JPH02104637U - - Google Patents
Info
- Publication number
- JPH02104637U JPH02104637U JP1211889U JP1211889U JPH02104637U JP H02104637 U JPH02104637 U JP H02104637U JP 1211889 U JP1211889 U JP 1211889U JP 1211889 U JP1211889 U JP 1211889U JP H02104637 U JPH02104637 U JP H02104637U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film carrier
- insulating film
- adhesive layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Wire Bonding (AREA)
Description
第１図……本考案によるフイルムキヤリアの一
部を示す平面図、第２図……本考案によるフイル
ムキヤリアの一部を示す概略断面図、第３図……
従来のフイルムキヤリアの一部を示す平面図、第
４図……従来の三層式フイルムキヤリアの一部を
示す概略断面図、第５図……従来の二層式フイル
ムキヤリアの一部を示す概略断面図。
１……フイルムキヤリア、２……絶縁フイルム
、３……導体層、４……抵抗層、５……デバイス
ホール、６……スプロケツトホール、７……イン
ナーリード、８……アウターリード、９……接着
層。
Fig. 1... A plan view showing a part of the film carrier according to the present invention, Fig. 2... A schematic sectional view showing a part of the film carrier according to the invention, Fig. 3...
FIG. 4 is a plan view showing a portion of a conventional film carrier; FIG. 4 is a schematic sectional view showing a portion of a conventional three-layer film carrier; FIG. 5 is a plan view showing a portion of a conventional two-layer film carrier. Schematic sectional view. DESCRIPTION OF SYMBOLS 1... Film carrier, 2... Insulating film, 3... Conductor layer, 4... Resistance layer, 5... Device hole, 6... Sprocket hole, 7... Inner lead, 8... Outer lead, 9 ...Adhesive layer.
Claims (1)
９が形成された絶縁フイルム２とが、抵抗層４と
接着層９を対面させてラミネートされた事を特徴
とするフイルムキヤリア。 (2) 該絶縁フイルム２がフツ素系樹脂よりなり
請求項１記載のフイルムキヤリア。[Claims for Utility Model Registration] (1) A conductor layer 3 on which a resistance layer 4 is formed and an insulating film 2 on which an adhesive layer 9 is formed are laminated with the resistance layer 4 and the adhesive layer 9 facing each other. A film carrier that is characterized by (2) The film carrier according to claim 1, wherein the insulating film 2 is made of fluororesin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1211889U JPH02104637U (en) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1211889U JPH02104637U (en) | 1989-02-03 | 1989-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104637U true JPH02104637U (en) | 1990-08-20 |
Family
ID=31221279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1211889U Pending JPH02104637U (en) | 1989-02-03 | 1989-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104637U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041434A (en) * | 1996-07-25 | 1998-02-13 | Nec Corp | Semiconductor device and manufacture thereof |
-
1989
- 1989-02-03 JP JP1211889U patent/JPH02104637U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041434A (en) * | 1996-07-25 | 1998-02-13 | Nec Corp | Semiconductor device and manufacture thereof |