying solder and a function to control the amount of solder supplied during assembly, making the equipment larger and more expensive.

また、半田の供給量の調整が困難で、供給量が多くなる
と他の部品への障害、例えばロータが回動不能となるお
それもあり、特にこの様な問題点は小型の集積回路用部
品では顕著であった。
In addition, it is difficult to adjust the amount of solder supplied, and if the amount supplied is too large, it may cause damage to other components, such as the rotor becoming unable to rotate.This problem is particularly important for small integrated circuit components. It was remarkable.

一方、端子を電極へ溶接することが考えられるが、電極
と端子との厚さの差が大き過ぎるため、特性の安定性を
欠き、量産には不向きである。
On the other hand, it is possible to weld the terminal to the electrode, but since the difference in thickness between the electrode and the terminal is too large, the characteristics lack stability and this is not suitable for mass production.

そこで、本発明の課題は、簡単な作業にょちて端子を電
極上に安定性よく接続できる構造を提供することにある
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a structure that allows a terminal to be connected to an electrode with good stability by a simple operation.

課 を解 するための手段と作用 前記課題を解決するため、本発明に係る端子の接続構造
は、端子材の表面に予め半田メッキを施し、該半田メッ
キ部を電極部に当接させて加熱し、端子材と該電極部を
電気的に接続したことを特徴とする。加熱する方法は、
例えば、端子上に加熱装置の電極棒を当接させ、該電極
棒に電流を供給することでジュール熱を発生させる方法
あるいはヒータ等の熱源を端子上に接触させる方法が採
用される。この接続構造においては、組立て時に半田を
供給しつつ加熱する工程が省かれ、余分な半田が他の部
分へ流れ出すこともなく、安定した電気的接続が得られ
る。
Means and Function for Solving the Problems In order to solve the above problem, the terminal connection structure according to the present invention is provided by applying solder plating to the surface of the terminal material in advance, bringing the solder plating part into contact with the electrode part, and heating it. The present invention is characterized in that the terminal material and the electrode portion are electrically connected. The heating method is
For example, a method is employed in which an electrode of a heating device is brought into contact with the terminal and a current is supplied to the electrode to generate Joule heat, or a method in which a heat source such as a heater is brought into contact with the terminal. In this connection structure, the step of heating while supplying solder during assembly is omitted, and a stable electrical connection is obtained without excess solder flowing out to other parts.

また、本発明に係る可変抵抗器は、前記端子の接続構造
を備えている。即ち、端子の表面に予め半田メッキを施
し、該半田メッキ部を基板上の抵抗体の端部に設けた電
極又はコし・クタ電極に当接させて加熱し、端子と抵抗
体又はコレクタ電極とを電気的に接続したことを特徴と
する。
Further, the variable resistor according to the present invention includes the terminal connection structure. That is, the surface of the terminal is solder-plated in advance, and the solder-plated part is brought into contact with an electrode or a collector electrode provided at the end of a resistor on a board and heated, and the terminal and the resistor or collector electrode are heated. It is characterized in that it is electrically connected to.

夾施珂 以下、本発明に係る可変抵抗器の実施例を添付図面に基
づいて説明する。
Embodiments of the variable resistor according to the present invention will be described below with reference to the accompanying drawings.

[第1実施例、第1図〜第18図] 本可変抵抗器は、概略、第12図、第13図に示す様に
、抵抗体6を備えた端子付き抵抗基板1をケース2に取
り付け、このケース2内に摺動子4を備えたロータ3を
回動可能に保持したもので、ケース2からはリード端子
9,10及びコレクタ端子11が引き出されている。
[First Embodiment, Figures 1 to 18] As schematically shown in Figures 12 and 13, this variable resistor includes a resistor board 1 with a terminal and a resistor 6 attached to a case 2. A rotor 3 having a slider 4 is rotatably held in this case 2, and lead terminals 9, 10 and a collector terminal 11 are drawn out from the case 2.

第1図に示す如く、基板1は、その表面に抵抗体6、電
極6a、6b、コレクタ電極7及び弾性体8が形成され
ている。抵抗体6は馬蹄形でその一端に電極6aを介し
て第1リード端子9が、他端に電極6bを介して第2リ
ード端子10が半田付けにてそれぞれ接続されている。
As shown in FIG. 1, a resistor 6, electrodes 6a, 6b, a collector electrode 7, and an elastic body 8 are formed on the surface of a substrate 1. The resistor 6 has a horseshoe shape, and a first lead terminal 9 is connected to one end thereof via an electrode 6a, and a second lead terminal 10 is connected to the other end by soldering via an electrode 6b.

コレクタ電極7は、基板1の中央部から基板1の一端部
に延在され、端部にはコレクタ端子11が接続されてい
る。
The collector electrode 7 extends from the center of the substrate 1 to one end of the substrate 1, and a collector terminal 11 is connected to the end.

