JP2006202794A - Component mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounter in which mounting of a component can be realized with higher precision. <P>SOLUTION: A member 21 at a component mounting head 8 holding a component 2 is provided with a through hole 22, and a recognition mark provided on the upper surface of the component 2 is recognized by a recognizing section 9 appearing on the upper surface of the member 21 or disappearing therefrom. It is utilized as holding posture information of the component 2 for correcting the posture at a mounting portion 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  For example, the present invention is effective in component mounting when a plurality of small printed wiring boards are positioned and pasted on a mother board and solder is printed on a land portion of the printed wiring board, or a semiconductor component is accurately mounted on the printed wiring board. It relates to the device.

As a conventional component mounting apparatus, in order to position and mount a component on a printed circuit board held by a component mounting unit, a recognition unit is provided below the component mounting head unit holding the component and held by the component mounting head unit. It was mounted while recognizing the outer shape of the mounted component and correcting the mounting posture at the time of mounting (see, for example, Patent Document 1).
JP 04-37099 A

  However, in the conventional component mounting apparatus, since the component held by the component mounting head is recognized from below, the external shape of the component must be recognized and the mounting posture must be corrected. As a result, the mounting is slightly out of order and accurate mounting cannot be performed, and solder printing cannot be performed accurately.

  The present invention eliminates the conventional drawbacks as described above, recognizes the recognition mark of the component held on the component mounting head from above, and mounts the component when mounting on a mount bond (for example, a printed board, a motherboard, etc.). An object of the present invention is to provide a component mounting apparatus that realizes more accurate mounting as posture correction information.

  In order to achieve the above object, the component mounting apparatus of the present invention recognizes the recognition mark provided on the upper surface of the component from above while the component held by the component mounting head unit is being conveyed from the component supply unit to the component mounting unit. A recognition unit is provided as information for correcting the mounting position in the component mounting unit.

  With this configuration, the recognition mark accurately provided with respect to the component mounting standard is recognized and used as information for correcting the mounting posture, so that the mounting bond can be accurately mounted.

  According to the present invention, the recognition mark formed on the upper surface can be basically recognized and the component can be mounted on the mount board by correcting the mounting posture. It is possible to prevent problems from being generated by solder printing on the part and solder connection to the land part.

  In the embodiment of the present invention, a component supply unit that supplies at least one component having two or more recognition marks on the upper surface one by one, and a component mounting that holds the component supply unit and holds the mount board The component mounting head that is mounted on the mounting board and positioned and mounted on the mounting board, and the component recognition mark is recognized from above while the component held by the component mounting head is being transported from the component supply unit to the component mounting unit. Featuring a component mounting device with a recognition unit that uses information to correct the mounting orientation of the component mounting unit, this allows recognition marks that are accurately formed with respect to the component mounting standards to be mounted on the mounting board. The effect that it can be obtained.

  In addition, since the component holding head component is configured so that the recognition unit can recognize at least the recognition mark of the component to be held, recognition from above the component with the recognition mark is realized. The effect that it can be obtained.

  Further, since the member that holds the components of the component mounting head portion is made of a transparent or semi-transparent material, the entire held components are included in the recognition portion that recognizes the recognition mark using light. The effect that it can be recognized is acquired.

In addition, the member that holds the component of the component mounting head portion has an effect that the member can be made of any material by having a structure having a through hole at a position corresponding to the recognition mark of the component to be held. can get.
[Embodiment 1]
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view of the component mounting apparatus of the first embodiment, FIG. 2 is an explanatory diagram for explaining the operation, and FIG. 3 is a diagram showing a recognition mark of a component held by the component mounting head unit from above. It is a perspective view which shows the state to recognize.

  1 to 3, the apparatus main body 1 is provided with a motor as a power source, a vacuum pump for vacuum suction, and a control unit for performing various controls. A component supply unit 3 that supplies at least two components 2 each having two or more recognition marks on the upper surface, and a component that positions and holds the mount board 4 on which the component 2 is mounted, on the upper portion of the apparatus main body 1. A mounting unit 5 is provided.

  In addition, a component mounting head portion 8 attached to a head slider 7 that is held by the support 6 and is disposed in the left-right direction of the apparatus main body 1 is disposed above the component supply portion 3 and the component mounting portion 5. Yes. The component mounting head unit 8 holds the components 2 one by one by the component supply unit 3, transports the components 2 to the component mounting unit 5 by the head slider 7, and is positioned and held by the component mounting unit 5. 4 is pressed to a predetermined position and mounted.

  Further, a recognition unit 9 is disposed above the component supply unit 3 and the component mounting unit 5 so as to be movable in the front-rear direction of the apparatus main body 1. The recognition unit 9 includes a light emitting element and a light receiving element, and irradiates a light beam emitted from the light emitting element onto a recognition mark on the upper surface of the component 2 held and conveyed by the component mounting head unit 8 and reflects the reflected light. The posture of the component 2 held by the component mounting head unit 8 is detected so that the beam is incident on the light receiving element.

