JPH0212046A - Method for inspecting temperature distribution - Google Patents
Method for inspecting temperature distributionInfo
- Publication number
- JPH0212046A JPH0212046A JP16080988A JP16080988A JPH0212046A JP H0212046 A JPH0212046 A JP H0212046A JP 16080988 A JP16080988 A JP 16080988A JP 16080988 A JP16080988 A JP 16080988A JP H0212046 A JPH0212046 A JP H0212046A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board
- infrared
- temperature distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009826 distribution Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000002950 deficient Effects 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は実装されたプリント基板のエージングを行う場
合に、該プリント基板に疑似負荷を接続して通電し、プ
リント基板上の各部品の温度上昇の具合を検査して、各
部品が正常に動作しているか否かを判定するための温度
分布検査方法に関する。[Detailed Description of the Invention] [Industrial Application Field] When aging a mounted printed circuit board, the present invention connects a pseudo load to the printed circuit board and energizes it to measure the temperature of each component on the printed circuit board. The present invention relates to a temperature distribution inspection method for inspecting the degree of temperature rise and determining whether each component is operating normally.
部品が実装されたプリント基板の良否判定としては、部
品の誤挿入、ハンダ付け不良あるいは部品不良等がある
。The quality of the printed circuit board on which components are mounted may be determined by incorrect insertion of components, poor soldering, or defective components.
ところで、前記した部品の誤挿入やハンダ付け不良の検
査方法としては、目視による検査が一般的であり、また
、部品の不良は目視による検査では発見できないため、
プリント基板を製品に組み込み通電をしてみて正常に回
路が動作しないことから判断していた。By the way, visual inspection is a common method for inspecting the incorrect insertion of parts and poor soldering as described above, and since defective parts cannot be detected by visual inspection,
This was determined based on the fact that the circuit did not operate properly when the printed circuit board was installed in the product and the power was turned on.
［発明が解決しようとする課題］
しかし、前記した目視による検査方法にあっては、近年
は部品の小型化とプリント基板の集積化が進んでいるた
め、非常な困難を伴う作業になると共に、検査に熟練を
要する等の問題があった。[Problems to be Solved by the Invention] However, in the above-mentioned visual inspection method, as parts have become smaller and printed circuit boards have become more integrated, it has become a very difficult task. There were problems such as the need for skill in the inspection.
また、部品の不良は製品に組み込み動作させた時に判る
ものであるため、他の回路に悪影響を与える恐れがある
と共に、不良部品の発見も非常に面倒で熟練を要する等
の問題があった。Furthermore, since defective parts are known when they are assembled into a product and put into operation, there is a risk that it may have an adverse effect on other circuits, and finding defective parts is very troublesome and requires skill.
本発明は前記した問題点を解決せんとするもので、その
目的とするところは、部品を実装したプリント基板に通
電した状態において、赤外線をスキャンしながら照射し
温度分布を検査し、正常なプリント基板の温度分布とを
比較することにより不良個所を検出するものであるから
、部品の誤挿入、ハンダ付け不良および部品の不良を簡
単に発見できる温度分布検査方法を提供するにある。The present invention aims to solve the above-mentioned problems, and its purpose is to inspect the temperature distribution by scanning and irradiating infrared rays while the printed circuit board with components mounted is energized. It is an object of the present invention to provide a temperature distribution inspection method that can easily detect incorrect insertion of components, poor soldering, and defective components since defective locations are detected by comparing the temperature distribution with the temperature distribution of the board.