端子9,10.11は銅合金等からなり、電極6a。The terminals 9, 10.11 are made of copper alloy or the like, and the electrodes 6a.

6b、7  に対する取り付けは、予め端子9,10.
11の少なくとも先端部に半田メッキを施しておき、こ
の半田メッキ部分を電極6a、 6b、 7上に当接さ
せ、ジュール熱による加熱、ヒータによる加熱等にてメ
ッキ層を溶融させて半田付けする。この場合、基板1は
アルミナ、電極6a、6b、7は銀又は銀−パラジウム
合金を用いることが好ましい。
For attachment to terminals 9, 10 .
Solder plating is applied to at least the tips of the electrodes 11, and the solder plated portions are brought into contact with the electrodes 6a, 6b, and 7, and the plating layer is melted by heating with Joule heat, heating with a heater, etc., and soldered. . In this case, it is preferable to use alumina for the substrate 1 and silver or a silver-palladium alloy for the electrodes 6a, 6b, and 7.

一方、弾性体8は、後述のロータ3のスカート部3cに
対向する位置に、円環状に基板1の表面に固着されてい
る。この弾性体8の材料としては、半田付けの温度に耐
え、フラックス洗浄等の溶剤に耐える絶縁性のシリコン
エ、ラスト等を用いている。また、基板1に固着させる
方法としては、スクリーン印刷、描画法、ディッピング
等を採用することができる。これによって、ロータ3と
摺接する際、内部の密閉性が得られると共に、トルクを
高めて安定させることができる。また、基板1とケース
2とをインサートモールドにて一体化する際、緩衝作用
が得られ、基板1が割れる問題が防止されると共に、前
記抵抗体6側にケース2の成形樹脂が流れるのを抑制で
きる利点がある。なお、この弾性体8はロータ3のスカ
ート部3cの下面に固着されていてもよい。
On the other hand, the elastic body 8 is fixed to the surface of the substrate 1 in an annular shape at a position facing a skirt portion 3c of the rotor 3, which will be described later. As the material of the elastic body 8, insulating silicone, last, etc., which can withstand the temperature of soldering and the solvents used in flux cleaning, etc., is used. Further, as a method for fixing it to the substrate 1, screen printing, drawing method, dipping, etc. can be adopted. Thereby, when slidingly contacting the rotor 3, internal airtightness can be obtained, and the torque can be increased and stabilized. Furthermore, when the board 1 and the case 2 are integrated by insert molding, a buffering effect is obtained, which prevents the problem of the board 1 from cracking, and also prevents the molded resin of the case 2 from flowing toward the resistor 6 side. It has the advantage of being suppressed. Note that this elastic body 8 may be fixed to the lower surface of the skirt portion 3c of the rotor 3.

ところで、基板1を含むケース2は、第2図に示す形状
に加工されたフープ材3oに保持されて製作される。即
ち、基板1は前述の如く半田付けされた端子9,10.
11とダミ一端子31.31とで保持され、この状態で
ケース2にインサートモールドされる(第3図、第5図
参照)。なお、最終的にフープ材30のタイバー、ダミ
一端子31.31はカットされる。リード端子9,10
は長手方向にスリット9 ’、10’ を形成すること
で二叉状の枝端子9a。
Incidentally, the case 2 including the substrate 1 is manufactured by being held by a hoop material 3o processed into the shape shown in FIG. That is, the board 1 has the terminals 9, 10 . . . soldered as described above.
11 and dummy terminals 31 and 31, and in this state is insert molded into the case 2 (see FIGS. 3 and 5). Incidentally, the tie bar and dummy terminals 31 and 31 of the hoop material 30 are finally cut. Lead terminals 9, 10
A bifurcated branch terminal 9a is formed by forming slits 9' and 10' in the longitudinal direction.

9b、 10a、 10bに分割されている。これは以
下に説明する標準2.5mmピッチと変則2.5mmピ
ッチの実装形態に対応させるためである。
It is divided into 9b, 10a, and 10b. This is to make it compatible with the standard 2.5 mm pitch and irregular 2.5 mm pitch mounting configurations described below.

ケース2は、第3図ないし第6図に示す様に、上方に開
口した筒状体をなし、側面から底面にわたって前記端子
9,10.11を保持し得る溝12a。
As shown in FIGS. 3 to 6, the case 2 has a cylindrical body that opens upward, and has grooves 12a that can hold the terminals 9, 10, and 11 from the side to the bottom.

12b、 13a、 13b、 14が複数本形成きれ
ている。上方に開口した筒部2aはロータ3を回動可能
に収容し得る内径とされており、上部の内周部には加熱
曲げ加工に必要な幅を有するリング状突起2bが形成さ
れている。
A plurality of 12b, 13a, 13b, and 14 have been formed. The upwardly opened cylindrical portion 2a has an inner diameter that can rotatably accommodate the rotor 3, and a ring-shaped protrusion 2b having a width necessary for heat bending is formed on the inner peripheral portion of the upper portion.