In addition, an operation unit 10 such as a touch panel is provided on the upper part of the component supply unit 3 so that control can be switched.
The basic configuration of the component mounting apparatus according to the first embodiment of the present invention is as described above. Specific examples of each component will be described below.

  As the component 2, a component having a large number of connection terminals such as a semiconductor component and various composite components is to be mounted. In these parts, the pitch between the connection terminals becomes narrower, and if the mounting accuracy with respect to the printed wiring board is not performed more accurately, connection failure will occur. Another example of the component 2 is a printed wiring board having a small shape. For example, as shown in FIG. 4, a plurality of flexible printed circuit boards 2 laminated in multiple layers are accurately positioned on a mother board (mount board 4) and pasted using an adhesive, and the mother board is taken out and transferred to a printing device. Effective component mounting is possible when cream solder or the like is printed on the mounting land portion of the flexible printed wiring.

  Further, as the component supply unit 3, a first component 2 is substantially positioned and supplied to the component supply table 13 by a component transfer mechanism 12 from a magazine 11 that is supplied in a state where a large number of components 2 are stacked. The component supply unit 14 and a second component supply unit 15 that supplies the components 2 that cannot be supplied by the magazine method one by one and transfers the components 2 to the operating position of the component mounting head unit 8. .

  Further, the component mounting portion 5 has a plurality of holding pins 17 for accurately positioning and holding the mount board 4 on a mounting table 16 that moves in the front-rear direction of the apparatus main body 1. As the mount board 4, a printed wiring board is used when mounting a component 2 such as a semiconductor component or a composite component, and at a predetermined position when a large number of components 2 made of the flexible printed wiring board are pasted and mounted. Use a motherboard printed with adhesive material.

  In addition, the component mounting head portion 8 whose upper portion is connected to the head slider 7 including a ball screw 18 and a linear guide 19 that are rotated by receiving power from the drive source of the apparatus main body 1 is moved in the horizontal direction by the rotation of the ball screw 18 of the head slider 7. It is possible to move to. The component mounting head portion 8 is provided with a member 21 for holding the component 2 held by the support shaft 20 at the lower end. The member 21 is configured to be movable up and down by the support shaft 20, and a plurality of suction ports connected to a vacuum pump in the apparatus main body 1 are provided on the lower surface, and the component supply unit 3 is provided by the suction ports. The components supplied in the above are sucked and held. Further, the member 21 is provided with several through holes 22 larger than the recognition marks at positions corresponding to the recognition marks 24 of the component 2 sucked and held. The through hole 22 transmits the light beam of the recognition unit 9 and irradiates the recognition mark 24 of the component 2, transmits the reflected beam again, and returns to the recognition unit 9, so that the component 2 is in the member 21 in any posture. It is for recognizing whether it is held.

  If the member 21 is made of a transparent or translucent material such as a glass material or a synthetic resin material instead of providing the through hole 22, the recognition mark of the component 2 by the light beam of the recognition unit 9 even without the through hole 22. Can be recognized.

  The configuration of the recognition unit 9 is a configuration using a light beam as described above. However, the recognition unit 9 is supported by the support block 23 on the apparatus main body 1, and the recognition unit 9 is also supported by the ball screw and the linear guide. It is configured to be movable in the front-rear direction, and moves forward to the upper surface of the member 21 that holds the component 2 conveyed by the component mounting head unit 8, and moves forward and backward so as to correspond to several through holes 22 of the member 21. Thus, the recognition mark of the component 2 is recognized.

Next, a mounting method for a device having two recognition marks 24 using the small flexible printed wiring board shown in FIGS. 2 and 5 as the component 2 will be described.
As shown in FIG. 5, the flexible printed wiring board as the component 2 is provided with recognition marks 24 at different positions in the height direction at the left and right ends. The recognition mark 24 is formed at a position determined with respect to the circuit pattern on the surface of the flexible printed wiring board, and is formed of a material that reflects a light beam different from the surroundings.

  As shown in FIG. 2, such a component 2 is supplied to the first component supply unit 14 of the component supply unit 3 in a magazine manner, and the component transfer mechanism 12 takes out the components 2 from the magazine 11 one by one. 13 is transferred after positioning. When the component 2 is transferred onto the component supply table 13, the component mounting head unit 8 moves onto the component supply table 13 by the operation of the head slider 7. The member 21 of the component mounting head portion 8 is lowered by the support shaft 20 and comes into contact with the component 2 on the component supply table 13, and the component 2 is sucked and held on the member 21 by the suction port on the lower surface of the member 21.

