JPH0210713A - Indication of electronic component - Google Patents
Indication of electronic componentInfo
- Publication number
- JPH0210713A JPH0210713A JP63161433A JP16143388A JPH0210713A JP H0210713 A JPH0210713 A JP H0210713A JP 63161433 A JP63161433 A JP 63161433A JP 16143388 A JP16143388 A JP 16143388A JP H0210713 A JPH0210713 A JP H0210713A
- Authority
- JP
- Japan
- Prior art keywords
- paint
- capacitor
- electronic component
- laser
- indication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003973 paint Substances 0.000 claims abstract description 29
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 abstract description 26
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003566 sealing material Substances 0.000 abstract description 2
- 238000007639 printing Methods 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Printing Methods (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品の改良にかかり、特にその表示方
法の改善に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in electronic components, and particularly to improvements in display methods thereof.
従来の電子部品の表示は、例えば電解コンデンサのよう
に外表面に、予め必要な表示が印刷された塩化ビニール
等からなる絶縁スリーブを被覆して行っている。Conventionally, electronic components, such as electrolytic capacitors, are displayed by covering the outer surface with an insulating sleeve made of vinyl chloride or the like on which a necessary display is printed in advance.
そして、これらの電子部品は、プリント基板に実装され
、半田リフロー法等により半田付けされる。These electronic components are then mounted on a printed circuit board and soldered using a solder reflow method or the like.
あるいは、チップ形の電子部品の場合、その多くは、耐
熱性のエポキシ樹脂等の合成樹脂からなる外装部材で電
子部品本体を被覆し、この外装部、材の表面に、白色等
のインクをもって極性、規格、社標等の必要な表示を印
刷している。Alternatively, in the case of chip-shaped electronic components, the main body of the electronic component is often covered with an exterior material made of synthetic resin such as heat-resistant epoxy resin, and the surface of the exterior material is coated with white or other ink to polarize the component. , standards, company marks, and other necessary markings are printed.
ところが、リフロー処理での輻射熱が、電子部品の外装
部材もしくは内部の電子部品本体に熱的ストレスとして
影響する場合があった。そのため、電子部品が熱劣化し
、その寿命特性に悪影響を及ぼすほか、外装部材の割れ
等の障害があった。However, the radiant heat during the reflow process sometimes affects the exterior member of the electronic component or the internal electronic component body as thermal stress. As a result, the electronic components deteriorate due to heat, which has a negative effect on their life characteristics, and also causes problems such as cracks in the exterior members.
また、チップ形電子部品の印刷においては、合成樹脂等
からなる外装枠の表面に直接印刷するので、外装枠の表
面状態、例えば、汚れ等によりその印刷品位が著しく劣
悪になることがあった。そのため、製造工程での歩留り
が悪化するほか、必要な定格の目視が困難となるので、
プリント基板等への実装工程、あるいは実装後の検査工
程での作業効率が悪くなることがあった。Furthermore, when printing chip-shaped electronic components, printing is performed directly on the surface of an exterior frame made of synthetic resin or the like, so the quality of the printing may be significantly degraded due to the surface condition of the exterior frame, such as dirt. As a result, the yield in the manufacturing process deteriorates, and it becomes difficult to visually check the required ratings.
The work efficiency in the mounting process on a printed circuit board or the like or in the inspection process after mounting sometimes deteriorated.
この発明の目的は、半田付は工程での熱的ストレスによ
る影響を軽減するとともに、電子部品に高品位の印刷を
することを目的としている。The purpose of this invention is to reduce the influence of thermal stress during soldering processes and to print high quality electronic components.
この発明は、電子部品の所望の箇所に、表面の色彩と異
なる色彩による塗料面を形成するとともに、この塗料面
にレーザーを照射して所望の表示を形成することを特徴
としている。This invention is characterized by forming a paint surface in a color different from that of the surface at a desired location of an electronic component, and by irradiating this paint surface with a laser to form a desired display.