前記溝12a、 12b、 13a、 13b、 14
は、リード端子9゜10及びコレクタ端子11の幅に合
わせて形成され、リード端子9,10の枝端子9a、 
10aに溝12a、 13aが対応し、枝端子9b、1
0bに溝12b、13bが対応している。この溝はケー
ス2の上面縁部から側面を経て底面側に延在され、ケー
ス2の側面から突出する各端子9,10.11を側面も
しくは底面の所要箇所で折り曲げて外方に取り出せる様
になっている。
The grooves 12a, 12b, 13a, 13b, 14
are formed to match the widths of the lead terminals 9° 10 and the collector terminal 11, and the branch terminals 9a and 9a of the lead terminals 9 and 10
Grooves 12a and 13a correspond to 10a, and branch terminals 9b and 1
Grooves 12b and 13b correspond to 0b. This groove extends from the top edge of the case 2 through the side surface to the bottom surface side, and allows each terminal 9, 10, 11 protruding from the side surface of the case 2 to be taken out by bending at a required point on the side surface or bottom surface. It has become.

また、溝の間隔は、可変抵抗器を実装するプリント基板
等に形成された端子の挿通孔相互の距離、つまりピッチ
に適合する様に設定されており、本実施例では後述の標
準2.5mmピッチ及び変則2.5mmピッチのいずれ
にも対応可能となっている。
Furthermore, the spacing between the grooves is set to match the distance between the terminal insertion holes formed on the printed circuit board etc. on which the variable resistor is mounted, that is, the pitch. It is compatible with both pitch and irregular 2.5 mm pitch.

さらに、各溝の縁部12c、 13c、 14cは外方
に突出し、各端子9,10.11を固定する加工、即ち
加熱融着等を容易にし得ると共に、プリント基板に実装
した際の安定性やフラックス上がりを良くし、半田付け
を良好にするためのスタンドオフ作用をも併せもたせて
いる。
Furthermore, the edges 12c, 13c, and 14c of each groove protrude outward to facilitate processing for fixing each terminal 9, 10, and 11, that is, heat fusion, etc., and to improve stability when mounted on a printed circuit board. It also has a standoff effect that improves flux removal and improves soldering.

前記ケース2の材質としては、熱変形温度がロータ3と
同等もしくは低い熱可塑性樹脂、例えばP B T*詣
等を用いるのが好ましい。
As the material for the case 2, it is preferable to use a thermoplastic resin having a heat deformation temperature equal to or lower than that of the rotor 3, such as PBT*.

ロータ3は、第7図ないし第9図に示す様に、上面に十
字形のドライバ溝38を形成し、下部には前記基板1上
の弾性体8に対向する円環形のスカート部3cが形成さ
れている。また、下部には摺動子4の基板部4aがイン
サートモールドにより、−体的に固定されている。突起
3d、 3dは底面側に突設され、ロータ3をドライバ
にて回動させて抵抗値を調節する際、基板1上に当接す
ることにより、加圧力でロータ3が破損したり、摺動子
4が変形するのを防止する。ロータ3の材質としては、
耐熱性に優れた熱硬化性樹脂や熱可塑性樹脂、例えばP
PS樹脂等が用いられ、ケース2のリング突起2bの加
熱曲げ加工時の熱による変形や特性の低下を防止可能と
している。
As shown in FIGS. 7 to 9, the rotor 3 has a cross-shaped driver groove 38 formed on its upper surface, and an annular skirt portion 3c facing the elastic body 8 on the substrate 1 formed at its lower part. has been done. Further, the base plate portion 4a of the slider 4 is physically fixed to the lower portion by insert molding. The protrusions 3d and 3d protrude from the bottom side, and when the rotor 3 is rotated by a screwdriver to adjust the resistance value, when the protrusions 3d and 3d come into contact with the substrate 1, the rotor 3 may be damaged by the pressurizing force or may slide. This prevents the child 4 from being deformed. The material of the rotor 3 is as follows:
Thermosetting resins and thermoplastic resins with excellent heat resistance, such as P
PS resin or the like is used to prevent the ring protrusion 2b of the case 2 from being deformed or deteriorating in characteristics due to heat during heat bending.

摺動子4は、第10図、第11図にも示す様に、1枚の
導電性金属板をプレス加工にて成形したもので、基板部
4aと、腕部4cの先端に位置する接点部4dと、周部
に位置する一対の腕部4e、 4eの先端に位置する接
点部4f、 4fとから構成されている。
As shown in FIGS. 10 and 11, the slider 4 is formed by pressing a single conductive metal plate, and includes a base plate 4a and a contact point located at the tip of an arm 4c. A pair of arm portions 4e located on the periphery, contact portions 4f located at the tips of 4e.

