JPH02122368U

JPH02122368U -

Info

Publication number: JPH02122368U
Application number: JP8256488U
Authority: JP
Priority date: 1988-06-21
Filing date: 1988-06-21
Publication date: 1990-10-05

Description

[Brief explanation of drawings]

第１図は考案の一実施例である半導体装置の測
定装置示す正面断面図、第２図ａ，ｂは接触子と
接触板との開離および接触状態を示した動作説明
図、第３図ａ，ｂ，ｃはパレツトボードのハンド
リング状態を示す断面正面図、第３図ｄはパレツ
トボードの斜視図、第４図ａ，ｂはこの考案の他
の実施例を示す半導体装置の測定装置の斜視図お
よび正面断面図、第５図は従来の半導体装置の測
定装置の正面断面図を示す。図において、１……半導体装置、２……定盤、
３……ＩＣソケツト、４……パレツトボード、５
……ソケツトボード、９……計測機、１０……ピ
ンソケツト、１１……接触子、１２……接触子台
、１３……アクチエータ、１４……駆動アーム、
１５……接触板、１６……板、１７……円板を示
す。なお、図中、同一符号は同一、または相当部
分を示す。 Fig. 1 is a front sectional view showing a semiconductor device measuring device which is an embodiment of the invention, Figs. 2 a and b are operation explanatory diagrams showing the separation and contact states of the contact and the contact plate, and Fig. 3. Figures a, b, and c are cross-sectional front views showing handling conditions of the pallet board, Figure 3 d is a perspective view of the pallet board, and Figures 4 a and b are perspective views of a semiconductor device measuring device showing another embodiment of this invention. FIG. 5 shows a front sectional view of a conventional semiconductor device measuring device. In the figure, 1...semiconductor device, 2... surface plate,
3...IC socket, 4...Palette board, 5
... Socket board, 9 ... Measuring device, 10 ... Pin socket, 11 ... Contact, 12 ... Contact base, 13 ... Actuator, 14 ... Drive arm,
15... contact plate, 16... plate, 17... disk. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims

[Scope of utility model registration request]

In a measuring device for a semiconductor device in which a pallet board having a plurality of IC sockets mounted on the front surface and an electrode pattern on the back surface corresponding to each IC socket and connected to an electrode lead of the semiconductor device is handled and detached from the measuring device section, A measuring device for a semiconductor device, characterized in that the external electrode portion of the back surface pattern of a pallet board is unified regardless of the arrangement of contacts of the semiconductor device.