JPH0212389B2 - - Google Patents
Info
- Publication number
- JPH0212389B2 JPH0212389B2 JP58223954A JP22395483A JPH0212389B2 JP H0212389 B2 JPH0212389 B2 JP H0212389B2 JP 58223954 A JP58223954 A JP 58223954A JP 22395483 A JP22395483 A JP 22395483A JP H0212389 B2 JPH0212389 B2 JP H0212389B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- film
- light
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000011231 conductive filler Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 12
- 239000002313 adhesive film Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
Description
【発明の詳細な説明】
本発明は異方導電性を有する接着シートおよび
フイルム（以下異方導電膜と称す）を用いた回路
の接続方法を関し、その目的とするところは、よ
り精度の高い回路の接続を比較的簡単に得ること
のできる回路の接続方法を提供することにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit connection method using an adhesive sheet and film having anisotropic conductivity (hereinafter referred to as anisotropic conductive film). It is an object of the present invention to provide a circuit connection method that allows circuit connection to be obtained relatively easily.
従来より電子産業において、集積回路、発光ダ
イオード、液晶やEL（エレクトロルミネツセン
ス）等の表示装置などの微細な電子部品間あるい
は部品の基板への装着等の回路接続方法として、
ハンダあるい導電性接着剤による接続が行なわれ
てきた。 Conventionally, in the electronics industry, it has been used as a circuit connection method for connecting minute electronic components such as integrated circuits, light emitting diodes, display devices such as liquid crystals and EL (electroluminescence), or for attaching components to substrates.
Connections have been made using solder or conductive adhesive.
ところが部品の微細化に伴ない、特に接続端子
などが細かいピツチで並んでいる場合において
は、これら接続材が等方導電性であるため、隣り
同士の回路が互いに接続しないように細心の注意
を払つても要求に追随できなくなつてきた。 However, with the miniaturization of components, especially when connecting terminals are lined up at a fine pitch, these connecting materials are isotropically conductive, so great care must be taken to prevent adjacent circuits from connecting to each other. It has become impossible to keep up with the demand even after paying.
そこで異方導電物質による接続が行なわれるよ
うになつてきた。すなわち厚み方向に導電性を、
面方向の少くとも１方向には絶縁性を有する、異
方導電ゴムや異方導電性接着剤などを用いる方法
であるが、これら物質も以下に述べる欠点を有し
ている。まず異方導電ゴム類は電気的異方性は得
られても接続の為にネジ止めあるいは機械的な押
圧力などによる別途固定手段が必要であるため工
程が煩雑となり、導電性の信頼性も低かつた。異
方導電性接着剤による方法では接着剤中に含有す
る溶剤のために環境汚染が問題となり、また均一
厚みを得ることも難かしいことからやはり導電性
の信頼性が低かつた。これら従来技術の改良を目
的として、異方導電性着膜が提案されているが、
以下に述べるようにやはり欠点を有していた。異
方導電性接着膜の製造方法としては
(1) 導電性充填剤の粉径とほゞ等しい厚さのシー
ト状（特開昭51−21192）あるいは粉径が10μ
ｍ以上の比較的大きな導電性充填剤を分散して
フイルム状とするもの、（特開昭55−104007、
特開昭56−122193）。 Therefore, connections using anisotropically conductive materials have come to be used. In other words, conductivity in the thickness direction,
This method uses an anisotropic conductive rubber, an anisotropic conductive adhesive, or the like, which has insulating properties in at least one plane direction, but these materials also have the following drawbacks. First, even though anisotropically conductive rubbers can achieve electrical anisotropy, they require additional fixing means such as screws or mechanical pressure for connection, making the process complicated and reducing the reliability of conductivity. It was low. In the method using an anisotropic conductive adhesive, environmental pollution is a problem due to the solvent contained in the adhesive, and it is also difficult to obtain a uniform thickness, so the reliability of conductivity is low. Anisotropically conductive deposited films have been proposed for the purpose of improving these conventional techniques;
It also had drawbacks as described below. The method for manufacturing an anisotropic conductive adhesive film is as follows: (1) A sheet with a thickness approximately equal to the powder diameter of the conductive filler (Japanese Patent Application Laid-Open No. 51-21192) or a powder with a diameter of 10 μm.
