JPH02102764U - - Google Patents
Info
- Publication number
- JPH02102764U JPH02102764U JP1021289U JP1021289U JPH02102764U JP H02102764 U JPH02102764 U JP H02102764U JP 1021289 U JP1021289 U JP 1021289U JP 1021289 U JP1021289 U JP 1021289U JP H02102764 U JPH02102764 U JP H02102764U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- packaged device
- mounting
- pin
- annular groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は弾性リングの一部破断斜視図、第３図乃至第８
図は夫々異なる弾性リングの変形例を示す図であ
り、第３図は一部破断斜視図、第４図ａ乃至ｄは
リング一部の断面図、第５図乃至第７図は斜視図
、第８図ａ及びｂは第７図の弾性リングに相当す
る断面図、第９図及び第１０図は夫々異なる従来
構造の縦断面図である。
１……パツケージ化デバイス、１ａ……金属ベ
ース、２……ピン、３……金属板、４……回路基
板、５……ねじ、６……固定ブロツク、７，８…
…環状溝、９，９Ａ〜９Ｄ……弾性リング、９ａ
，９ｂ……スリツト。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, FIG. 2 is a partially cutaway perspective view of an elastic ring, and FIGS.
The figures show different modifications of the elastic ring, in which FIG. 3 is a partially cutaway perspective view, FIGS. 4 a to d are sectional views of a portion of the ring, and FIGS. 5 to 7 are perspective views. FIGS. 8a and 8b are sectional views corresponding to the elastic ring shown in FIG. 7, and FIGS. 9 and 10 are longitudinal sectional views of different conventional structures. DESCRIPTION OF SYMBOLS 1...Packaged device, 1a...Metal base, 2...Pin, 3...Metal plate, 4...Circuit board, 5...Screw, 6...Fixing block, 7, 8...
...Annular groove, 9,9A-9D...Elastic ring, 9a
, 9b...slit.
Claims (1)
透孔を開設し、パツケージ化デバイスのピンを該
透孔に挿通させると共に、該パツケージ化デバイ
スを前記金属板の表面に接触状態で固定する実装
構造において、前記金属板のピン周囲に凹状の環
状溝を形成し、この環状溝内には少なくとも前記
パツケージ化デバイスと金属板に弾性力を持つて
接触する弾性リングを嵌入したことを特徴とする
デバイス実装構造。 Mounting in which a through hole is opened in a mounting board made of a metal plate on which a circuit board is arranged, a pin of a packaged device is inserted through the through hole, and the packaged device is fixed in contact with the surface of the metal plate. The structure is characterized in that a concave annular groove is formed around the pin of the metal plate, and an elastic ring that contacts at least the packaged device and the metal plate with elastic force is fitted into the annular groove. Device mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1021289U JPH02102764U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1021289U JPH02102764U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102764U true JPH02102764U (en) | 1990-08-15 |
Family
ID=31217667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1021289U Pending JPH02102764U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102764U (en) |
-
1989
- 1989-01-31 JP JP1021289U patent/JPH02102764U/ja active Pending