JPH0211332U - - Google Patents
Info
- Publication number
- JPH0211332U JPH0211332U JP1988088962U JP8896288U JPH0211332U JP H0211332 U JPH0211332 U JP H0211332U JP 1988088962 U JP1988088962 U JP 1988088962U JP 8896288 U JP8896288 U JP 8896288U JP H0211332 U JPH0211332 U JP H0211332U
- Authority
- JP
- Japan
- Prior art keywords
- electrode lead
- electrode
- thickness
- semiconductor chip
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988088962U JPH0211332U (enExample) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988088962U JPH0211332U (enExample) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211332U true JPH0211332U (enExample) | 1990-01-24 |
Family
ID=31313515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988088962U Pending JPH0211332U (enExample) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211332U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082384A (ja) * | 2012-10-17 | 2014-05-08 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| WO2025257937A1 (ja) * | 2024-06-11 | 2025-12-18 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
-
1988
- 1988-07-06 JP JP1988088962U patent/JPH0211332U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082384A (ja) * | 2012-10-17 | 2014-05-08 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| WO2025257937A1 (ja) * | 2024-06-11 | 2025-12-18 | 三菱電機株式会社 | 半導体装置および電力変換装置 |