基板部4aは端部4bで折り曲げて二重構造とされてい
る。腕部4e、 4eは周方向に延在され、第9図で明
らかな様に、接点部4f、4fを直線と円弧形状を組み
合わせた曲線でカットすることにより、内周部と外周部
に2分割されている。さらに、基板部48の中心と接点
部4f、 4fとを結ぶ直線Aと平行な直線B、Bにて
腕部4e、 4eが前記基板1偏に折り曲げられ、先端
付近は逆方向に曲げ加工を行なって接点部4f、 4f
を形成している。この場合、接点部4f、 4fは全て
の曲げ加工が終了した後、抵抗体6と接触させて動作状
態にすると、直線A上に並列することとなる。
The substrate portion 4a is bent at the end portion 4b to form a double structure. The arm parts 4e, 4e extend in the circumferential direction, and as is clear from FIG. It is divided. Further, the arm parts 4e, 4e are bent toward the board 1 by straight lines B, which are parallel to the straight line A connecting the center of the board part 48 and the contact parts 4f, 4f, and the vicinity of the tips are bent in the opposite direction. and contact parts 4f, 4f
is formed. In this case, when the contact portions 4f, 4f are brought into contact with the resistor 6 and put into operation after all the bending processes are completed, they will be arranged in parallel on the straight line A.

ところで、接点部4f、 4fは、フリーな状態におい
て第10図、第11図ウニ点鎖線位置にあり、基板1上
に取り付けられた際には、矢印り方向に撓み、実線位置
に変移する。即ち、本実施例では、直線Aと平行な直線
B、Bにて腕部4e、 4eを折り曲げているため、接
点部4f、 4fは矢印り方向に垂直移動する。もし、
腕部4e、 4eを直線Aに対して角度をもたせて折り
曲げたのであれば、基板1に取り付けた際に、接点部4
f、 4fが実線位置に存在するためには、フリーな状
態では接点部4f、 4fは二点鎖線位置よりも矢印E
方向にずれて存在しなければならない。ロータ3のモー
ルド成形は、図示しない金型の空間部に接点部4f、 
4f及び腕部4e。
By the way, the contact portions 4f, 4f are in the position indicated by the dashed dotted line in FIGS. 10 and 11 in a free state, and when mounted on the substrate 1, they are bent in the direction of the arrow and shifted to the position indicated by the solid line. That is, in this embodiment, since the arm portions 4e, 4e are bent along straight lines B, B parallel to the straight line A, the contact portions 4f, 4f move vertically in the direction indicated by the arrow. if,
If the arm parts 4e, 4e are bent at an angle with respect to the straight line A, the contact part 4 will be bent when attached to the board 1.
In order for f, 4f to exist at the solid line position, in the free state, the contact portions 4f, 4f should be closer to the arrow E than the two-dot chain line position.
It must exist shifted in the direction. When molding the rotor 3, a contact portion 4f is placed in a space of a mold (not shown).
4f and arm portion 4e.

4eを収容して行なうのであるが、もし、接点部4f。4e, but if the contact part 4f.

4fがフリーな状態で二点鎖線位置よりも矢印E方向に
ずれて存在するならば、接点部4f、 4f及び腕部4
e、 4eを金型の空間部に収容することができなくな
ってしまう。即ち、本実施例は、直線Aと平行な直線B
、Bにて腕部4e、4eを折り曲げ、接点部4f、 4
fが矢印り方向に垂直移動するようにしているので、ロ
ータ3のモールド成形が可能になっているのである。
If 4f is in a free state and is shifted in the direction of arrow E from the position of the two-dot chain line, then the contact parts 4f, 4f and the arm part 4
e, 4e cannot be accommodated in the space of the mold. That is, in this embodiment, straight line B parallel to straight line A
, bend the arm portions 4e, 4e at B, and connect the contact portions 4f, 4.
Since f is arranged to move vertically in the direction of the arrow, molding of the rotor 3 is possible.

さらに、本実施例では、接点部4f、 4fを円弧形状
を含む曲線によって分割したため、腕部4e、 4eを
直線Bで折り曲げると、第9図に示す様に、接点部4f
、 4f間に隙間Gが形成され、接点部4f、4f間の
相互干渉が防止され、抵抗体6に追随して互いにフリー
に動作でき接触信頼性が向上することとなる。また、接
点部4f、4fの幅寸法を大きくとることができ、加工
精度も向上する。
Furthermore, in this embodiment, since the contact portions 4f, 4f are divided by a curved line including an arc shape, when the arm portions 4e, 4e are bent along a straight line B, the contact portion 4f is divided as shown in FIG.
A gap G is formed between the contact portions 4f, 4f, and mutual interference between the contact portions 4f and 4f is prevented, and the contact portions 4f and 4f can mutually operate freely following the resistor 6, thereby improving contact reliability. Moreover, the width dimension of the contact portions 4f, 4f can be increased, and the processing accuracy is also improved.

