JPH02114932U - - Google Patents

Info

Publication number
JPH02114932U
JPH02114932U JP1989022308U JP2230889U JPH02114932U JP H02114932 U JPH02114932 U JP H02114932U JP 1989022308 U JP1989022308 U JP 1989022308U JP 2230889 U JP2230889 U JP 2230889U JP H02114932 U JPH02114932 U JP H02114932U
Authority
JP
Japan
Prior art keywords
chip component
wiring board
electrodes
electrode
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989022308U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989022308U priority Critical patent/JPH02114932U/ja
Publication of JPH02114932U publication Critical patent/JPH02114932U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13005Structure
    • H01L2224/13006Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]

Landscapes

  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
JP1989022308U 1989-02-28 1989-02-28 Pending JPH02114932U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989022308U JPH02114932U (zh) 1989-02-28 1989-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989022308U JPH02114932U (zh) 1989-02-28 1989-02-28

Publications (1)

Publication Number Publication Date
JPH02114932U true JPH02114932U (zh) 1990-09-14

Family

ID=31240303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989022308U Pending JPH02114932U (zh) 1989-02-28 1989-02-28

Country Status (1)

Country Link
JP (1) JPH02114932U (zh)

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