JPH02126504A - Circuit board device - Google Patents

Abstract

PURPOSE:To eliminate play between a circuit board and a casing by forming a plurality of irregularities on the circumference of the circuit board and bringing the circuit board into resilient contact with the inner surface of the casing. CONSTITUTION:A casing 1 is constituted by joining a cover 2 and a partition cylinder 3 together. A circuit board 16 is placed on a stepped portion 17 provided on the partition cylinder 3 and secured to the cylinder with depressing pawls 18,.... A plurality of irregularities 19,... are formed on the circumference of the circuit board 16. The multitude of irregularities thus formed are brought into resilient contact with the inner surface of the casing. As a result, no play is produced between the circuit board and the casing even if there are dimensional errors between the circuit board and the casing. Furthermore, there is no need for the injection of adhesive, number of work processes is reduced, and disadvantages such as thermal deterioration is eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a circuit board device in which a circuit board including circuit components is fitted and attached to the inner surface of a casing.

(Prior Art) For example, conventionally, a ballast or high-frequency lighting circuit component is housed in a cover (casing) with a screw-in base for an incandescent lamp attached to one end, and a fluorescent lamp,
Fluorescent lamp assemblies have been developed that include bent fluorescent lamps, such as U-shaped, W-shaped, saddle-shaped, etc. shaped fluorescent lamps.

This type of fluorescent lamp device is becoming popular as an energy-saving light source because it is compatible with incandescent light bulbs.

In such a fluorescent lamp device, when the ballast or high-frequency lighting circuit components are housed in the cover, a structure is adopted in which these circuit components are mounted on a circuit board and this circuit board is housed in the cover. Furthermore, in this case, the circuit board is inserted into the cover and supported by the locking claws provided on the cover.

(Problem to be Solved by the Invention) However, in the above conventional case, rattling occurs due to dimensional errors between the circuit board and the cover, and when vibration is applied, not only rattling noise is generated. This will give vibration to the mounted circuit components, and there is a risk that soldering may cause parts to peel off or short circuits to occur.

In order to prevent such problems, attempts have been made to inject adhesive between the circuit board and the cover, but this increases the amount of adhesive injection process and also reduces the heat transferred from the circuit components and lamps. This causes problems such as the adhesive deteriorating over time.

The present invention aims to provide a circuit board device that prevents rattling between the circuit board and the casing and improves life characteristics.

[Structure of the Invention] (Means for Solving the Problems) The present invention forms a large number of unevenness on the circumferential surface of a circuit board, makes these unevenness come into elastic contact with the inner surface of the casing, and fits the circuit board into the casing. It is characterized by a combination of

(Function) According to the present invention, since the many irregularities formed on the circumferential surface of the circuit board come into elastic contact with the inner surface of the casing, rattling can be prevented even if there is a dimensional error between the circuit board and the casing. do not have. Therefore, no adhesive injection is required;
As the number of work steps is reduced, problems such as thermal deterioration are also eliminated.

(Example) The present invention will be described below based on an example shown in the drawings.

This embodiment is applied to a fluorescent lamp device, and FIG. 3 is a sectional view of the entire fluorescent lamp device in an assembled state.

In the figure, 1 is a casing made of synthetic resin, and this casing 1 is constructed by combining a cover 2 and a partition tube 3.

A cylindrical member 4 is protruded from one end of the cover 2, and an E26 type screw base 5, for example, is fixed to the cylindrical member 4 by adhesive or caulking.

The partition tube 3 is attached to the opening at the other end of the cover 2.

A fixing plate 6 is fixed to the partition tube 3 with adhesive, and this fixing plate 6 closes the lower end opening of the partition tube 3.

The fixed plate 6 includes a pair of partition walls 78 spaced apart in the axial direction, and these partition walls 7 and 8 are opposed to each other with a predetermined distance between them by a connecting rib 9 interposed between them. Therefore, a heat insulating air layer IO is formed between these partition walls 7 and 8 which are spaced apart and facing each other. The heat insulating air layer 10 communicates with the outside over the entire circumference.

