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Priority to JP1810289UpriorityCriticalpatent/JPH02108337U/ja
Publication of JPH02108337UpublicationCriticalpatent/JPH02108337U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
H01L2224/85009—Pre-treatment of the connector or the bonding area
H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector