JPH02113341U - - Google Patents

Info

Publication number
JPH02113341U
JPH02113341U JP2050089U JP2050089U JPH02113341U JP H02113341 U JPH02113341 U JP H02113341U JP 2050089 U JP2050089 U JP 2050089U JP 2050089 U JP2050089 U JP 2050089U JP H02113341 U JPH02113341 U JP H02113341U
Authority
JP
Japan
Prior art keywords
semiconductor element
heat
semiconductor
shape memory
dissipates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2050089U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2050089U priority Critical patent/JPH02113341U/ja
Publication of JPH02113341U publication Critical patent/JPH02113341U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2050089U 1989-02-25 1989-02-25 Pending JPH02113341U (US20030199744A1-20031023-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2050089U JPH02113341U (US20030199744A1-20031023-C00003.png) 1989-02-25 1989-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2050089U JPH02113341U (US20030199744A1-20031023-C00003.png) 1989-02-25 1989-02-25

Publications (1)

Publication Number Publication Date
JPH02113341U true JPH02113341U (US20030199744A1-20031023-C00003.png) 1990-09-11

Family

ID=31236921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2050089U Pending JPH02113341U (US20030199744A1-20031023-C00003.png) 1989-02-25 1989-02-25

Country Status (1)

Country Link
JP (1) JPH02113341U (US20030199744A1-20031023-C00003.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650398U (ja) * 1992-12-04 1994-07-08 株式会社村田製作所 放熱板
JP2004071658A (ja) * 2002-08-01 2004-03-04 Nec Corp チップ部品を備える電子装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650398U (ja) * 1992-12-04 1994-07-08 株式会社村田製作所 放熱板
JP2004071658A (ja) * 2002-08-01 2004-03-04 Nec Corp チップ部品を備える電子装置及びその製造方法

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