A plurality of locking claws 11 are formed at the upper end of the partition tube 3 whose bottom portion is closed by such a fixing plate 6, and these locking claws 11... It is locked in a locking recess 12 formed in the opening. As a result, the partition tube 3 is fixed to the cover 2, and the opening at the other end of the cover 2 is closed.

Therefore, the inside of the cover 2 constitutes a room 13 separated from the outside.

A high frequency lighting circuit component 15 as a circuit component is housed in the chamber 13 within the cover 2.

The high-frequency lighting circuit components 15 include a known full-wave rectifier, an aluminum electrolytic capacitor, a transistor, a resonance capacitor, an oscillation coil, a fuse, etc. (not shown in detail), and these lighting circuit components 15 are mounted on a circuit board 16.

The circuit board 16 is placed on a step 17 provided on the partition tube 3 and fixed to the partition tube 3 by presser claws 18 .

In this case, a large number of irregularities 19 are formed on the circumferential surface of the circuit board 16, as shown in FIGS. 1 and 2.

These unevenness 19... have a height of 1 mm or less, and since the circuit board 16 is made of insulating synthetic resin, these unevenness 19... can be slightly elastically deformed. As shown in FIG. 2, the convex portions of the projections and depressions 19 elastically abut against the inner surface of the partition tube 3, so that the circuit board 6 is fitted onto the inner surface of the partition tube 3.

In addition, as shown in FIG. 4, such a circuit board 16 is prepared by cutting out material into a large shape in advance, forming a perforation-like cutout portion 30, and printing the circuit board 16 in such a large shape. Wiring, fluxing, lighting circuit parts 1
After completing the predetermined assembly process such as mounting 5, soldering these parts, and removing residual flux, the product can be made into a predetermined size by finally cutting at the perforation-shaped cutout portion 30. can.

In this case, when cutting is performed at the perforation-shaped cutout portion 30, the cutout remains on this cut surface, and the unevenness 19.
・can utilize this residual Paris.

The other partition wall 8 of the fixed plate 6 has a fluorescent lamp,
For example, a bent fluorescent lamp 20 is attached.

The bent fluorescent lamp 20 may be U-shaped, W-shaped, etc., but in this embodiment, a fluorescent lamp in which three U-shaped glass bulbs are connected to form a meandering discharge path is used. There is.

Each end of this fluorescent lamp has electrodes 21 and 21, respectively.
The inner surface is coated with a phosphor coating (not shown), and a predetermined amount of inert gas such as mercury and argon is sealed inside.

Such a bent fluorescent lamp 20 has an adhesive 2 at the end.
It is fixed to the partition wall 8 via 2.

Incidentally, the adhesive portion at the end of the fluorescent lamp 20 is covered and hidden by a cylindrical cover portion 25 fixed to the partition wall 8 with an adhesive or the like.

In the fluorescent lamp device having such a configuration, the circuit board 16 on which the lighting circuit component 15 is mounted is placed on the stepped portion 17 provided in the partition tube 3, and the partition tube 3 is held down by the presser claws 18. is fixed. In this case, a large number of unevenness 19... are formed on the circumferential surface of the circuit board 16, and these unevenness 19... are made to elastically contact the inner surface of the partition tube 3 as shown in FIG. 3, there is no need to worry about the circuit board 16 shaking against the partition tube 3. In other words, even if there is a dimensional error in the circuit board 1G and the partition tube 3 during molding, the convex portions of the unevenness 19 are slightly elastically deformed and elastically contact the inner surface of the partition tube 3, thereby eliminating the variation. As a result, the circuit board 16 is pressed against and fixed to the partition tube 3.

Therefore, the occurrence of rattling noise is prevented, and problems such as peeling off of soldered parts of the mounted circuit component 15 and occurrence of short circuits are eliminated.

In addition, there is no need to inject adhesive to prevent rattling, and the adhesive does not deteriorate over time, resulting in improved longevity.