  The member 21 holding the component 2 is raised to a predetermined height by the support shaft 20 and is conveyed by the head slider 7 to a position corresponding to the recognition unit 9 in this state. When the component mounting head unit 8 comes to a position corresponding to the recognition unit 9, the recognition unit 9 moves forward and positions the tip of the recognition unit 9 on the upper surface of the member 21 of the component mounting head unit 8. The beam is emitted, and the first recognition mark 24 of the component 2 held by the member 21 through the first through hole 22 of the member 21 is recognized.

  Next, the component mounting head 8 is moved slightly in the left-right direction by the operation of the head slider 7, and the recognition unit 9 is also moved slightly in the front-rear direction, and the light beam of the recognition unit 9 passes through the second through hole 22 of the member 21. The second recognition mark 24 of the component 2 held by the member 21 is recognized.

  By recognizing the two recognition marks 24, the posture of the component 2 held by the member 21 of the component mounting head portion 8 is read. This information is sent to the control unit of the apparatus main body 1, and the posture of the component 2 held by the member 21 of the component mounting head unit 8 is compared with the original mounting posture to determine the rotation angle of the support shaft 20 and the position of the mount board 4. Etc. are corrected and conveyed to the component mounting unit 5. Note that the recognition unit 9 moves backward as soon as the recognition of the two recognition marks 24 is completed.

  The component 2 that has been transported onto the component mounting unit 5 rotates the support shaft 20 to correct the posture of the component 2 recognized by the recognition unit 9, moves the mount board 4 back and forth, The conveyance position in the left-right direction is determined and corrected, and when the correction is completed, the member 21 is lowered by the support shaft 20 and is pressed to a predetermined position on the mount board 4 and attached by an adhesive material to be mounted.

  When a predetermined number of components 2 are accurately mounted on the mount board 4 by repeating such an operation, the mounting table 16 moves forward and moves the mount board 4 to the front of the apparatus main body 1 and takes it out.

  In the above description, the recognition unit 9 recognizes the posture held by the component mounting head unit 8 of the component 2 and corrects the deviation of the posture on the component mounting unit 5. For those in which the posture of the component 2 recognized in 9 is not recognizable, the component 2 is not mounted on the mount board 4 but is discharged to the discharge portion, and only those having no problem in posture can be mounted. In this case, the recognition unit 9 recognizes information on the holding posture of the component 2 at the component mounting head unit 8, and the control unit determines whether the mounting is possible.

  Further, the member 21 for holding the component 2 of the component mounting head portion 8 has been described as a configuration in which the suction port is provided and the component 2 is sucked. However, depending on the component to be handled, a configuration in which a holding claw that sandwiches and holds the component 2 is provided. It can also be.

  Further, the recognition mark 24 of the component 2 has been described as being formed separately. However, when the printed wiring board is used as a component, the entire wiring pattern on the surface or the mounting land can also be used as the recognition mark. .

  As described above, the component mounting apparatus according to the present invention corrects the orientation of the component 2 held by recognizing the recognition mark 24 formed accurately with respect to the mounting reference when high-precision mounting is required. As a result, extremely high implementation accuracy can be achieved.

  Since the component mounting apparatus of the present invention recognizes and mounts the recognition mark formed on the upper surface of the component, it can be widely used in production facilities that perform highly accurate mounting and assembly.

It is a perspective view of the component mounting apparatus in Embodiment 1 of this invention. It is explanatory drawing explaining operation | movement of the apparatus. It is a perspective view which shows the recognition part and a component mounting head part. It is a top view which shows the example of mounting of the components in the apparatus. It is a top view which shows an example of the components mounted by the same apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Apparatus main body 2 Components 3 Component supply part 4 Mount board 5 Component mounting part 6 Support body 7 Head slider 8 Component mounting head part 9 Recognition part 10 Operation part 11 Magazine 12 Component transfer mechanism 13 Component supply table 14 1st component supply Part 15 Second component supply part 16 Mounting table 17 Holding pin 18 Ball screw 19 Linear guide 20 Support shaft 21 Member 22 Through hole 23 Support block 24 Recognition mark

Claims (4)

A component supply unit that supplies a component having at least two recognition marks on the upper surface, and a component that holds the component supply unit, transports it to the component mounting unit that holds the mount board, and positions and mounts it on the mount board Information for recognizing the component recognition mark from above and correcting the mounting posture at the component mounting unit while the mounting head unit and the component held by the component mounting head unit are being transported from the component supply unit to the component mounting unit A component mounting apparatus including a recognition unit. The component mounting apparatus according to claim 1, wherein the member that holds the component of the component mounting head unit is configured so that the recognition unit can recognize at least a recognition mark of the held component. The component mounting apparatus according to claim 2, wherein the member that holds the components of the component mounting head unit is made of a transparent or translucent material. The component mounting apparatus according to claim 2, wherein the member that holds the component of the component mounting head unit has a through hole at a position corresponding to a recognition mark of the component to be held.

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