JPH0211665U - - Google Patents
Info
- Publication number
- JPH0211665U JPH0211665U JP6905889U JP6905889U JPH0211665U JP H0211665 U JPH0211665 U JP H0211665U JP 6905889 U JP6905889 U JP 6905889U JP 6905889 U JP6905889 U JP 6905889U JP H0211665 U JPH0211665 U JP H0211665U
- Authority
- JP
- Japan
- Prior art keywords
- ics
- transport
- soldering
- rail
- cleaning tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989069058U JPH0442057Y2 (enEXAMPLES) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989069058U JPH0442057Y2 (enEXAMPLES) | 1989-06-15 | 1989-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211665U true JPH0211665U (enEXAMPLES) | 1990-01-24 |
| JPH0442057Y2 JPH0442057Y2 (enEXAMPLES) | 1992-10-02 |
Family
ID=31294354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989069058U Expired JPH0442057Y2 (enEXAMPLES) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442057Y2 (enEXAMPLES) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
| JPS5881561A (ja) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | 被はんだ付け物整列支持用の治具 |
-
1989
- 1989-06-15 JP JP1989069058U patent/JPH0442057Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
| JPS5881561A (ja) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | 被はんだ付け物整列支持用の治具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442057Y2 (enEXAMPLES) | 1992-10-02 |