A film made by dispersing a relatively large conductive filler of m or more (Japanese Patent Application Laid-Open No. 104007/1983
(Japanese Patent Publication No. 56-122193).
(2) 導電性充填剤として繊維状物を用いて略一定
方向にそろえるもの（特開昭555−763）。(2) A fibrous material used as a conductive filler and arranged in a substantially constant direction (Japanese Patent Laid-Open No. 555-763).
(3) 磁場中で導電性充填剤を配向するもの（特開
昭53−3695）に大別される。(3) It is broadly divided into those in which conductive fillers are oriented in a magnetic field (Japanese Patent Application Laid-open No. 53-3695).
これら３種の製造方法により得られた異方導電
性接着膜に共通していることは、透明性が全くな
いかほゞ不透明の外観を呈していることである。
異方導電性接着膜が不透明であると回路の位置合
せに多大の労力を必要とし、接続部以外で合わせ
マーク等による位置合わせを必要とするために、
回路基材の熱収縮などによるパターンの位置合せ
不良を生じ易い欠点を有する。 What the anisotropically conductive adhesive films obtained by these three manufacturing methods have in common is that they have no transparency or a nearly opaque appearance.
If the anisotropic conductive adhesive film is opaque, it will take a lot of effort to align the circuit, and alignment using alignment marks etc. will be required at areas other than the connection areas.
It has the disadvantage that pattern alignment is likely to occur due to heat shrinkage of the circuit substrate.
本発明は上記欠点に鑑みてなされたものであ
り、回路の相互接続材として透明性を有する異方
導電性接着膜を用いて回路の位置合わせを光学的
に行ない、信頼性にすぐれた高精度の回路接続方
法を提供せんとするものである。 The present invention was made in view of the above-mentioned drawbacks, and uses a transparent anisotropic conductive adhesive film as a circuit interconnection material to optically align circuits, thereby achieving highly reliable and high precision. The purpose of this invention is to provide a method for connecting circuits.
以下本発明を実施例を示す図面を参照しながら
説明すると、第１図において１は異方導電性接着
膜であり、透明性を有し膜の厚み方向には導電性
を膜の面方向には絶縁性を有し合わせて接着機能
を有する膜が適用可能である。ここでいう透明性
とはJIS Ｋ−6714による全光線透過率で、40％以
上が必要であり全光線透過率の高い方が好まし
く、40％以下では、光線透過量が少なくて回路の
光学的位置合わせが不可能となる。 The present invention will be described below with reference to drawings showing embodiments. In FIG. 1, reference numeral 1 denotes an anisotropic conductive adhesive film, which has transparency and conductivity in the thickness direction of the film. A film having an insulating property and an adhesion function can be applied. Transparency here refers to the total light transmittance according to JIS K-6714, which requires 40% or more, and higher total light transmittance is preferable.If it is less than 40%, the amount of light transmitted is small and the optical Positioning becomes impossible.
異方導電性については、膜の厚み方向には導電
性を面方向には絶縁性を示すものが適用される
が、厚み方向の抵抗としては103Ω−cm以下が好
ましく、さらに面方向の抵抗としては106Ω−cm
以上が好ましい。 Regarding anisotropic conductivity, a film that exhibits conductivity in the thickness direction and insulating property in the plane direction is applied, but the resistance in the thickness direction is preferably 10 3 Ω-cm or less, and the resistance in the plane direction is The resistance is 10 6 Ω-cm
The above is preferable.
接着機能については、加圧あるいは加熱加圧等
の何らかの手段により接着性を発現できれば適用
可能であり、回路面との接着力は高い方が接続の
信頼性が高いことから好ましい。 As for the adhesive function, it can be applied as long as adhesiveness can be expressed by some means such as pressurization or heating and pressurization, and it is preferable that the adhesive force with the circuit surface is high because the reliability of the connection is high.
これらの特性を満足する異方導電性接着膜の製
法としては、絶縁性接着剤中に導電性充填剤を10
体積％以下と、比較的小量分散混合し磁場下で導
電性充填剤を厚み方向に配列し膜状に構成したも
のが代表的であるが、その製法は問わない。 The method for manufacturing an anisotropically conductive adhesive film that satisfies these properties is to add a conductive filler to an insulating adhesive.
