JPH0210897A - Device for mounting electronic component - Google Patents

Abstract

PURPOSE:To perform various workings, a process at the time of mounting of an electronic component, and to reduce the number of steps by radiating an electronic component mounting unit with a working light beam through a suction nozzle. CONSTITUTION:A mounting head 22 is disposed above the sucking position of a component supply unit 24, and the shape of an electronic component P of sucked position is recognized by a recognition camera 18 through a suction nozzle 1 and a light transmission plate 5. If the shape of the component P is proper, the component P is sucked by the nozzle 1, and moved to be disposed above the predetermined mounting position of a circuit board 25. In this case, the position of the component P is accurately recognized by a recognition camera 18, a deviation in X-Y directions and an inclining angle theta with respect to the mounting attitude are detected, and are corrected by the movement of a moving table 23 and the rotation of a pulley 16. Then, an ultraviolet ray radiator 21 is disposed at the same axial center as that of the nozzle 1, an adhesive 28 coating the mounting position of the component P on the board 25 is irradiated with an ultraviolet ray, rapidly cured to increase its restricting force. When all the components are completely mounted, the board 25 is inserted into a reflowing furnace, primarily secured with solder, and electrically connected.

Description

[Detailed description of the invention] Industrial applications The present invention relates to an electronic component mounting device.

Conventional technology Conventionally, when mounting electronic components on a circuit board, adhesive is applied to the electronic component mounting position on the circuit board and reflow solder is applied to the electrodes. The components are picked up by a suction nozzle, and the picked up electronic components are transported to the electronic component mounting position on the circuit board and mounted, temporarily fixed with adhesive, and the mounting of all electronic components to the circuit board is completed. Then, this circuit board was inserted into a reflow oven, the reflow solder was reflowed, and the circuit board was permanently fixed with solder and electrically bonded. Also, if you do not use reflow solder,
A circuit board with electronic components temporarily fixed with adhesive was dipped in a solder tank, and the electrodes of the electronic component and circuit board were soldered together.

Problems to be Solved by the Invention However, since the binding force of the adhesive on the electronic components is small, it is difficult to handle such things as transporting the circuit board with the electronic components temporarily fixed, resulting in poor workability.

Although it is conceivable to strengthen the binding force of the adhesive, there is a problem in that it becomes difficult to apply the adhesive to the circuit board, and productivity deteriorates significantly.

Furthermore, it requires two steps: mounting the electronic components on the circuit board and temporarily fixing them with adhesive, and inserting the circuit board into a reflow oven and permanently fixing the electronic components to the circuit board. There was a problem with low productivity.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, an object of the present invention is to provide an electronic component mounting device that can increase the restraining force of electronic components during mounting and improve workability for final fixing.

Another object of the present invention is to provide an electronic component mounting device that can perform mounting and final fixing of electronic components in one process to improve productivity.

Means for Solving the Problems In order to achieve the above object, the present invention is characterized by comprising a suction nozzle made of a transparent material and a light irradiation means for irradiating a light beam through the suction nozzle.

Further, a recognition means for recognizing the shape of the electronic component suctioned by the suction nozzle through the suction nozzle is provided, and the light irradiation means and the recognition means are alternatively positioned on the axis of the suction nozzle. I can do it.

The light irradiation means may be ultraviolet irradiation means or laser light irradiation means, and the laser light irradiation means may include a laser oscillator and a scanning means.

Function According to the present invention, processing and treatment can be performed during the electronic component mounting process by irradiating the processing light beam onto the electronic component mounting portion through the suction nozzle. For example, by irradiating an adhesive for temporarily fixing electronic components with ultraviolet rays, the binding force of the adhesive can be increased, making it easier to handle the circuit board on which electronic components are temporarily fixed, and improving workability. In addition, when mounting electronic components, with the leads of the electronic components in contact with the electrodes of the circuit board, each lead is sequentially irradiated with a laser beam to coat the electrodes or reflow the flow solder. , it is also possible to bond the electrode and lead and eliminate the glue flow process in a reflow oven.

In addition, by providing the light irradiation means and the recognition means and positioning them alternatively on the axis of the suction nozzle,
After detecting the position of the electronic component picked up by the component supply unit with the recognition means, correcting the positional deviation, and accurately mounting it at a predetermined position on the circuit board, switching the recognition means and the light irradiation means,
The above operations can be performed immediately on the mounted electronic components.

EXAMPLE Hereinafter, an example of the present invention will be described based on FIGS. 1 to 3.

