JPH02102741U - - Google Patents

Info

Publication number
JPH02102741U
JPH02102741U JP1200789U JP1200789U JPH02102741U JP H02102741 U JPH02102741 U JP H02102741U JP 1200789 U JP1200789 U JP 1200789U JP 1200789 U JP1200789 U JP 1200789U JP H02102741 U JPH02102741 U JP H02102741U
Authority
JP
Japan
Prior art keywords
hole
mounting
semiconductor element
semiconductor
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1200789U
Other languages
English (en)
Japanese (ja)
Other versions
JP2546304Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1200789U priority Critical patent/JP2546304Y2/ja
Publication of JPH02102741U publication Critical patent/JPH02102741U/ja
Application granted granted Critical
Publication of JP2546304Y2 publication Critical patent/JP2546304Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1200789U 1989-02-02 1989-02-02 半導体素子の固定装置 Expired - Lifetime JP2546304Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1200789U JP2546304Y2 (ja) 1989-02-02 1989-02-02 半導体素子の固定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1200789U JP2546304Y2 (ja) 1989-02-02 1989-02-02 半導体素子の固定装置

Publications (2)

Publication Number Publication Date
JPH02102741U true JPH02102741U (US20100223739A1-20100909-C00005.png) 1990-08-15
JP2546304Y2 JP2546304Y2 (ja) 1997-08-27

Family

ID=31221063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1200789U Expired - Lifetime JP2546304Y2 (ja) 1989-02-02 1989-02-02 半導体素子の固定装置

Country Status (1)

Country Link
JP (1) JP2546304Y2 (US20100223739A1-20100909-C00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567891A (ja) * 1991-09-09 1993-03-19 Matsushita Electric Ind Co Ltd 電子部品の取付装置
JPH07235783A (ja) * 1994-02-22 1995-09-05 Ebara Densan:Kk パワーモジュールの固定方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567891A (ja) * 1991-09-09 1993-03-19 Matsushita Electric Ind Co Ltd 電子部品の取付装置
JPH07235783A (ja) * 1994-02-22 1995-09-05 Ebara Densan:Kk パワーモジュールの固定方法

Also Published As

Publication number Publication date
JP2546304Y2 (ja) 1997-08-27

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