前記した目的を達成するために、本発明の温度分布検査
方法は、赤外線を発光する赤外線ランプと、該赤外線ラ
ンプよりの光を電子部品が実装されたプリント基板に向
かって照射すると共にスキャンするスキャニング手段と
、該スキャニング手段によりスキャンされプリント基板
より反射された赤外綿を受光しプリント基板上の発熱量
に応じた電気信号を出力する赤外線放射温度計と、該赤
外線放射温度計よりの出力を前記スキャンによる前記プ
リント基板の照射位置に対応したアドレス毎に記憶する
ＲＡＭ等の記憶手段とを具備した装置によって、正常な
プリント基板に通電を行った状態で該プリント基板の各
部の発熱量を計測して前記記憶手段に記憶し、次いで、
被計測プリント基板の各部の発熱量を計測して前記正常
なプリント基板の各部の発熱量とを比較し、部品の誤挿
入やハンダ付け不良あるいは部品不良等を判定するよう
にしたものである。In order to achieve the above object, the temperature distribution inspection method of the present invention includes an infrared lamp that emits infrared rays, and a scanning method that irradiates light from the infrared lamp toward a printed circuit board on which electronic components are mounted and scans it. means, an infrared radiation thermometer that receives the infrared cotton scanned by the scanning means and reflected from the printed circuit board, and outputs an electric signal corresponding to the amount of heat generated on the printed circuit board; Measure the heat generation amount of each part of the printed circuit board while the normal printed circuit board is energized by a device equipped with a storage means such as a RAM that stores each address corresponding to the irradiation position of the printed circuit board by the scanning. and stored in the storage means, and then,
The amount of heat generated in each part of the printed circuit board to be measured is compared with the amount of heat generated in each part of the normal printed circuit board to determine whether there is incorrect insertion of parts, poor soldering, or defective parts.
前記した如く構成された温度分布検査方法は、赤外線ラ
ンプよりの赤外線をスキャニング手段によって電子部品
が実装されたプリント基板に対してスキャンしながら照
射し、また、プリント基板で反射された前記赤外線を赤
外線放射温度計によって受光しプリント基板の発熱量に
応じた電気信号を得、この信号を前記スキャンによる前
記プリント基板の照射位置に対応したアドレス毎にＲＡ
Ｍ等の記憶手段に記憶し、正常なプリント基板に通電を
行った状態で前記計測方法に基づいてプリント基板の各
部の発熱量を記憶手段に記憶し、次いで、被計測プリン
ト基板の各部の発熱量を計測して前記正常なプリント基
板の各部の発熱量とを比較することにより、部品の誤挿
入やハンダ付け不良あるいは部品不良等を知ることがで
きるものである。In the temperature distribution inspection method configured as described above, infrared rays from an infrared lamp are scanned and irradiated onto a printed circuit board on which electronic components are mounted by a scanning means, and the infrared rays reflected by the printed circuit board are irradiated with infrared rays. The radiation thermometer receives the light and obtains an electric signal corresponding to the amount of heat generated by the printed circuit board, and this signal is sent to the RA for each address corresponding to the irradiation position of the printed circuit board by the scanning.
The amount of heat generated in each part of the printed circuit board to be measured is stored in the storage means such as M, and the amount of heat generated in each part of the printed circuit board to be measured is stored in the storage means based on the above measurement method while the normal printed circuit board is energized. By measuring the amount of heat generated and comparing it with the amount of heat generated in each part of the normal printed circuit board, it is possible to detect incorrect insertion of parts, poor soldering, or defective parts.
以下、本発明の一実施例を図面と共に説明するに、１は
被検査体である電子部品を実装したプリント基板、２は
赤外線ランプ、３は該赤外線ランプ２よりの不要な光線
を除去し赤外線のみを通過させるフィルタ、４は該フィ
ルタ３よりの赤外線をビーム状に集光する集光レンズ、
５は該集光レンズ４よりの赤外線を前記プリント基板１
に対しスキャンするためのミラーにして、モータ６によ
りて回転する。７はミラー５によって反射された赤外線
をプリント基板１の方向に反射すると共に該プリント基
板１よりの反射光を通過させるハーフミラ−１８は該ハ
ーフミラ−７を通過した赤外線のみを通過させるフィル
タ、９は該フィルタ８を連通した赤外線を熱として捉え
る画素の集合体である赤外線固体撮像素子を有する赤外
線放射温度計（以下赤外線カメラという）である。Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a printed circuit board on which an electronic component to be inspected is mounted, 2 is an infrared lamp, and 3 is an infrared lamp that removes unnecessary light from the infrared lamp 2. 4 is a condensing lens that condenses the infrared rays from the filter 3 into a beam shape;
5 directs the infrared rays from the condenser lens 4 to the printed circuit board 1.
