JPH02104643U - - Google Patents
Info
- Publication number
- JPH02104643U JPH02104643U JP1399589U JP1399589U JPH02104643U JP H02104643 U JPH02104643 U JP H02104643U JP 1399589 U JP1399589 U JP 1399589U JP 1399589 U JP1399589 U JP 1399589U JP H02104643 U JPH02104643 U JP H02104643U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- center
- semiconductor device
- external terminals
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
図面は本考案の実施例を示し、第１図は第１実
施例の縦断正面図、第２図は第１図の―視断
面図、第３図は第２図の別の例を示す図、第４図
、第５図及び第６図は他の実施例の縦断正面図で
ある。
１……絶縁管、２……半導体チツプ、２ａ……
半導体チツプのコレクタ電極、２ｂ……半導体チ
ツプのベース電極、２ｃ……半導体チツプのエミ
ツタ電極、３……一方の外部端子、４……他方の
外部端子、５，８，１１，１３……筒状外部端子
片、６，９，１２，１４……絶縁材、７，１０，
１５……棒状外部端子片。
The drawings show an embodiment of the present invention; FIG. 1 is a longitudinal sectional front view of the first embodiment, FIG. 2 is a cross-sectional view of FIG. 1, and FIG. 3 is a diagram showing another example of FIG. 2. , FIG. 4, FIG. 5, and FIG. 6 are longitudinal sectional front views of other embodiments. 1... Insulating tube, 2... Semiconductor chip, 2a...
Collector electrode of semiconductor chip, 2b...base electrode of semiconductor chip, 2c...emitter electrode of semiconductor chip, 3...one external terminal, 4...other external terminal, 5, 8, 11, 13... tube shaped external terminal piece, 6, 9, 12, 14...insulating material, 7, 10,
15... Rod-shaped external terminal piece.
Claims (1)
管の両端から各々挿入した外部端子によつて挾み
付けるようにして成る半導体装置において、前記
半導体チツプにおける少なくとも一方の表面に、
少なくとも二つの電極を、半導体チツプにおける
略中心の部位と中心から外側に適宜距離を隔てた
部位とに設ける一方、前記両外部端子のうち少な
くとも一方の外部端子を、前記半導体チツプの一
方の表面における各電極のうち外側に位置する電
極に接当する筒状の外部端子片と、該筒状外部端
子片内に絶縁材を挾んで挿入され、且つ、前記半
導体チツプの一方の表面における各電極のうち略
中心に位置する電極に接当する棒状の外部端子片
とに構成したことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor chip inserted into an insulating tube is clamped by external terminals inserted from both ends of the insulating tube, at least one surface of the semiconductor chip is provided with:
At least two electrodes are provided at a location approximately at the center of the semiconductor chip and at a location at an appropriate distance outward from the center, while at least one of the two external terminals is provided at a location approximately at the center of the semiconductor chip, and at least one of the two external terminals is located at one surface of the semiconductor chip. a cylindrical external terminal piece that comes into contact with the outer electrode of each electrode; 1. A semiconductor device comprising: a rod-shaped external terminal piece that comes into contact with an electrode located approximately at the center of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1399589U JPH02104643U (en) | 1989-02-08 | 1989-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1399589U JPH02104643U (en) | 1989-02-08 | 1989-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104643U true JPH02104643U (en) | 1990-08-20 |
Family
ID=31224794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1399589U Pending JPH02104643U (en) | 1989-02-08 | 1989-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104643U (en) |
-
1989
- 1989-02-08 JP JP1399589U patent/JPH02104643U/ja active Pending