以上の如く構成された摺動子4は、ケース2にロータ3
と共に組み込んだ際、接点部4dがコレクタ電極7上に
接触し、接点部4f、4fが抵抗体6上に接触し、ロー
タ3の回動角度に応じて端子9゜11及び10.11間
の抵抗値が調整される。
The slider 4 configured as described above has a rotor 3 attached to the case 2.
When assembled together, the contact portion 4d contacts the collector electrode 7, the contact portions 4f, 4f contact the resistor 6, and the contact between the terminals 9°11 and 10.11 changes depending on the rotation angle of the rotor 3. The resistance value is adjusted.

次に、この可変抵抗器の組立について、第12図、第1
3図、第14図を参照して説明する。まず、摺動子4の
タイバー40.40を切除してケース2の筒部2aに、
単体のロータ3を収容する。次に、ケース2のリング状
突起2bに熱カシメによる曲げ加工を施してロータ3の
抜は止めを図る。この曲げ加工は、熱ボンダ、超音波加
工等にて行なわれ、ロータ3がケース2内で回動自在に
保持される。
Next, regarding the assembly of this variable resistor, Fig. 12 and 1
This will be explained with reference to FIGS. 3 and 14. First, the tie bars 40 and 40 of the slider 4 are cut out and attached to the cylindrical part 2a of the case 2.
A single rotor 3 is accommodated. Next, the ring-shaped protrusion 2b of the case 2 is bent by heat caulking to prevent the rotor 3 from being pulled out. This bending process is performed using a thermal bonder, ultrasonic processing, etc., and the rotor 3 is rotatably held within the case 2.

突起2bの一部は予め高く形成されており(第5図にて
符号2cで示す)、この曲げ加工時にロータ3の上面に
臨み、ロータ3の上面に形成された突部3bが当接する
ことにより、ロータ3の回動角度を規制するストッパ2
cとして機能する。ケース2の上面にはリング状突起2
bの外側に目盛15が複数形成されている。この目盛1
5は凹みとして形成され、ロータ3のドライバ溝3aに
近接して位置し、該ドライバ溝3aをいわば指標として
ロータ3の回動角度の目安となる。
A part of the protrusion 2b is formed high in advance (indicated by the reference numeral 2c in FIG. 5), so that it faces the upper surface of the rotor 3 during this bending process, and the protrusion 3b formed on the upper surface of the rotor 3 comes into contact with it. A stopper 2 that regulates the rotation angle of the rotor 3
Functions as c. A ring-shaped protrusion 2 is on the top of the case 2.
A plurality of scales 15 are formed on the outside of b. This scale 1
Reference numeral 5 is formed as a recess, located close to the driver groove 3a of the rotor 3, and serves as a guide for the rotation angle of the rotor 3 using the driver groove 3a as a so-called index.

続いて、端子9,10.11のタイバーを切除すると、
ケース2の側面から突出したリード端子9゜10及びコ
レクタ端子11を有する可変抵抗器が得られる。
Next, remove the tie bars of terminals 9, 10, and 11.
A variable resistor having lead terminals 9 and 10 and a collector terminal 11 protruding from the side surface of the case 2 is obtained.

ところで、これらのリード端子9,10、コレクタ端子
11は、ケース2に設けられた溝に沿わせられ、所定の
位置で折曲して外方に突出させることにより、プリント
基板に形成された複数の挿通孔、即ち、標準2.5mm
ピッチ、及び変則2.5mmピッチのいずれにも適合可
能とされている。プリント基板16には、第15図、第
16図に示す様に、Xのピッチで挿通孔17が複数個形
成されており、通常このXは2.5mmに設定されてい
る。標準2.5mmピッチとは、第15図に二点鎖線で
示す如く、底辺2X、高さXの直角二等辺三角形が形成
される様に、コレクタ端子11を挿通孔17a、リード
端子9を挿通孔17bに、リード端子10を挿通孔17
cにそれぞれ挿通させる取付は形態をいう。変則2.5
mmピッチとは、第16図に二点鎖線で示す如く、二辺
がそれぞれXの二等辺三角形が形成される轡に、コレク
タ端子11を挿通孔17a1 リード端子9を挿通孔1
7bに、リード端子10を挿通孔17cにそれぞれ挿通
させる取付は形態をいう。
By the way, these lead terminals 9, 10 and collector terminal 11 are arranged along the groove provided in the case 2, bent at a predetermined position, and projected outward to form a plurality of leads formed on the printed circuit board. insertion hole, i.e. standard 2.5mm
It is said that it can be adapted to both pitch and irregular pitch of 2.5 mm. As shown in FIGS. 15 and 16, a plurality of insertion holes 17 are formed in the printed circuit board 16 at a pitch of X, and this X is normally set to 2.5 mm. The standard 2.5 mm pitch means that the collector terminal 11 is inserted through the insertion hole 17a and the lead terminal 9 is inserted through the insertion hole 17a so that a right-angled isosceles triangle with a base of 2X and a height of X is formed as shown by the two-dot chain line in FIG. Insert the lead terminal 10 into the hole 17b.
The attachment that is inserted through C is called the form. Anomaly 2.5
The mm pitch means that the collector terminal 11 is inserted into the insertion hole 17a1, the lead terminal 9 is inserted into the insertion hole 1, and the collector terminal 11 is inserted into the insertion hole 17a1, and the lead terminal 9 is inserted into the insertion hole 1, in which an isosceles triangle with two sides of X is formed, as shown by the two-dot chain line in FIG.
7b, the attachment in which the lead terminals 10 are respectively inserted into the insertion holes 17c is referred to as a form.