It is rotated by a motor 6. 7 is a filter that reflects the infrared rays reflected by the mirror 5 toward the printed circuit board 1 and allows the reflected light from the printed circuit board 1 to pass; a half mirror 18 is a filter that passes only the infrared rays that have passed through the half mirror 7; This is an infrared radiation thermometer (hereinafter referred to as an infrared camera) having an infrared solid-state image sensor which is a collection of pixels that captures infrared rays communicated through the filter 8 as heat.
１０は赤外線カメラ９よりの出力であるアナログ信号を
デジタル信号に変換し５、パスラインに入力するＡ／Ｄ
変換器、１１は入出力回路１２を介してパスラインに接
続された同期回路にして、その出力が前記モータ６に接
続されている。そして、回期回路１１はプリント基板１
に対する赤外線ビームの照射位置とＲＡＭ１３に記憶す
るアドレスとが同期するように動作する。10 is an A/D that converts the analog signal output from the infrared camera 9 into a digital signal and inputs it to the pass line.
The converter 11 is a synchronous circuit connected to the pass line via an input/output circuit 12, and its output is connected to the motor 6. The periodic circuit 11 is connected to the printed circuit board 1
It operates so that the irradiation position of the infrared beam and the address stored in the RAM 13 are synchronized.
なお、１４は制御回路であるＣＰＵ、１５はデイスプレ
ー １６はプリンタ、１７はフロッピディスクである。In addition, 14 is a CPU which is a control circuit, 15 is a display, 16 is a printer, and 17 is a floppy disk.
次ぎに、前記した回路構成に基づいて動作を説明する。Next, the operation will be explained based on the circuit configuration described above.
まず、正常に動作する部品を実装したプリント基板ｌを
所定の固定位置に′Ｉｉ＆置すると共に疑似負荷を接続
して通電を行い、図示しないスタート釦を操作すると、
ＣＰＵ１４よりＲＡＭ１３に記憶するアドレスに対応し
てモータ６を駆動すべく出力が送出される。この出力は
入出力回路１２を介して同期回路１１に入力されるので
、モータ６はＲＡＭ１３に記憶されるアドレスに対応し
て回転され、ミラー５を回転する。一方、赤外線ランプ
２より発光される赤外線はフィルタ３、集光レンズ４を
介して前記ミラー５に入射されるので、該ミラー５で反
射されると共にハーフミラ−７で反射されプリント基板
１に照射される。この時、ミラー５がＲＡＭ１３のアド
レスに対応して回転しているので、ハーフミラ−７より
の赤外線はプリント基板ｌをスキャンすることとなる。First, place the printed circuit board l on which normally operating parts are mounted at a predetermined fixed position, connect a pseudo load, turn on the electricity, and operate the start button (not shown).
An output is sent from the CPU 14 to drive the motor 6 in accordance with the address stored in the RAM 13. Since this output is input to the synchronous circuit 11 via the input/output circuit 12, the motor 6 is rotated in accordance with the address stored in the RAM 13, thereby rotating the mirror 5. On the other hand, the infrared rays emitted from the infrared lamp 2 enter the mirror 5 via the filter 3 and the condensing lens 4, so that they are reflected by the mirror 5 and reflected by the half mirror 7, and are irradiated onto the printed circuit board 1. Ru. At this time, since the mirror 5 is rotating in accordance with the address of the RAM 13, the infrared rays from the half mirror 7 scan the printed circuit board 1.
