JPH02102741U - - Google Patents
Info
- Publication number
- JPH02102741U JPH02102741U JP1989012007U JP1200789U JPH02102741U JP H02102741 U JPH02102741 U JP H02102741U JP 1989012007 U JP1989012007 U JP 1989012007U JP 1200789 U JP1200789 U JP 1200789U JP H02102741 U JPH02102741 U JP H02102741U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- mounting
- semiconductor element
- semiconductor
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012007U JP2546304Y2 (ja) | 1989-02-02 | 1989-02-02 | 半導体素子の固定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012007U JP2546304Y2 (ja) | 1989-02-02 | 1989-02-02 | 半導体素子の固定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02102741U true JPH02102741U (en:Method) | 1990-08-15 |
| JP2546304Y2 JP2546304Y2 (ja) | 1997-08-27 |
Family
ID=31221063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989012007U Expired - Lifetime JP2546304Y2 (ja) | 1989-02-02 | 1989-02-02 | 半導体素子の固定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2546304Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567891A (ja) * | 1991-09-09 | 1993-03-19 | Matsushita Electric Ind Co Ltd | 電子部品の取付装置 |
| JPH07235783A (ja) * | 1994-02-22 | 1995-09-05 | Ebara Densan:Kk | パワーモジュールの固定方法 |
-
1989
- 1989-02-02 JP JP1989012007U patent/JP2546304Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567891A (ja) * | 1991-09-09 | 1993-03-19 | Matsushita Electric Ind Co Ltd | 電子部品の取付装置 |
| JPH07235783A (ja) * | 1994-02-22 | 1995-09-05 | Ebara Densan:Kk | パワーモジュールの固定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2546304Y2 (ja) | 1997-08-27 |