図面に示したように、電子部品（コンデンサ）１の所望
の箇所には、予め電子部品１の表面の色彩と異なる色彩
の塗料、例えば白色の塗料による塗料面２を形成し、こ
の塗料面２に、レーザー照射による所望の表示４を刻印
する。そのため、電子部品１に塗布された塗料がレーザ
ーにより剥離され、電子部品１の表面が外部に露出して
表示４を形成する。As shown in the drawing, a paint surface 2 of a color different from that of the surface of the electronic component 1, for example, white paint, is formed in advance at a desired location of the electronic component (capacitor) 1, and this paint surface 2 A desired marking 4 is engraved by laser irradiation. Therefore, the paint applied to the electronic component 1 is peeled off by the laser, and the surface of the electronic component 1 is exposed to the outside to form the display 4.
また、表示４自体はレーザーによる塗料の除去で実現さ
れているため、白色等の塗料が外装部材の表面上の殆ど
の部分を占めることになる。そのため、リフロー処理で
の赤外線の輻射熱が吸収されにくくなる。Furthermore, since the display 4 itself is realized by removing paint using a laser, the paint, such as white, occupies most of the surface of the exterior member. Therefore, infrared radiant heat during reflow processing is less likely to be absorbed.
次いで、この発明の実施例を図面にしたがい説明する。 Next, embodiments of the invention will be described with reference to the drawings.
第１図は、この発明の実施例により得られた電子部品を
示す斜視図、第２図は、この発明の実施例による表示方
法を説明した説明図である。第３図は、この発明の第２
の実施例にらる電子部品を示した斜視図、また第４図は
、第２の実施例による電子部品内部の赤外線リフロー処
理における温度上昇を示した図面である。FIG. 1 is a perspective view showing an electronic component obtained according to an embodiment of the invention, and FIG. 2 is an explanatory diagram illustrating a display method according to an embodiment of the invention. Figure 3 shows the second embodiment of this invention.
FIG. 4 is a perspective view showing an electronic component according to the second embodiment, and FIG. 4 is a drawing showing a temperature rise during infrared reflow processing inside the electronic component according to the second embodiment.
なお、この実施例において、電子部品としては、コンデ
ンサを例に採り説明する。In this embodiment, a capacitor will be taken as an example of the electronic component.
コンデンサ１は、図示しないコンデンサ素子を外装ケー
スに収納し、開口端面を弾性ゴム等の封口材により密封
している。コンデンサ素子から導かれたリードｗＡ３は
、封口体を貫通して外部に突出している。In the capacitor 1, a capacitor element (not shown) is housed in an exterior case, and the open end surface is sealed with a sealing material such as elastic rubber. A lead wA3 led from the capacitor element penetrates the sealing body and projects to the outside.
コンデンサ１の外装ケースの外周部には、塩化ビニール
からなる絶縁スリーブを被覆する。また、コンデンサｌ
の端面には、絶縁スリーブと同様に塩化ビニールからな
る絶縁板１３を配置し、絶縁スリーブとともに熱処理を
施してコンデンサ１本体に密着させる。このコンデンサ
１の端面に配置される絶縁板１３には、予め、もしくは
コンデンサ１に装着された後、絶縁板１３とは異なる色
彩、この実施例では白色による塗料面２を形成した。The outer periphery of the outer case of the capacitor 1 is covered with an insulating sleeve made of vinyl chloride. Also, capacitor l
An insulating plate 13 made of vinyl chloride, like the insulating sleeve, is arranged on the end face of the capacitor 1, and is heat-treated together with the insulating sleeve so as to be brought into close contact with the capacitor 1 body. On the insulating plate 13 disposed on the end face of the capacitor 1, a paint surface 2 of a color different from that of the insulating plate 13, white in this example, is formed in advance or after being attached to the capacitor 1.
次いで、第２図に示すように、レーザー光源５から反射
鏡６、集束レンズ７を介してレーザーをコンデンサ１の
塗料面２に集中的に照射する。このとき塗料面２の塗料
は、レーザーにより除去され、絶縁板１３の表面が外部
に露出する。したがって、載置用の治具８に搭載された
コンデンサｌの微移動を繰り返すことにより、レーザー
の照射が集中する部分が移動し、コンデンサ１の塗料面
２に所望の文字、記号、数字等からなる、極性、定格等
の表示４が形成され、第１図に示したようなコンデンサ
１が得られる。Next, as shown in FIG. 2, the paint surface 2 of the condenser 1 is intensively irradiated with a laser beam from a laser light source 5 via a reflecting mirror 6 and a focusing lens 7. At this time, the paint on the paint surface 2 is removed by the laser, and the surface of the insulating plate 13 is exposed to the outside. Therefore, by repeating small movements of the capacitor l mounted on the mounting jig 8, the part where the laser irradiation is concentrated moves, and the desired characters, symbols, numbers, etc. Indications 4 such as polarity, rating, etc. are formed, and a capacitor 1 as shown in FIG. 1 is obtained.