しかして、前記リード端子9,10及びコレクタ端子1
1は、前記2種類の取付は形態に合わせ、第17図に示
すケース2の上面に位置するドライバ溝3aに対して直
角方向となる側面からの取出しに限らず、ケース2の底
面側からも取り出すことができる。
Therefore, the lead terminals 9 and 10 and the collector terminal 1
1, the above two types of attachment are not limited to the side surface perpendicular to the driver groove 3a located on the top surface of the case 2 as shown in FIG. 17, but can also be taken out from the bottom surface side of the case 2. It can be taken out.

まず、側面側からの取出しにおいて、標準2.5mmピ
ッチ(第17図の二点鎖線Y1参照)に適合させる場合
について説明すると、初めにケース2の側面から突出し
たコレクタ端子11を底面側に向けて折曲し、溝14に
沿わせる。そして、所定位置である点P1にて再び折曲
し、側面に対して直角方向に突出させる。リード端子9
,1oは、それぞれ枝端子9b、10bを切除し、残さ
れた枝端子9a、 10aを上面側に向けて折曲し、か
つ、溝12a、13aに沿わせる。さらに、所定位置で
ある点P2. P3にて再び折曲し、コレクタ端子11
と平行になる様に突出きせる。これによって、コレクタ
端子11を頂点とする直角二等辺三角形の取出し位置を
決めることができる。
First, to explain the case of adapting to the standard 2.5 mm pitch (see the two-dot chain line Y1 in Fig. 17) when taking out from the side, first, the collector terminal 11 protruding from the side of the case 2 should be directed toward the bottom side. bend it and align it along the groove 14. Then, it is bent again at a predetermined point P1 to protrude perpendicularly to the side surface. Lead terminal 9
, 1o cut off the branch terminals 9b and 10b, respectively, and bend the remaining branch terminals 9a and 10a toward the upper surface side, and align them with the grooves 12a and 13a. Further, point P2, which is a predetermined position. Bend again at P3 and connect collector terminal 11
Protrude so that it is parallel to the As a result, the extraction position of a right-angled isosceles triangle having the collector terminal 11 as its apex can be determined.

次に、変則2.5mmピッチ(第17図の二点鎖線Y2
参照)に適合させる場合は、初めにコレクタ端子11を
ケース2の上面側に向けて折曲し、溝14に沿わせる。
Next, an irregular 2.5 mm pitch (double-dashed line Y2 in Fig. 17)
), first bend the collector terminal 11 toward the upper surface of the case 2 and align it with the groove 14.

そして、所定位置である点P4にて再び折曲し、側面に
対して直角方向に突出きせる。リード端子9,10は、
それぞれ枝端子9a、 10aを切除し、残された枝端
子9b、10bを底面側に向けて折曲し、溝12b、1
3bに沿わせる。さらに、所定位置である点P5.P6
にて再び折曲し、コレクタ端子11と同方向に突出させ
る。これにより、フレクタ端子11を頂点とする二等辺
三角形の取出し位置を決めることができる。
Then, it is bent again at a predetermined point P4 to protrude perpendicularly to the side surface. The lead terminals 9 and 10 are
Cut out the branch terminals 9a and 10a, respectively, and bend the remaining branch terminals 9b and 10b toward the bottom side to form grooves 12b and 1.
Align it along 3b. Furthermore, point P5. which is a predetermined position. P6
It is bent again at , and is made to protrude in the same direction as the collector terminal 11 . Thereby, the extraction position of the isosceles triangle having the flexor terminal 11 as its apex can be determined.