In FIG. 1, a suction nozzle l made of a transparent material is held in a nozzle holder 2. As shown in FIG. Nozzle holder 2 is suction tube 3
It is fitted to the lower end of the electronic component and is locked by an elastic locking tool 4 so that it can be replaced with one touch depending on the size of the electronic component to be sucked. The upper end of the suction cylinder 3 is shielded by a transparent plate 5, and a suction opening 6 is formed in the peripheral wall. 5a is a fixing nut for the transparent plate 5. The upper end of the suction cylinder 3 is fitted into the lower end of the rotary cylinder 7, and the suction cylinder 3
It is locked with an elastic locking tool 8 so that it can be easily replaced when the inside becomes dirty.

The rotating cylinder 7 has bearings 9a arranged on its upper and lower outer peripheries.
, 9b, and is rotatably supported by a support cylinder portion 1) provided on the elevating body IO. Further, a suction outer cylinder 12 provided on the elevating body 10 is fitted onto the outer periphery of the suction cylinder 3. An annular groove 13 is formed on the inner periphery of the suction outer cylinder 12 so as to face the suction opening 6, and OIJ songs 4 for sealing are arranged on both sides of the annular groove 13. Further, a suction port 15 is opened in the annular groove 13 and is connected to a suction source (not shown).

A pulley 16 is fixed to the upper end of the rotary cylinder 7, and is rotationally driven by a drive source (not shown). Further, the elevating body 10 is movable up and down along the kite 17, and is elastically supported by the movable table 23 via the wings 30.

Reference numeral 18 denotes a recognition camera that is movably arranged between a coaxial center position above the rotary barrel 7 and a standby position on the side thereof, and a half mirror 20a is arranged at the bottom of the optical system barrel 19. , illumination light from a lighting fixture 20 disposed on the side is irradiated toward the suction nozzle l.

Reference numeral 21 denotes an ultraviolet irradiation device, which is movable between a position on the same axis above the rotary cylinder 7 as an alternative to the recognition camera 18 and a standby position on the side thereof.

The mounting head 22 configured as described above is mounted on the moving table 23, and is moved between the suction position of the component supply section 24 and an arbitrary position on the circuit board 25 where the electronic component is to be mounted, as shown in FIG. is configured to do so. Parts supply section 24
, there is a parts cassette 2 in which an electronic component assembly 26 formed by holding a large number of electronic components P in a tape-like body is set.
7 is disposed, and is configured to sequentially feed the electronic components P to the suction position.

Next, the operation will be explained. First, the mounting rod 22 is placed oppositely above the suction position of the component supply unit 24, and the recognition camera 18 recognizes the shape of the electronic component P at the suction position through the suction nozzle l made of a transparent material and the transparent plate 5. do. If the electronic component P has an inappropriate shape, the parts cassette 27 is operated without entering the suction operation to pick up the next electronic component P.
is sent to the suction position, and the shape is recognized again by the camera 18.
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When the shape of the electronic component P is appropriate, the moving table 23 descends and the electronic component P is sucked by the suction nozzle l, and after rising again, the movable table 23 moves and the electronic component P sucked by the suction nozzle 1 is removed. At this time, when the component P is positioned above the predetermined mounting position of the circuit board 25, the position of the sucked electronic component P is accurately recognized by the recognition camera 18, and the eccentricity in the X-Y direction and the mounting of the electronic component P are determined. The tilt angle θ with respect to the posture is detected, and its correction is performed by correcting the amount of movement of the moving table 23 and rotating the Boo 9160.

Next, the ultraviolet irradiation device 21 is located on the same axis as the suction nozzle 1, and the adhesive 28 applied to the mounting position of the electronic component P on the circuit board 25 is irradiated with ultraviolet rays.
The curing reaction of 8 is started quickly and the binding force of the adhesive 2 is increased. Thereafter, the moving table 23 is lowered, so that the electronic component P is accurately mounted at a predetermined position on the circuit board 25, and the electronic component P is temporarily fixed with a strong binding force.

By repeating the above operations, appropriate electronic components P are sequentially and efficiently mounted on the electronic component mounting positions on the circuit board 25, and when the mounting of all electronic components P is completed, this circuit board 25 is placed in a reflow oven. It is inserted, and the main fixation and electrical connection are performed using solder.