この実施例の場合、従来のように、所望の表示毎に絶縁
スリーブおよび絶縁板１３を用意する必要はなく、外径
寸法に適合した共通の絶縁スリーブ等を用意し、コンデ
ンサ１に被覆した後に所望の表示をすることができる。In the case of this embodiment, there is no need to prepare an insulating sleeve and an insulating plate 13 for each desired display as in the conventional case. A desired display can be made.
そのため、作業効率が向上するほか、余分な絶縁スリー
ブ等を排除することができ、コスト面での改良も望める
。Therefore, in addition to improving work efficiency, unnecessary insulating sleeves and the like can be eliminated, and cost improvements can also be expected.
次いで、第３図に示したこの発明の第２の実施例につい
て説明する。この実施例でも、電子部品としてコンデン
サを例に採用した。Next, a second embodiment of the invention shown in FIG. 3 will be described. In this embodiment as well, a capacitor is used as an example of an electronic component.
図示しないコンデンサ素子は、第１の実施例と同様に電
極箔と電解紙とを巻回して形成する。このコンデンサ素
子を耐熱性の合成樹脂、例えばエポキシ樹脂等からなる
外装部材９に収納して密封し、コンデンサのリードＮｌ
Ａ１ ｉを外装枠の側面から底面にかけて折り曲げてい
る。A capacitor element (not shown) is formed by winding electrode foil and electrolytic paper in the same manner as in the first embodiment. This capacitor element is housed in an exterior member 9 made of heat-resistant synthetic resin, such as epoxy resin, and sealed.
A1 i is bent from the side of the exterior frame to the bottom.
この外装部材９の上表面には、予めもしくはコンデンサ
を収納したのち、白色の塗料を塗布して塗料面１０を形
成する。この塗料の塗布は、外装部材９を所望の数量並
べ、ローラ等で一括して行うこともできる。The upper surface of this exterior member 9 is coated with white paint to form a paint surface 10, either in advance or after the capacitor is housed therein. The coating can also be applied all at once by arranging a desired number of exterior members 9 and using a roller or the like.
次いで、第１の実施例と同様に、レーザーの照射により
外装部材９の塗料面ｌＯの一部を除去する。Next, as in the first embodiment, a portion of the paint surface lO of the exterior member 9 is removed by laser irradiation.
そのため、黒色である外装部材９の表面が外部に露出し
て表示１２を形成し、第３図に示したようなチップ形の
電子部品（コンデンサ）を得る。Therefore, the surface of the black exterior member 9 is exposed to the outside to form a display 12, and a chip-shaped electronic component (capacitor) as shown in FIG. 3 is obtained.
第４図は、第２の実施例によるチップ形のコンデンサと
、従来のチップ形コンデンサを、共に同一プリント基板
に実装して赤外線リフロー処理を施した場合の内部温度
の変化を観察した結果である。Figure 4 shows the results of observing changes in internal temperature when a chip-type capacitor according to the second embodiment and a conventional chip-type capacitor are both mounted on the same printed circuit board and subjected to infrared reflow treatment. .
なお、赤外線リフロー炉内の温度は１５０℃に設定し、
温度測定は各試料に熱電対を埋設して測定した。その結
果、第４図からも明らかなように、この発明の実施例に
よる試料の温度上昇Ａは、従来例による試料の温度上昇
Ｂよりも低いことが理解される。The temperature inside the infrared reflow oven was set at 150°C.
Temperature was measured by embedding a thermocouple in each sample. As a result, as is clear from FIG. 4, it is understood that the temperature rise A of the sample according to the embodiment of the present invention is lower than the temperature rise B of the sample according to the conventional example.