一方、各端子9,10,11をケース2の底面側から取
り出す場合も、前述の如く標準2.5mmピッチ、変則
2.5mmピッチに対応させて各端子9,10.11を
ケース2の底面にて第17図中玉角形Yl 、 Y2を
構成する様に突出させればよい。取出し位置では、第1
8図に示す様に、例えば底面側の場合、溝12aの縁部
を加熱して枝端子98側に押し潰し、カシメ部を形成し
ておけば、該枝端子9aが固定されてその浮き上がりが
防止される。
On the other hand, when taking out each terminal 9, 10, 11 from the bottom side of case 2, each terminal 9, 10, 11 is removed from the bottom side of case 2 in accordance with the standard 2.5 mm pitch and irregular 2.5 mm pitch as described above. It is sufficient if they are made to protrude so as to form the conical shapes Yl and Y2 in FIG. 17. At the extraction position, the first
As shown in FIG. 8, for example, in the case of the bottom surface side, if the edge of the groove 12a is heated and crushed toward the branch terminal 98 side to form a caulked part, the branch terminal 9a is fixed and its lifting is prevented. Prevented.

[第2実施例、第19図] 本第2実施例は、従来から知られている構成に本発明を
適用したもので、摺動子40を備えたロータ45の軸部
を基板50の中心孔に挿入し、裏側でカシメて抜は止め
を図り、ロータ45と一体的に摺動子40を回動可能と
したものである。基板50上には抵抗体55、コレクタ
電極56が形成され、端子61゜62、63の端部が抵
抗体55の両端電極部55a、 55b及びコレクタ電
極56上に半田付けされている。この半田付けは、前記
第1実施例でも説明した様に、端子61.62.63の
先端部表面に半田メッキを施し、この半田メッキ部分を
電極55a、 55b、 56上に当接させると共に、
加熱することによりメッキ層を溶融させて行なわれる。
[Second Embodiment, FIG. 19] In the second embodiment, the present invention is applied to a conventionally known configuration. The slider 40 is inserted into the hole and caulked on the back side to prevent it from being pulled out, allowing the slider 40 to rotate integrally with the rotor 45. A resistor 55 and a collector electrode 56 are formed on the substrate 50, and the ends of terminals 61, 62, 63 are soldered onto the electrodes 55a, 55b at both ends of the resistor 55 and the collector electrode 56. As described in the first embodiment, this soldering involves applying solder plating to the surfaces of the tips of the terminals 61, 62, and 63, and bringing the solder plated portions into contact with the electrodes 55a, 55b, and 56.
This is done by melting the plating layer by heating.

加熱は加熱用電極に電流を供給しつつジュール熱を発生
させるか、ヒータチップを押し当てることで行なう。ま
た、基板1はアルミナ、電極55a、 55b、 56
は銀又は銀−パラジウム合金、半田メッキ層には銅合金
が用いられている。
Heating is performed by generating Joule heat while supplying current to the heating electrode, or by pressing a heater chip against it. Further, the substrate 1 is made of alumina, and the electrodes 55a, 55b, 56
Silver or silver-palladium alloy is used for the solder plating layer, and a copper alloy is used for the solder plating layer.

勿論、他の材料を適宜選択することも可能である。Of course, it is also possible to select other materials as appropriate.

発明の効果 以上の説明で明らかな様に、本発明によれば、端子の表
面に予め設けた半田メッキ層を加熱により溶融させ、該
端子を電極に接続したため、いちいち半田を供給しつつ
半田付けする必要がなく、作業が簡単となり、連続した
生産に適する。また、半田の付着量が一定となり、余分
な半田が流れ出して他の部品の障害となるおそれもなく
、小型の電子部品に最適である。しかも、膜厚の薄い電
極ニ対して安定した電気的接続を図ることができる。
Effects of the Invention As is clear from the above explanation, according to the present invention, the solder plating layer provided in advance on the surface of the terminal is melted by heating and the terminal is connected to the electrode, so that soldering can be performed while supplying solder one by one. There is no need to do this, making the work easier and suitable for continuous production. In addition, the amount of solder adhered is constant, and there is no risk of excess solder flowing out and interfering with other components, making it ideal for small electronic components. Moreover, a stable electrical connection can be achieved between electrodes having a thin film thickness.

【図面の簡単な説明】[Brief explanation of drawings]