In the above embodiment, the ultraviolet rays were irradiated before the electronic component P was attached, but as shown in FIG. 3, the ultraviolet rays were irradiated after the electronic component P was attached. It is also possible to increase the binding force of the electronic component P by irradiating the adhesive 28, which has partially flowed out, with ultraviolet rays 29.

In the first embodiment described above, an example was shown in which the ultraviolet irradiation device 21 was provided, but as in the second embodiment shown in FIG. good.

In FIG. 4, reference numeral 31 denotes a laser beam irradiation device, which is composed of a laser oscillation device 832 and a scanning device 36 consisting of an It is configured so that it can be irradiated with

The operation in this embodiment is to connect the electronic component P to the circuit board 25.
The process is almost the same as the first embodiment until the electronic component P is mounted on the top, and after mounting the electronic component P, the laser beam irradiation device 31 is positioned on the axis of the suction nozzle 1, the laser oscillator 32 is activated, and scanning is performed. The device 36 is operated to sequentially irradiate each lead 37 of the electronic component P that is in contact with the electrode 38 of the circuit board 25 with a laser beam, and heat the solder coated on the electrode 38 or solder for flow with the laser beam. The electrode 38 and the lead 37 are soldered together by reflowing. When the bonding of the entire circumference of the electronic component P with the glue 37 is completed, the process moves to the mounting operation of the next electronic component P, and the above-mentioned operations are repeated.

In this manner, in the second embodiment, it is possible to attach the electronic component P to the temporary circuit board 25 and to simultaneously bond the electronic component P to the temporary circuit board 25.

In this embodiment, it is not necessary to apply an adhesive for temporarily fixing the electronic component P to the circuit board 25, but it may be applied. Although the suction nozzle 1 may be separated from the electronic component P after the electronic component P is mounted, the laser beam can also be irradiated while the electronic component P is pressed and fixed.

Effects of the Invention According to the present invention, by irradiating processing light onto the electronic component mounting portion through the suction nozzle, various processing and treatments can be performed during the electronic component mounting process, and the number of steps can be reduced. .

Furthermore, by irradiating the adhesive that temporarily fixes the electronic component with ultraviolet rays, the binding force of the adhesive can be increased, making it easier to handle the circuit board on which the electronic component is temporarily fixed, improving workability.

Also, when installing electronic components, each lead is placed in a state where the leads of the electronic components are in contact with the electrodes of the circuit board.

It is also possible to join the electrodes and leads by sequentially irradiating them with a laser beam to reflow the reflow solder applied on the electrodes, thereby eliminating the adhesive flow in the reflow oven.

Furthermore, by providing a light irradiation means and a recognition means and positioning them alternatively on the axis of the suction nozzle,
After detecting the position of the electronic component picked up by the component supply unit with the recognition means, correcting the positional deviation, and accurately mounting it at a predetermined position on the circuit board, switching the recognition means and the light irradiation means,
This has great effects, such as being able to immediately perform the above operations on the mounted electronic components.

[Brief explanation of the drawing]

1 to 3 show a first embodiment of the present invention, in which FIG. 1 is a vertical sectional front view of the main part of the mounting head, FIG. 2 is a perspective view V showing the mounting operation, and FIG. 3 is a UV-ray FIG. 4 is a perspective view of a mounting head which is a main part of a second embodiment of the present invention. L...Suction nozzle, 18...Recognition camera, 2I...Ultraviolet irradiation device, 25...
・Circuit board, 31...Laser light irradiation device, 32...
...Laser oscillator, 36...Scanning device, P
...Electronic parts. Acting A4 Patent Attorney Toshio Nakatari 1 person] -- 1 lo l 2 toku no mata ゛1 LLjNhi 29 31-Le 1 light solution # 芒,! jΦ j/

Claims (5)

[Claims] (1) An electronic component mounting apparatus comprising a suction nozzle made of a transparent material and a light beam irradiation means for irradiating a light beam through the suction nozzle. (2) A claim further comprising recognition means for recognizing the shape of the electronic component suctioned by the suction nozzle through the suction nozzle, wherein the light irradiation means and the recognition means are alternatively positioned on the axis of the suction nozzle. 1. The electronic component mounting device according to 1. (3) Claim 1, wherein the light irradiation means is an ultraviolet irradiation means.
Or the electronic component mounting device according to 2. (4) The electronic component mounting apparatus according to claim 1 or 2, wherein the light beam irradiation means is a laser beam irradiation means. (5) The electronic component mounting apparatus according to claim 4, wherein the laser beam irradiation means comprises a laser oscillator and a scanning means.