JPH02101538U - - Google Patents
Info
- Publication number
- JPH02101538U JPH02101538U JP1989009812U JP981289U JPH02101538U JP H02101538 U JPH02101538 U JP H02101538U JP 1989009812 U JP1989009812 U JP 1989009812U JP 981289 U JP981289 U JP 981289U JP H02101538 U JPH02101538 U JP H02101538U
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead
- connection part
- horizontal
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989009812U JPH02101538U (pt-PT) | 1989-01-30 | 1989-01-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989009812U JPH02101538U (pt-PT) | 1989-01-30 | 1989-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02101538U true JPH02101538U (pt-PT) | 1990-08-13 |
Family
ID=31216886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989009812U Pending JPH02101538U (pt-PT) | 1989-01-30 | 1989-01-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02101538U (pt-PT) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62165941A (ja) * | 1986-01-18 | 1987-07-22 | Nec Corp | テ−プキヤリア方式ic |
JPS62171132A (ja) * | 1986-01-23 | 1987-07-28 | Oki Electric Ind Co Ltd | 半導体チップの実装方法 |
JPS63211730A (ja) * | 1987-02-27 | 1988-09-02 | Nec Corp | 電子部品の実装構造 |
-
1989
- 1989-01-30 JP JP1989009812U patent/JPH02101538U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62165941A (ja) * | 1986-01-18 | 1987-07-22 | Nec Corp | テ−プキヤリア方式ic |
JPS62171132A (ja) * | 1986-01-23 | 1987-07-28 | Oki Electric Ind Co Ltd | 半導体チップの実装方法 |
JPS63211730A (ja) * | 1987-02-27 | 1988-09-02 | Nec Corp | 電子部品の実装構造 |