JPH02116189A - Substrate packing structure - Google Patents
Substrate packing structureInfo
- Publication number
- JPH02116189A JPH02116189A JP26985388A JP26985388A JPH02116189A JP H02116189 A JPH02116189 A JP H02116189A JP 26985388 A JP26985388 A JP 26985388A JP 26985388 A JP26985388 A JP 26985388A JP H02116189 A JPH02116189 A JP H02116189A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning liquid
- hole
- gap
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 21
- 238000012856 packing Methods 0.000 title 1
- 238000004140 cleaning Methods 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 abstract 3
- 230000000694 effects Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は基板の実装構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a mounting structure for a board.
〔発明の概要］
本発明は、
電気部品あるいは電子部品を実装する基板において、電
気部品あるいは電子部品の一部を挿入するだめに設けた
該基板の穴以外に、電気部品あるいは電子部品の下にあ
たる位置に、洗浄液を流入させるための穴を少なくとも
一つ設けたことにより、該部品と該基板との間の異物を
洗浄しやすくするようにしたものである。[Summary of the Invention] The present invention provides, in a board on which an electrical component or electronic component is mounted, a hole located under the electrical component or electronic component, in addition to a hole provided in the board for inserting a part of the electrical component or electronic component. By providing at least one hole through which a cleaning liquid flows, foreign matter between the component and the substrate can be easily cleaned.
従来、電気部品あるいは電子部品を実装する基板におい
て、前記部品の下にあたる位置に、洗浄液を流入させる
ための穴を有していなかった。BACKGROUND ART Conventionally, a board on which electrical or electronic components are mounted has not had a hole under the component for allowing a cleaning liquid to flow therein.
〔発明が解決しようとする課題］
しかし、従来の技術では、前記部品を実装した前記基板
を洗浄した時、前記部品≧前記基板との間隔が狭いため
、前記間隔にある異物が外に出て来ない。また、洗浄す
る差異に用いる洗浄液も前記間隔に入りにくい。という
問題点を有する。[Problems to be Solved by the Invention] However, in the conventional technology, when the board on which the component is mounted is cleaned, the distance between the component and the board is narrow, so foreign matter in the distance comes out. do not come. Further, the cleaning liquid used for cleaning the difference is also difficult to enter the above-mentioned interval. There is a problem.
そこで本発明は、このような課題を解決しようとするも
ので、その目的とするところは電気部品あるいは電子部
品と該部品を実装する基板とのすき間の異物を洗浄しや
すい基板実装構造を提供するところにある。SUMMARY OF THE INVENTION The present invention aims to solve these problems, and its purpose is to provide a board mounting structure that makes it easy to clean foreign objects in the gap between electrical or electronic components and the board on which the parts are mounted. There it is.
本発明の基板実装構造は、
電気部品あるいは電子部品を実装する基板実装構造にお
いて、電気部品あるいは電子部品の一部を挿入するため
に設けた該基板の穴以外に、該部品の下にあたる位置に
、洗浄液を流入させるための穴を少なくとも一つ有する
ことを特徴とする。The board mounting structure of the present invention is a board mounting structure for mounting an electrical component or an electronic component, in which a hole in the board is provided for inserting a part of the electrical component or electronic component, and in a position below the component. It is characterized by having at least one hole through which cleaning liquid flows.
〔作用］
本発明の上記構造によれば、前記部品を実装した前記基
板を洗浄した時、洗浄液は、該基板に設けた穴を通って
該部品と該基板とのすき間に流入しやすくなるため、前
記すき間にある異物を取り除くことができる。[Function] According to the above structure of the present invention, when cleaning the substrate on which the component is mounted, the cleaning liquid easily flows into the gap between the component and the substrate through the hole provided in the substrate. , foreign matter present in the gap can be removed.
〔実施例］
第１図は本発明をチップキャリアの実装に用いた場合の
断面図である。[Example] FIG. 1 is a cross-sectional view when the present invention is used for mounting a chip carrier.
チップキャリア１を実装する基板４において、本発明と
なる洗浄液を流入させるための穴５を設けている。In the substrate 4 on which the chip carrier 1 is mounted, holes 5 are provided to allow the cleaning liquid of the present invention to flow therein.
このため、該チップキャリアｌを実装した該基板４を洗
浄した際、洗浄液はチップキャリア１と基板４とのすき
間に入りやすくなるため、該洗浄液は前記すき間にある
異物３に到達することができる。Therefore, when cleaning the substrate 4 on which the chip carrier 1 is mounted, the cleaning liquid can easily enter the gap between the chip carrier 1 and the substrate 4, so that the cleaning liquid can reach the foreign matter 3 in the gap. .
従って異物３は、該洗浄液によって洗い流され、穴５を
通って取り除かれる。The foreign matter 3 is thus washed away by the cleaning liquid and removed through the hole 5.
第２図は本発明をデイツプ型ＩＣの実装に用いた場合の
断面図である。FIG. 2 is a sectional view when the present invention is used for mounting a dip type IC.
デイツプ型ＩＣ６を実装する基板９において、本発明と
なる洗浄液を流入させるための穴１０を設けている。The substrate 9 on which the dip-type IC 6 is mounted is provided with a hole 10 through which the cleaning liquid of the present invention flows.
このため、デイツプ型ＩＣ６を実装した基板９を洗浄し
た際、洗浄液はデイツプ型ＩＣ６と基板９とのすき間に
入りやすくなるため、該洗浄液は前記すき間にある異物
８に到達することができる。Therefore, when cleaning the substrate 9 on which the dip-type IC 6 is mounted, the cleaning liquid easily enters the gap between the dip-type IC 6 and the substrate 9, so that the cleaning liquid can reach the foreign matter 8 in the gap.
