JPH02108361U - - Google Patents
Info
- Publication number
- JPH02108361U JPH02108361U JP1669189U JP1669189U JPH02108361U JP H02108361 U JPH02108361 U JP H02108361U JP 1669189 U JP1669189 U JP 1669189U JP 1669189 U JP1669189 U JP 1669189U JP H02108361 U JPH02108361 U JP H02108361U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- heavy component
- circuit board
- heavy
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1669189U JPH02108361U (es) | 1989-02-15 | 1989-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1669189U JPH02108361U (es) | 1989-02-15 | 1989-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108361U true JPH02108361U (es) | 1990-08-29 |
Family
ID=31229838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1669189U Pending JPH02108361U (es) | 1989-02-15 | 1989-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108361U (es) |
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1989
- 1989-02-15 JP JP1669189U patent/JPH02108361U/ja active Pending