このスキャンをしながらプリント基板１で反射された赤
外線は、バー°ノミラー７を透過してフィルタ８を介し
て赤外線カメラ９の赤外線固体撮像素子に入力される。The infrared rays reflected by the printed circuit board 1 during this scanning are transmitted through the vertex mirror 7 and input to the infrared solid-state imaging device of the infrared camera 9 via the filter 8.
そして、プリント基板１には通電が行われていることか
ら、抵抗素子等の発熱部品が発熱しているので、赤外線
カメラ９からはプリント基板１上の発熱量に応じたデー
タが出力される。この出力はＡ／Ｄ変換器ＩＯによりデ
ジタル信号に変換され、ＲＡＭ１３にプリント基板１の
アドレスに対応する位置に記憶される。すなわち、ＲＡ
Ｍ１３においてプリント基板１の全面積に対してアドレ
スが付されるので、各アドレスには発熱■に応じたデー
タが記憶される。Since the printed circuit board 1 is energized, heat-generating components such as resistive elements generate heat, and the infrared camera 9 outputs data corresponding to the amount of heat generated on the printed circuit board 1. This output is converted into a digital signal by the A/D converter IO and stored in the RAM 13 at a location corresponding to the address on the printed circuit board 1. That is, R.A.
Since addresses are assigned to the entire area of the printed circuit board 1 in M13, data corresponding to the heat generation (2) is stored in each address.
このようにして、正常なプリント基板ｌの各部における
発熱量に対応するデータをＲＡＭ１３内のアドレスに記
憶したら、このＲＡＭ１３内のデータを基準として、計
測しようとするプリント基板１のデータを前記したと同
様な方法により計測し、そのデータ同士をＣＰＵ１４に
おいて比較し、その結果をプリンタ１６あるいはデイス
プレ１５にて表示する。これにより、部品の誤挿入やハ
ンダ付け不良あるいは不良部品によって異常に発熱して
いる部分があれば、その部品やハンダ不良の部分が表示
されるので、部品の誤挿入、ハンダ付け不良あるいは不
良部品が判るものである。In this way, once the data corresponding to the amount of heat generated in each part of the normal printed circuit board 1 is stored in the addresses in the RAM 13, the data of the printed circuit board 1 to be measured is calculated based on the data in the RAM 13 as described above. Measurements are made using a similar method, the data are compared in the CPU 14, and the results are displayed on the printer 16 or display 15. As a result, if there is a part that is abnormally heated due to incorrectly inserted parts, bad soldering, or defective parts, that part or the part with bad soldering will be displayed. It can be seen that
本発明は前記したように、電子部品を実装したプリント
基板に通電した状態で、該プリント基板の各部の発熱量
を計測できるので、正常なプリント基板を計測した値と
被計測プリント基板との発熱量を比較することにより、
部品の誤挿入やハンダ付け不良あるいは部品不良等を被
接触でしかも節単に知ることができる等の効果を有する
ものである。As described above, the present invention can measure the amount of heat generated in each part of a printed circuit board on which electronic components are mounted while the circuit board is energized, so that the value measured for a normal printed circuit board and the heat generated by the measured printed circuit board By comparing the amounts,
This has the effect of being able to detect incorrect insertion of parts, poor soldering, defective parts, etc. without contact and in a simple manner.
図は本発明に係る温度分布検査方法を実施するための−
・例を示すブロック図である。
■・・・プリント基板、２・・・赤外線ランプ、５・・
・ミラー、６・・・モータ、９・・・赤外線放射温度計
（赤外線カメラ）、１０・・・Ａ／Ｄ変換器、１１・・
・同期回路、１３・・・ＲＡＭやThe figure shows a method for carrying out the temperature distribution inspection method according to the present invention.
- It is a block diagram showing an example. ■...Printed circuit board, 2...Infrared lamp, 5...
・Mirror, 6...Motor, 9...Infrared radiation thermometer (infrared camera), 10...A/D converter, 11...