A typical example is one in which the conductive filler is dispersed and mixed in a relatively small amount (not more than vol. %) and arranged in the thickness direction under a magnetic field to form a film, but any manufacturing method may be used.
２および３は回路基板４および５に形成された
回路であり、各回路基板は一体化されている。 2 and 3 are circuits formed on circuit boards 4 and 5, and each circuit board is integrated.
回路２と回路３を接続するとき、その間に異方
導電接着膜１を介在させるものとする。 When connecting circuit 2 and circuit 3, an anisotropically conductive adhesive film 1 is interposed between them.
介在の方法としては、回路２および回路３の中
間に非接触の状態で存在しても良いし、回路２お
よび回路３のどちらか片面に接触あるいは接着し
ている状態でも可能である。 As for the intervening method, it may be present between the circuit 2 and the circuit 3 in a non-contact state, or it may be in a state where it is in contact with or adhered to one side of either the circuit 2 or the circuit 3.
６は光源であり、通常の電灯や蛍光灯類でも可
能であるが、集光装置を備えたものが好ましく、
さらに光の直線性の点からレーザー光などが好ま
しい。 6 is a light source, which can be a normal electric lamp or fluorescent lamp, but it is preferably equipped with a light condensing device.
Further, from the viewpoint of linearity of light, laser light or the like is preferable.
この時光源側の回路基板４が光線を透過する性
質を有すると、光源６の光は回路基板４を透過
し、回路部２を透過せずに回路パターンの映像は
異方導電膜１に伝わる。 At this time, if the circuit board 4 on the light source side has the property of transmitting light, the light from the light source 6 will pass through the circuit board 4, and the image of the circuit pattern will be transmitted to the anisotropic conductive film 1 without passing through the circuit section 2. .
異方導電膜１は透明性を有するために、パター
ンの一部あるいは全部が回路５に到達し、たとえ
ば光センサーを備えた駆動装置７上の回路３およ
び基板５よりなる回路板は、前記映像と一致する
ように前後左右に駆動し位置合せが完了となり、
同時に回路板Ａと加圧、あるいは加熱加圧により
異方導電膜の接着機能により接続される。またも
つとも簡単には、基材４および５に位置合せマー
ク８，９を施しておき、光源６を利用して位置合
せを完了することもできる。一方、回路基板５が
不透明の場合には、光源６の光線は異方導電性接
着膜１を透過後回路３および回路基板５に到達
し、基板５と回路３あるいは位置合わせマーク９
における段差や光線反射率の差を信号として反射
光となる。この反射光は異方導電性接着膜１およ
び回路基板４を透過して光源側に到る。 Since the anisotropic conductive film 1 has transparency, part or all of the pattern reaches the circuit 5. For example, a circuit board consisting of a circuit 3 and a substrate 5 on a drive device 7 equipped with an optical sensor is The alignment is completed by driving it forward, backward, left and right so that it matches the
At the same time, it is connected to the circuit board A by the adhesive function of the anisotropic conductive film by applying pressure or heating and pressing. Furthermore, it is also possible to simply apply alignment marks 8 and 9 to the base materials 4 and 5 and complete alignment using the light source 6. On the other hand, when the circuit board 5 is opaque, the light beam from the light source 6 passes through the anisotropic conductive adhesive film 1 and reaches the circuit 3 and the circuit board 5, and the light beam from the light source 6 reaches the circuit 3 and the circuit board 5.
Reflected light is generated using the difference in level and light reflectance as a signal. This reflected light passes through the anisotropic conductive adhesive film 1 and the circuit board 4 and reaches the light source side.
この反射光と回路２あるいは位置合わせマーク
９との一致点を、たとえば光センサで検出し、駆
動装置７を連動することにより位置合わせが可能
である。 By detecting the point where this reflected light coincides with the circuit 2 or the alignment mark 9 using, for example, an optical sensor and interlocking the driving device 7, alignment is possible.
以上詳述したように、本発明による路の接続方
法においては異方導電性着膜が全光線透過率40％
以上の透明膜であり、２種の回路板の接続を光学
的手段により行なえることから、回路の位置合わ
せ精度が高い。また異方導電性を有することから
微細回路に適用可能であり、接着機能を有するこ
とから位置合わせと同時に接着固定することが可
能となり、回路接続時の作業工程を自動化できる
ので位置合わせ精度の向上と、大幅な省力化が可
能となる。 As detailed above, in the path connection method according to the present invention, the anisotropically conductive deposited film has a total light transmittance of 40%.
Since this is a transparent film and two types of circuit boards can be connected by optical means, the precision of positioning the circuits is high. In addition, because it has anisotropic conductivity, it can be applied to fine circuits, and because it has an adhesive function, it can be bonded and fixed at the same time as alignment, and the work process when connecting circuits can be automated, improving alignment accuracy. This enables significant labor savings.
第１図は回路位置合わせを示す模式断面図であ
る。
符号の説明、１……異方導電性接着膜、２……
回路Ａ、３……回路Ｂ、４……回路基板Ａ、５…
…回路基板Ｂ、６……光源、７……駆動装置。
FIG. 1 is a schematic cross-sectional view showing circuit alignment. Explanation of symbols, 1... Anisotropic conductive adhesive film, 2...
Circuit A, 3...Circuit B, 4...Circuit board A, 5...
...Circuit board B, 6...Light source, 7...Drive device.
Claims (1)
位置合わせマークを形成してなる回路基板と、該
回路基板の回路面に対峙して回路および／または
位置合わせマークを形成してなる回路基板の間
に、10体積％以下の導電性充填剤を含有させた絶
縁性接着剤からなり、全光線透過率（JIS Ｋ−
6714）が40％以上を有する異方導電性膜を介在さ
せた状態で、前記回路または位置合わせマークに
より光学的に両回路の位置合わせを行い、次いで
両回路基板を接合することを特徴とする回路の接
続方法。1. Between a circuit board formed by forming a circuit and/or alignment mark on a light-transmitting substrate and a circuit board formed by forming the circuit and/or alignment mark facing the circuit surface of the circuit board. It is made of an insulating adhesive containing 10% by volume or less of a conductive filler, and has a total light transmittance (JIS K-
6714) with an anisotropic conductive film having 40% or more interposed therebetween, optically aligning both circuits using the circuit or alignment mark, and then bonding both circuit boards. How to connect the circuit.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22395483A JPS60117572A (en) | 1983-11-28 | 1983-11-28 | Method of connecting circuit |
| EP84306963A EP0140619B1 (en) | 1983-10-14 | 1984-10-11 | Anisotropic-electroconductive adhesive film and circuit connecting method using the same |
| DE8484306963T DE3486101T2 (en) | 1983-10-14 | 1984-10-11 | ANISOTROP ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND METHOD FOR CONNECTING CIRCUITS UNDER THEIR APPLICATION. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22395483A JPS60117572A (en) | 1983-11-28 | 1983-11-28 | Method of connecting circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60117572A JPS60117572A (en) | 1985-06-25 |
| JPH0212389B2 true JPH0212389B2 (en) | 1990-03-20 |
Family
ID=16806296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22395483A Granted JPS60117572A (en) | 1983-10-14 | 1983-11-28 | Method of connecting circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60117572A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5088376B2 (en) * | 2007-11-29 | 2012-12-05 | 日立化成工業株式会社 | Circuit member connecting adhesive and semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120941A (en) * | 1974-08-14 | 1976-02-19 | Seikosha Kk | DODENSEISETSUCHAKUZAI |
| JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
| JPS5337199A (en) * | 1976-08-10 | 1978-04-06 | Kebetsukushiyuu | Process for continuously preparing lithium carbonate |
-
1983
- 1983-11-28 JP JP22395483A patent/JPS60117572A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120941A (en) * | 1974-08-14 | 1976-02-19 | Seikosha Kk | DODENSEISETSUCHAKUZAI |
| JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
| JPS5337199A (en) * | 1976-08-10 | 1978-04-06 | Kebetsukushiyuu | Process for continuously preparing lithium carbonate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60117572A (en) | 1985-06-25 |
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