従って異物８は、該洗浄液によって洗い流され、穴５を
通って取り除かれる。The foreign matter 8 is therefore washed away by the cleaning liquid and removed through the hole 5.
以上述べた実施例において、実装する部品はチップキャ
リアやデイツプ型ＩＣばかりではなく、表面実装型ＩＣ
やスイッチ、抵抗、コンデンサなど、あらゆる電気部品
あるいは電子部品の実装についても効果がある。In the embodiments described above, the components to be mounted are not only chip carriers and dip type ICs, but also surface mount type ICs.
It is also effective for mounting all kinds of electrical or electronic components such as switches, resistors, capacitors, etc.
以上述べた本発明によれば、基板に洗浄液を流入させる
ための穴を設けたことにより、電気部品や電子部品と基
板とのすき間にある異物に洗浄液が到達し、該異物は該
基板に設けた穴を通って取り除くことができるという効
果を有する。According to the present invention described above, by providing a hole for the cleaning liquid to flow into the substrate, the cleaning liquid reaches the foreign matter present in the gap between the electrical component or electronic component and the substrate, and the foreign matter is This has the effect that it can be removed through the hole.
５、穴 ６、デイツプ型ＩＣ ７、はんだ ９、基板 １０、穴 以上 出願人 セイコーエプソン株式会社 代理人弁理士 鈴木喜三部 他１名5. Hole 6. Deep type IC 7. Solder 9. Substrate 10, hole that's all Applicant: Seiko Epson Corporation Representative Patent Attorney Kizobe Suzuki and 1 other person
第１図は、本発明の洗浄液を流入させるための穴を設け
た基板にチップキャリアを実装した場合の断面図。
第２図は、本発明の洗浄液を流入させるための穴を設け
た基板にデツプ型ＩＣを実装した場合の断面図。
■、チップキャリア
２、モールド
３、異物
４、基板FIG. 1 is a cross-sectional view of a chip carrier mounted on a substrate having holes for inflowing the cleaning liquid of the present invention. FIG. 2 is a cross-sectional view of a deep type IC mounted on a substrate having holes for inflowing the cleaning liquid of the present invention. ■, chip carrier 2, mold 3, foreign matter 4, board
Claims (1)
いて、電気部品あるいは電子部品の一部を挿入するため
に設けた該基板の穴以外に、電気部品あるいは電子部品
の下にあたる位置に、洗浄液を流入させるための穴を少
なくとも一つ有することを特徴とする基板実装構造。In a board mounting structure in which electrical or electronic components are mounted, cleaning liquid is allowed to flow into a position below the electrical or electronic component, other than through a hole in the board provided for inserting a part of the electrical or electronic component. A board mounting structure characterized by having at least one hole for mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26985388A JPH02116189A (en) | 1988-10-26 | 1988-10-26 | Substrate packing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26985388A JPH02116189A (en) | 1988-10-26 | 1988-10-26 | Substrate packing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116189A true JPH02116189A (en) | 1990-04-27 |
Family
ID=17478110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26985388A Pending JPH02116189A (en) | 1988-10-26 | 1988-10-26 | Substrate packing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116189A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082824A (en) * | 1988-06-29 | 1992-01-21 | Imperial Chemical Industries Plc | Receiver sheet |
| JPH0529393A (en) * | 1991-07-22 | 1993-02-05 | Sharp Corp | Board for mounting semiconductor device |
-
1988
- 1988-10-26 JP JP26985388A patent/JPH02116189A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082824A (en) * | 1988-06-29 | 1992-01-21 | Imperial Chemical Industries Plc | Receiver sheet |
| JPH0529393A (en) * | 1991-07-22 | 1993-02-05 | Sharp Corp | Board for mounting semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0863548A3 (en) | Mounting assembly of integrated circuit device and method for production thereof | |
| DE69527473D1 (en) | Semiconductor arrangement consisting of a semiconductor chip, which is connected by means of contact bumps on the printed circuit board, and assembly method | |
| JPS631099A (en) | Shielding device | |
| JPH02116189A (en) | Substrate packing structure | |
| FR2793990B1 (en) | ELECTRONIC HOUSING ON PLATE AND METHOD FOR MANUFACTURING SUCH A HOUSING | |
| CA2156795A1 (en) | An electronic device assembly and a manufacturing method of the same | |
| JPH01166545A (en) | Zigzag type ic | |
| KR950035538A (en) | Printed wiring board | |
| US6023841A (en) | Printed circuit board fixing and mounting procedure for power devices | |
| JP3671436B2 (en) | Square chip parts | |
| JPH02275690A (en) | Printed circuit board | |
| KR940007755Y1 (en) | Aluminium plate for mold frame cleaning process | |
| JPS6228472U (en) | ||
| JP3013544B2 (en) | Hybrid integrated circuit device | |
| JPH0577886U (en) | Neo wedge valve mounting board | |
| JPH03220789A (en) | Lead terminal electrode of hybrid ic substrate and the like | |
| JPH0585071U (en) | Printed circuit board | |
| JPH02302087A (en) | Leakage preventive substrate structure | |
| JP3012872U (en) | Heat sink for recycling | |
| Economou | No-clean rework, part I | |
| JPS63266894A (en) | Washing of flux | |
| JPH10144833A (en) | Semiconductor module | |
| Bhatgadde | A review of electroless plating techniques for electronics | |
| JPH05259355A (en) | Electronic component | |
| JPH03272191A (en) | Printed wiring board |