Note that, as shown in FIG. 4, the circuit board 16 is cut into a large shape in advance, and a perforation-shaped cutout portion 30 is formed, and the circuit board 16 is cut at this cutout portion 30. The cut edges remain on the cut surface of the cigarette, and this remaining edge can be used to bind the unevenness 19..., so there is no need to form the unevenness 19... and the unevenness can be easily created. .

Further, as shown in FIG. 4, the circuit board 16 is cut into a large shape in advance, and a perforation-like cutout portion 3 is prepared.
0 is formed, and predetermined assembly processes such as printed wiring, flux application, mounting of the lighting circuit components 15, soldering of these components, and removal of residual flux are carried out in such a large shape. , the back side of the circuit board 16 (
When applying flux to the lower surface, the flux is less likely to go around and be applied to the upper surface. In other words, when applying flux to the back surface (lower surface) of the circuit board 16, the back surface of the circuit board 16 is immersed in a bath of molten flux, and the flux is applied only to this lower surface. Due to the shaking, the top surface of the circuit board 16 is covered with waves of flux, and the flux may adhere to the top surface of the circuit board 1B, which should not be attached. However, if a plate-like material that is sufficiently larger than the circuit board 16 of a predetermined size is immersed in the molten flux bath as described above, the fluctuation of the flux liquid level will cause the upper surface of the plate material to be undulated by the flux. Even if the flux is covered, the flux does not reach the upper surface of the circuit board 16 of a predetermined size surrounded by the perforation-shaped cutout area 30. Flux is less likely to adhere to mounted circuit components. Therefore, when removing residual flux from soldering of the lighting circuit component 15 later, only the back side needs to be removed, making the removal work easier, and thus the flux can be removed satisfactorily. Residual flux is on circuit board 1
Although there is a risk of deterioration of the withstand voltage of No. 6, the above method has the advantage that no residual flux is generated.

Note that the present invention is not limited to the above embodiments.

That is, although the above embodiment describes a circuit board on which lighting circuit components of a fluorescent lamp device are mounted, the present invention is not limited to a fluorescent lamp device, and can be applied to any structure in which a circuit board is fitted into a casing. It is possible to implement it if

In addition, in the case of a fluorescent lamp device, the fluorescent lamp 20 is not limited to a type in which it is used as exposed, but a fluorescent lamp having a structure in which a bent fluorescent lamp is covered with a transparent or semi-transparent glove is used. Even a light lamp device can be implemented.

Furthermore, it is also possible to use a choke coil type ballast as the lighting circuit component in addition to the high frequency lighting circuit component.

The casing l is not limited to the cover 2 and the partition tube 3.

[Effects of the Invention] As explained above, according to the present invention, the large number of irregularities formed on the circumferential surface of the circuit board come into elastic contact with the inner surface of the casing, so that even if there is a dimensional error between the circuit board and the casing, it is not possible to wobble. Does not cause sticking. Therefore, since there is no wobbling of the circuit board, the seismic strength of the components mounted thereon is improved, and peeling of soldered parts can be prevented.

In addition, there is no need to inject adhesive, which reduces the number of work steps and eliminates problems such as thermal deterioration of the adhesive.
It will have a long life.

[Brief explanation of drawings]

The drawings show an embodiment in which the present invention is applied to a fluorescent lamp device, and FIG. 1 is an exploded perspective view of the main parts of the fluorescent lamp device, and FIG. 2 is an enlarged plan view of the part ▪ in FIG. 3. , FIG. 3 is a cross-sectional view of the entire structure, and FIG. 4 is a plan view showing an example of how materials are taken for the circuit board. DESCRIPTION OF SYMBOLS 1... Casing, 2... Cover, 3... Partition tube, 5... Base, 6... Fixed plate, 15... High frequency lighting circuit component, 1B... Circuit board,
20... Bent fluorescent lamp. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 3

Claims (1)

[Scope of Claims] A circuit board device in which a circuit board on which circuit components are mounted is fitted into the inner surface of a casing and this circuit board is attached to the casing, wherein a large number of irregularities are formed on the circumferential surface of the circuit board, A circuit board device characterized in that the circuit board is fitted into the casing by bringing these unevenness into elastic contact with the inner surface of the casing.