JPH0211341U - - Google Patents
Info
- Publication number
- JPH0211341U JPH0211341U JP1988090779U JP9077988U JPH0211341U JP H0211341 U JPH0211341 U JP H0211341U JP 1988090779 U JP1988090779 U JP 1988090779U JP 9077988 U JP9077988 U JP 9077988U JP H0211341 U JPH0211341 U JP H0211341U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- insulating film
- conductive film
- film
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090779U JPH0211341U (en18) | 1988-07-07 | 1988-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090779U JPH0211341U (en18) | 1988-07-07 | 1988-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211341U true JPH0211341U (en18) | 1990-01-24 |
Family
ID=31315291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988090779U Pending JPH0211341U (en18) | 1988-07-07 | 1988-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211341U (en18) |
-
1988
- 1988-07-07 JP JP1988090779U patent/JPH0211341U/ja active Pending