JPH02120836U - - Google Patents
Info
- Publication number
- JPH02120836U JPH02120836U JP1989029563U JP2956389U JPH02120836U JP H02120836 U JPH02120836 U JP H02120836U JP 1989029563 U JP1989029563 U JP 1989029563U JP 2956389 U JP2956389 U JP 2956389U JP H02120836 U JPH02120836 U JP H02120836U
- Authority
- JP
- Japan
- Prior art keywords
- bump
- ball
- thin
- gold
- gold alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001020 Au alloy Inorganic materials 0.000 claims description 4
- 239000003353 gold alloy Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029563U JPH0749794Y2 (ja) | 1989-03-15 | 1989-03-15 | ワイヤレスボンデイング用金バンプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029563U JPH0749794Y2 (ja) | 1989-03-15 | 1989-03-15 | ワイヤレスボンデイング用金バンプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02120836U true JPH02120836U (US06633600-20031014-M00021.png) | 1990-09-28 |
| JPH0749794Y2 JPH0749794Y2 (ja) | 1995-11-13 |
Family
ID=31253886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989029563U Expired - Lifetime JPH0749794Y2 (ja) | 1989-03-15 | 1989-03-15 | ワイヤレスボンデイング用金バンプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749794Y2 (US06633600-20031014-M00021.png) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4952973A (US06633600-20031014-M00021.png) * | 1972-09-22 | 1974-05-23 | ||
| JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
| JPS57163919A (en) * | 1981-03-20 | 1982-10-08 | Philips Nv | Method of forming protruded contact |
| JPS60134444A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | バンプ電極形成方法 |
| JPS62152143A (ja) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | バンプ形成方法 |
| JPS63173345A (ja) * | 1987-01-12 | 1988-07-16 | Nec Kansai Ltd | バンプ電極形成方法 |
| JPS63275127A (ja) * | 1987-05-07 | 1988-11-11 | Matsushita Electric Ind Co Ltd | 半導体チップの実装体 |
-
1989
- 1989-03-15 JP JP1989029563U patent/JPH0749794Y2/ja not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4952973A (US06633600-20031014-M00021.png) * | 1972-09-22 | 1974-05-23 | ||
| JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
| JPS57163919A (en) * | 1981-03-20 | 1982-10-08 | Philips Nv | Method of forming protruded contact |
| JPS60134444A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | バンプ電極形成方法 |
| JPS62152143A (ja) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | バンプ形成方法 |
| JPS63173345A (ja) * | 1987-01-12 | 1988-07-16 | Nec Kansai Ltd | バンプ電極形成方法 |
| JPS63275127A (ja) * | 1987-05-07 | 1988-11-11 | Matsushita Electric Ind Co Ltd | 半導体チップの実装体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749794Y2 (ja) | 1995-11-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |