JPH02110334U - - Google Patents
Info
- Publication number
- JPH02110334U JPH02110334U JP2048489U JP2048489U JPH02110334U JP H02110334 U JPH02110334 U JP H02110334U JP 2048489 U JP2048489 U JP 2048489U JP 2048489 U JP2048489 U JP 2048489U JP H02110334 U JPH02110334 U JP H02110334U
- Authority
- JP
- Japan
- Prior art keywords
- locking step
- top surface
- wafer
- semiconductor wafer
- vertical wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims 1
- 238000007373 indentation Methods 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048489U JPH02110334U (de) | 1989-02-22 | 1989-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048489U JPH02110334U (de) | 1989-02-22 | 1989-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110334U true JPH02110334U (de) | 1990-09-04 |
Family
ID=31236893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2048489U Pending JPH02110334U (de) | 1989-02-22 | 1989-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110334U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020025997A (ja) * | 2018-08-09 | 2020-02-20 | 日清工業株式会社 | 両頭平面研削盤 |
-
1989
- 1989-02-22 JP JP2048489U patent/JPH02110334U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020025997A (ja) * | 2018-08-09 | 2020-02-20 | 日清工業株式会社 | 両頭平面研削盤 |