・Synchronous circuit, 13...RAM and
Claims (1)
の光を電子部品が実装されたプリント基板に向かって照
射すると共にスキャンするスキャニング手段と、該スキ
ャニング手段によりスキャンされプリント基板より反射
された赤外線を受光しプリント基板上の発熱量に応じた
電気信号を出力する赤外線放射温度計と、該赤外線放射
温度計よりの出力を前記スキャンによる前記プリント基
板の照射位置に対応したアドレス毎に記憶するＲＡＭ等
の記憶手段とを具備した装置によって、正常なプリント
基板に通電を行った状態で該プリント基板の各部の発熱
量を計測して前記記憶手段に記憶し、次いで、被計測プ
リント基板の各部の発熱量を計測して前記正常なプリン
ト基板の各部の発熱量とを比較し、部品の誤挿入やハン
ダ付け不良あるいは部品不良等を判定するようにしたこ
とを特徴とする温度分布検査方法。an infrared lamp that emits infrared rays; a scanning means that irradiates light from the infrared lamp toward a printed circuit board on which electronic components are mounted and scans the same; and a scanning means that receives infrared rays scanned by the scanning means and reflected from the printed circuit board. an infrared radiation thermometer that outputs an electrical signal according to the amount of heat generated on the printed circuit board, and a RAM or the like that stores the output from the infrared radiation thermometer for each address corresponding to the irradiation position of the printed circuit board by the scanning. A device equipped with a storage means measures the amount of heat generated in each part of a normal printed circuit board while the circuit board is energized and stores it in the storage means, and then measures the amount of heat generated in each part of the printed circuit board to be measured. A method for inspecting temperature distribution, characterized in that the amount of heat generated in each part of the normal printed circuit board is measured and compared with the amount of heat generated in each part of the normal printed circuit board to determine incorrect insertion of parts, poor soldering, defective parts, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16080988A JPH0212046A (en) | 1988-06-30 | 1988-06-30 | Method for inspecting temperature distribution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16080988A JPH0212046A (en) | 1988-06-30 | 1988-06-30 | Method for inspecting temperature distribution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212046A true JPH0212046A (en) | 1990-01-17 |
Family
ID=15722898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16080988A Pending JPH0212046A (en) | 1988-06-30 | 1988-06-30 | Method for inspecting temperature distribution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212046A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05172772A (en) * | 1991-12-25 | 1993-07-09 | Shuji Nakada | Inspecting method for bonded part of electronic component |
| US6375347B1 (en) * | 1998-11-04 | 2002-04-23 | Advanced Micro Devices, Inc. | Method for laser scanning flip-chip integrated circuits |
| US7332718B2 (en) | 2002-01-24 | 2008-02-19 | Central Glass Company, Limited | Method for finding disconnection of conductive wires formed on plate glass and apparatus therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074167A (en) * | 1973-10-30 | 1975-06-18 | ||
| JPS57149927A (en) * | 1981-03-12 | 1982-09-16 | Jeol Ltd | Measuring method for temperature distribution |
| JPS6127481A (en) * | 1984-07-18 | 1986-02-06 | 株式会社山本製作所 | Method of drying cereal grain using circulation type cereal grain drier |
-
1988
- 1988-06-30 JP JP16080988A patent/JPH0212046A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074167A (en) * | 1973-10-30 | 1975-06-18 | ||
| JPS57149927A (en) * | 1981-03-12 | 1982-09-16 | Jeol Ltd | Measuring method for temperature distribution |
| JPS6127481A (en) * | 1984-07-18 | 1986-02-06 | 株式会社山本製作所 | Method of drying cereal grain using circulation type cereal grain drier |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05172772A (en) * | 1991-12-25 | 1993-07-09 | Shuji Nakada | Inspecting method for bonded part of electronic component |
| US6375347B1 (en) * | 1998-11-04 | 2002-04-23 | Advanced Micro Devices, Inc. | Method for laser scanning flip-chip integrated circuits |
| US7332718B2 (en) | 2002-01-24 | 2008-02-19 | Central Glass Company, Limited | Method for finding disconnection of conductive wires formed on plate glass and apparatus therefor |
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