第1図ないし第18図は本発明に係る可変抵抗器の第1
実施例を示し、第1図は端子付き抵抗基板の平面図、第
2図は組立て前の端子の平面図、第3図は基板をケース
にてインサートモールドした状態の半断面平面図、第4
図は第3図の側面図、第5図は第3図のI−I線断面図
、第6図は第3図の底面図、第7図は摺動子をインサー
トモールドしたロータの平面図、第8図は第7図のII
−I線断面図、第9図は第7図の底面図、第10図、第
11図はそれぞれ摺動子の接点部の撓みを示す説明図、
第12図は組立てられた可変抵抗器の半断面平面図、第
13図は第12図の■−■線断面図、第14図は第12
図の底面図、第15図はプリント基板に設けた挿通孔の
標準ピッチを示す平面図、第16図は同挿通孔の変則ピ
ッチを示す平面図、第17図は標準ピッチ及び変則ピッ
チに設定される端子の突出位置を示すケースの側面図、
第18図は端子の折曲状態を示す斜視図である。 第19図は第2実施例を示し、ロータの一部を切り欠い
た可変抵抗器の斜視図である。 1・・・抵抗基板、2・・・ケース、3・・・ロータ、
4・・・摺動子、4d、 4f・・・接点部、6・・・
抵抗体、6a、 6b・・・電極、7・・・コレクタ電
極、9,10.11・・・端子、40・・・摺動子、4
5・・・ロータ、50・・・基板、55・・・抵抗体、
55a、55b−−−電極、56・・−Illレクタ電
極、61.62.63・・・端子。 特許出願人  株式会社村田製作所
FIGS. 1 to 18 show a first diagram of a variable resistor according to the present invention.
Embodiments are shown; Fig. 1 is a plan view of a resistor board with a terminal, Fig. 2 is a plan view of the terminal before assembly, Fig. 3 is a half-sectional plan view of the board inserted into a case, and Fig. 4 is a plan view of a resistor board with a terminal.
The figure is a side view of Fig. 3, Fig. 5 is a sectional view taken along the line I-I of Fig. 3, Fig. 6 is a bottom view of Fig. 3, and Fig. 7 is a plan view of the rotor with insert molded sliders. , Figure 8 is II of Figure 7.
- I line sectional view, FIG. 9 is a bottom view of FIG. 7, FIGS. 10 and 11 are explanatory diagrams showing the deflection of the contact portion of the slider, respectively,
FIG. 12 is a half-sectional plan view of the assembled variable resistor, FIG. 13 is a sectional view taken along the line ■-■ in FIG. 12, and FIG.
Fig. 15 is a plan view showing the standard pitch of the insertion holes provided in the printed circuit board, Fig. 16 is a plan view showing the irregular pitch of the insertion holes, and Fig. 17 is a plan view showing the standard pitch and irregular pitch of the insertion holes. side view of the case showing the protruding position of the terminal,
FIG. 18 is a perspective view showing the terminal in a bent state. FIG. 19 shows a second embodiment, and is a perspective view of a variable resistor with a part of the rotor cut away. 1... Resistance board, 2... Case, 3... Rotor,
4...Slider, 4d, 4f...Contact part, 6...
Resistor, 6a, 6b... Electrode, 7... Collector electrode, 9, 10.11... Terminal, 40... Slider, 4
5... Rotor, 50... Substrate, 55... Resistor,
55a, 55b---electrode, 56...-Ill rectifier electrode, 61.62.63...terminal. Patent applicant Murata Manufacturing Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 1.端子材の表面に予め半田メッキを施し、該半田メッ
キ部を電極部に当接させて加熱し、端子材と該電極部を
電気的に接続したことを特徴とする端子の接続構造。
1. A terminal connection structure characterized in that the surface of a terminal material is pre-plated with solder, the solder plated portion is brought into contact with an electrode portion and heated, and the terminal material and the electrode portion are electrically connected.
2.表面に抵抗体を設けた基板に対して摺動子を備えた
ロータが回動可能に取り付けられた可変抵抗器において
、 端子の表面に予め半田メッキを施し、該半田メッキ部を
基板上の抵抗体の端部に設けた電極又はコレクタ電極に
当接させて加熱し、端子と抵抗体又はコレクタ電極とを
電気的に接続したことを特徴とする可変抵抗器。
2. In a variable resistor in which a rotor with a slider is rotatably attached to a board with a resistor on its surface, the surface of the terminal is solder-plated in advance, and the solder-plated part is connected to the resistor on the board. 1. A variable resistor, characterized in that the terminal is electrically connected to the resistor or the collector electrode by contacting the electrode or the collector electrode provided at the end of the variable resistor and heating the resistor.
JP27990788A 1988-11-05 1988-11-05 Connecting structure of terminal and variable resistor provided with such connecting structure Pending JPH02126601A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP27990788A JPH02126601A (en) 1988-11-05 1988-11-05 Connecting structure of terminal and variable resistor provided with such connecting structure
KR1019890015984A KR900008545A (en) 1988-11-05 1989-11-04 Variable resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27990788A JPH02126601A (en) 1988-11-05 1988-11-05 Connecting structure of terminal and variable resistor provided with such connecting structure

Publications (1)

Publication Number Publication Date
JPH02126601A true JPH02126601A (en) 1990-05-15

Family

ID=17617580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27990788A Pending JPH02126601A (en) 1988-11-05 1988-11-05 Connecting structure of terminal and variable resistor provided with such connecting structure

Country Status (1)

Country Link
JP (1) JPH02126601A (en)

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