JPH0211288A - Laser processing device - Google Patents
Laser processing deviceInfo
- Publication number
- JPH0211288A JPH0211288A JP63159434A JP15943488A JPH0211288A JP H0211288 A JPH0211288 A JP H0211288A JP 63159434 A JP63159434 A JP 63159434A JP 15943488 A JP15943488 A JP 15943488A JP H0211288 A JPH0211288 A JP H0211288A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- fuse
- laser
- radiating part
- forming plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 230000002950 deficient Effects 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、半導体集積回路の配線を高精度で切断加工す
るレーザ加工装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a laser processing apparatus for cutting wiring of a semiconductor integrated circuit with high precision.
（従来の技術）
半導体集積回路は、年々微細加工技術が進歩し、高密度
化、高集積化がはかられている。中でも半導体メモリは
、微細加工による高集積化で大容量化がはかられている
。しかし、半導体チップ面積も増加しており、ダスト等
によるパターン欠陥のため不良チップとなり１歩留まり
が低下する。このため、チップ上の配線やヒュー−ズを
切断して、不良メモリセルと１）汀もって同一チップに
設けられている予備のメモリセルとを置き換え、不良チ
ップを良品化する冗長救済技術が用いられている。(Prior Art) Microfabrication technology of semiconductor integrated circuits is progressing year by year, and efforts are being made to increase the density and integration of semiconductor integrated circuits. In particular, semiconductor memories are becoming more highly integrated through microfabrication, resulting in larger capacities. However, as the area of semiconductor chips increases, pattern defects caused by dust and the like result in defective chips and a decrease in yield. For this reason, redundancy repair technology is used to turn the defective chip into a good product by cutting the wiring and fuses on the chip and replacing the defective memory cell with a spare memory cell installed on the same chip. It is being
従来、このヒユーズ切断のレーザ光は、第２図に示すよ
うに、切断するヒユーズ１の短辺方向に沿うレーザ光照
射部２の長さｂが、切断するヒユーズ１の長辺に沿うレ
ーザ光照射部の長さａよりも長いレーザ光照射部２とな
るように、レーザ光路間に置かれた縦の辺の長さと横の
辺の長さを任意に設定できる長方形状の光の穴を設けた
成形板により、円形状のレーザ光の形状を長方形状に変
えられている。Conventionally, the length b of the laser beam irradiation part 2 along the short side direction of the fuse 1 to be cut is the same as that of the laser beam along the long side of the fuse 1 to be cut, as shown in FIG. A rectangular light hole is placed between the laser beam paths and the length of the vertical side and the length of the horizontal side can be arbitrarily set so that the laser beam irradiation part 2 is longer than the length a of the irradiation part. The provided molding plate changes the shape of the circular laser beam into a rectangular shape.
（発明が解決しようとする課ｙＭ）
しかしながら、切断されるヒユーズのチップ上のレイア
ラ１−は同一でなく、設計上の都合により、切断される
ヒユーズの長辺方向が異なるヒユーズが同一チップ、１
−に存在する場合がある。この場合、レーザ光の形状を
変える必要があり、レーザ光成形板の形状設定にレーザ
光成形板の取り替え等時間を長く必要とする。また、ヒ
ユーズの長辺方向がチップの周辺に対して平行でない場
合に、チップの周辺に対して平行な辺をもった長方形の
光の穴をもったレーザ光成形板では、適当なレーザ光の
照射部分を得ることができないという問題があった・
（課題を解決するための手段）
このため、本発明のレーザ加工装置は、上記課題を解決
するため、縦方向の長さと横方向の長さが異なるレーザ
光にするためのレーザ光成形板や。(Problem to be Solved by the Invention) However, the layerers 1- on the chips of the fuses to be cut are not the same, and due to design considerations, the fuses to be cut with different long sides are on the same chip, 1-
− may exist. In this case, it is necessary to change the shape of the laser beam, and it takes a long time to set the shape of the laser beam molded plate, such as replacing the laser beam molded plate. In addition, if the long side direction of the fuse is not parallel to the periphery of the chip, in a laser beam forming plate with a rectangular light hole with sides parallel to the periphery of the chip, an appropriate laser beam There was a problem that the irradiated part could not be obtained. (Means for solving the problem) Therefore, in order to solve the above problem, the laser processing device of the present invention has Laser light molding plates and plates for making different laser lights.
レーザ光成形用レンズが回転できるレーザ加工装置とし
たものである。This is a laser processing device in which a lens for laser beam shaping can be rotated.
（作 用）
１−記構成によれば、レーザ光成形板やレーザ光成形用
レンズが回転できることから、チップ上に任意の方向に
ヒユーズの長辺方向がレイアウトされた切断されるヒユ
ーズに対して、最適なレーザ光照射部分を得ることがで
きる。(Function) According to the configuration described in 1-, since the laser beam shaping plate and the laser beam shaping lens can be rotated, the long side direction of the fuse can be laid out in any direction on the chip to be cut. , the optimum laser beam irradiation area can be obtained.
