JPH02113327U - - Google Patents
Info
- Publication number
- JPH02113327U JPH02113327U JP2093589U JP2093589U JPH02113327U JP H02113327 U JPH02113327 U JP H02113327U JP 2093589 U JP2093589 U JP 2093589U JP 2093589 U JP2093589 U JP 2093589U JP H02113327 U JPH02113327 U JP H02113327U
- Authority
- JP
- Japan
- Prior art keywords
- board
- resin layer
- exterior surface
- expands
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の実施例の正面図、第２図は第
１図の実施例を基板に接続した状態の正面図、第
３図は第２図において樹脂層が膨脹した状態の正
面図を示す。
１……チツプ型コンデンサ、２……樹脂層、３
……外装面、５……基板。
Figure 1 is a front view of the embodiment of the present invention, Figure 2 is a front view of the embodiment of Figure 1 connected to a board, and Figure 3 is a front view of Figure 2 with the resin layer expanded. shows. 1... Chip type capacitor, 2... Resin layer, 3
... Exterior surface, 5 ... Board.
Claims (1)
接する外装面に、接続時の加熱温度より高い温度
で膨脹する樹脂層を設けることを特徴とするチツ
プ型コンデンサ。 A chip-type capacitor characterized in that a resin layer that expands at a temperature higher than the heating temperature during connection is provided on the exterior surface in contact with a board to be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2093589U JPH0521862Y2 (en) | 1989-02-23 | 1989-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2093589U JPH0521862Y2 (en) | 1989-02-23 | 1989-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02113327U true JPH02113327U (en) | 1990-09-11 |
| JPH0521862Y2 JPH0521862Y2 (en) | 1993-06-04 |
Family
ID=31237724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2093589U Expired - Lifetime JPH0521862Y2 (en) | 1989-02-23 | 1989-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521862Y2 (en) |
-
1989
- 1989-02-23 JP JP2093589U patent/JPH0521862Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521862Y2 (en) | 1993-06-04 |