以上のように、この発明は、電子部品の所望の箇所に、
表面の色彩と異なる色彩による塗料面を形成するととも
に、この塗料面にレーザーを照射して所望の表示を形成
することを特徴としているので、この発明による電子部
品をプリント基板に実装して赤外線リフロー処理を施し
た場合、赤外線の輻射熱の吸収が抑制される。そのため
、外装部材の温度上昇が軽減され、温度上昇に伴う外装
部材の割れ等の不都合が生じにくくなる。As described above, the present invention provides
It is characterized by forming a paint surface with a color different from the color of the surface, and irradiating this paint surface with a laser to form a desired display.The electronic component according to the present invention is mounted on a printed circuit board and can be reflowed using infrared rays. When treated, absorption of infrared radiant heat is suppressed. Therefore, the temperature rise of the exterior member is reduced, and problems such as cracking of the exterior member due to the temperature rise are less likely to occur.
また、電子部品内部の温度上昇も抑制されるので、熱的
ストレスによる電気的特性の劣化が少な（なり、信幀性
が向上する。Furthermore, since the temperature rise inside the electronic component is also suppressed, deterioration of electrical characteristics due to thermal stress is reduced (resulting in improved reliability).
また、表示は、予め塗布した塗料をレーザーにより除去
して行うため、微細な表示が可能となり、その印刷品位
が向上するとともに、情報量を増加させることもできる
。また、その表示も必要最小限の面積でよく、熱の吸収
を最小限に抑制することができる。Further, since the display is performed by removing the pre-applied paint with a laser, it is possible to display fine details, improve the printing quality, and increase the amount of information. In addition, the display requires only the minimum necessary area, and heat absorption can be suppressed to the minimum.
第１図は、この発明の実施例により得られた電子部品を
示す斜視図、第２図は、この発明の実施例による表示方
法を説明した説明図である。第３図は、この発明の第２
の実施例による電子部品を示した斜視図、また第４図は
、第２の実施例による電子部品内部の赤外線リフロー処
理における温度上昇を示した図面である。
１・・・コンデンサ、２．１０・・・塗料面、３．１１
・・・リード線、４．１２・・・表示、５・・・レーザ
ー光源、６・・・反射鏡、７・・・集束レンズ、８・・
・治具、９・・・外装部材、１３・・・絶縁板。
ｊｌｌＩ！１FIG. 1 is a perspective view showing an electronic component obtained according to an embodiment of the invention, and FIG. 2 is an explanatory diagram illustrating a display method according to an embodiment of the invention. Figure 3 shows the second embodiment of this invention.
FIG. 4 is a perspective view showing an electronic component according to the second embodiment, and FIG. 4 is a drawing showing a temperature rise during infrared reflow processing inside the electronic component according to the second embodiment. 1... Capacitor, 2.10... Paint surface, 3.11
...Lead wire, 4.12...Display, 5...Laser light source, 6...Reflector, 7...Focusing lens, 8...
- Jig, 9... Exterior member, 13... Insulating plate. jllI! 1
Claims (1)
彩による塗料面を形成するとともに、この塗料面にレー
ザーを照射して所望の表示を形成することを特徴とする
電子部品の表示方法。(1) A method for displaying electronic components, which comprises forming a paint surface in a color different from that of the surface at a desired location of the electronic component, and irradiating this paint surface with a laser to form a desired display. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161433A JPH0210713A (en) | 1988-06-29 | 1988-06-29 | Indication of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161433A JPH0210713A (en) | 1988-06-29 | 1988-06-29 | Indication of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210713A true JPH0210713A (en) | 1990-01-16 |
Family
ID=15735018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161433A Pending JPH0210713A (en) | 1988-06-29 | 1988-06-29 | Indication of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210713A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548428U (en) * | 1991-11-28 | 1993-06-25 | 株式会社大真空 | Crystal oscillator |
| JP2021171550A (en) * | 2020-04-30 | 2021-11-01 | 京楽産業．株式会社 | Game machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5713702A (en) * | 1980-06-27 | 1982-01-23 | Mitsubishi Electric Corp | Method of indicating electronic part |
-
1988
- 1988-06-29 JP JP63161433A patent/JPH0210713A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5713702A (en) * | 1980-06-27 | 1982-01-23 | Mitsubishi Electric Corp | Method of indicating electronic part |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548428U (en) * | 1991-11-28 | 1993-06-25 | 株式会社大真空 | Crystal oscillator |
| JP2021171550A (en) * | 2020-04-30 | 2021-11-01 | 京楽産業．株式会社 | Game machine |
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