（実施例）
本発明の一実施例を図面を用いて説明する。第１図にお
いて、半導体チップ１０」−に形成されたヒユーズ１１
とヒユーズ２１は、ヒユーズの長辺方向が直交する関係
で配置されている。まず、ヒユーズ１１を切断するため
のレーザ光照射部１２にするため、レーザ光成形板１３
の長方形状の穴１４により、円形状のレーザ光２０が形
成される。ヒユーズ１１を切断後、ヒユーズ１１と直交
する関係で配置しであるヒユーズ２１を切断するための
レーザ光照射部２２にするため、レーザ光成形板１３を
９０°回転させてレーザ光成形板２３にする。長方形状
の穴２４によりレーザ光照射部２２ができ、ヒユーズ２
１が切断される。(Example) An example of the present invention will be described using the drawings. In FIG. 1, a fuse 11 formed on a semiconductor chip 10''
and the fuse 21 are arranged such that the long side directions of the fuses are perpendicular to each other. First, in order to make the laser beam irradiation part 12 for cutting the fuse 11, a laser beam forming plate 13 is used.
A circular laser beam 20 is formed by the rectangular hole 14 . After cutting the fuse 11, the laser beam forming plate 13 is rotated by 90 degrees to form the laser beam forming plate 23 in order to form the laser beam irradiation part 22 for cutting the fuse 21, which is arranged orthogonally to the fuse 11. do. The rectangular hole 24 forms the laser beam irradiation part 22, and the fuse 2
1 is disconnected.
ここで、レーザ光の穴１４．２４の長方形の対角線の交
点を中心に、レーザ光成形板１．３．２３を同心で回転
することで、レーザ光の中心位置のずれが発生しないよ
うにしである。Here, by rotating the laser beam forming plate 1.3.23 concentrically around the intersection of the diagonals of the rectangle of the laser beam hole 14.24, it is possible to prevent the center position of the laser beam from shifting. be.
また、レーザ光照射部を楕円形状に絞り込めるレンズを
、レーザ光成形板の代わりにレーザ光路間に挿入して楕
円形状のレーザ光照射部を得る場合も、この楕円形状に
絞り込めるレンズを回転できる機構とすることで、本発
明を実現することができる。Also, when inserting a lens that can narrow the laser beam irradiation area into an elliptical shape between the laser beam paths instead of the laser beam shaping plate to obtain an elliptical laser beam irradiation area, the lens that can narrow the laser beam irradiation area to an elliptical shape can also be rotated. The present invention can be realized by providing a mechanism that allows this.
（発明の効果）
以−Ｌのように、本発明のレーザ加工装置を用いること
により、従来必要としたレーザ光照射部形状を変える穴
の調整時間が、直交する関係のヒュズを切断する場合に
短縮できる。また、ヒユーズの長辺方向が任意に配置し
である場合も、最適な加工用レーザ光照射部を得ること
が可能となる。(Effects of the Invention) As shown in L below, by using the laser processing apparatus of the present invention, the time required for adjusting the hole to change the shape of the laser beam irradiation part, which was conventionally required, can be reduced when cutting orthogonal fuses. Can be shortened. Further, even when the fuses are arranged in an arbitrary direction along the long side, it is possible to obtain an optimal processing laser beam irradiation section.
第１図は本発明の一実施例のレーザ加工装置のレーザ光
照射部を形成する機構を説明する斜視図、第２図は従来
のレーザ加工装置のレーザ光照射部分を説明する図であ
る。
１０・・半導体チップ、 １１．．２１・・・ヒユー
ズ、１２、２２・・・レーザ光照射部、 １３．２３・
・・レーザ光成形板、 １４．２４・・・レーザ光が通
過する穴、 ２０・・・円形状のレーザ光。
第
図FIG. 1 is a perspective view illustrating a mechanism for forming a laser beam irradiation section of a laser processing apparatus according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating a laser beam irradiation section of a conventional laser processing apparatus. 10. Semiconductor chip, 11. ．． 21... Fuse, 12, 22... Laser light irradiation part, 13.23.
... Laser light molded plate, 14.24 ... Hole through which the laser light passes, 20 ... Circular laser light. Diagram
Claims (2)
するためのレーザ光成形板が回転できることを特徴とす
るレーザ加工装置。(1) A laser processing device characterized in that a laser beam shaping plate for producing laser beams with different lengths in the vertical direction and lengths in the lateral direction can be rotated.
するためのレーザ光成形用レンズが回転できることを特
徴とするレーザ加工装置。(2) A laser processing device characterized in that a laser beam shaping lens for forming laser beams with different lengths in the vertical direction and lengths in the horizontal direction can be rotated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63159434A JPH0211288A (en) | 1988-06-29 | 1988-06-29 | Laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63159434A JPH0211288A (en) | 1988-06-29 | 1988-06-29 | Laser processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211288A true JPH0211288A (en) | 1990-01-16 |
Family
ID=15693667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63159434A Pending JPH0211288A (en) | 1988-06-29 | 1988-06-29 | Laser processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009155241A3 (en) * | 2008-06-17 | 2010-05-06 | Electro Scientific Industries, Inc. | Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems |
-
1988
- 1988-06-29 JP JP63159434A patent/JPH0211288A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009155241A3 (en) * | 2008-06-17 | 2010-05-06 | Electro Scientific Industries, Inc. | Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems |
| US8378259B2 (en) | 2008-06-17 | 2013-02-19 | Electro Scientific Industries, Inc. | Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems |
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